Abstract:
PROBLEM TO BE SOLVED: To provide a mode-locked semiconductor laser element having a configuration capable of reducing the influence of piezo polarization and intrinsic polarization.SOLUTION: The mode-locked semiconductor laser element includes: a stacked structure including a sequential stack of a first compound semiconductor layer 30 composed of a GaN-based compound semiconductor, a third compound semiconductor layer 40 having a light-emitting region 41, and a second compound semiconductor layer 50; a second electrode 62; and a first electrode 61. The stacked structure is formed on a semi-polar or non-polar compound semiconductor substrate 21. The third compound semiconductor layer has a quantum well structure having a well layer and a barrier layer, and has an inclined waveguide. The flow of a current from the second electrode to the first electrode via the stacked structure generates an optical pulse in the light-emitting region.
Abstract:
PROBLEM TO BE SOLVED: To provide a driving method of a self-oscillation type semiconductor laser element for making a generated optical pulse shorter and peak output higher without causing a trouble such as heat generation and deterioration. SOLUTION: The self-oscillation type semiconductor laser element is equipped with: a laminated structure obtained by sequentially laminating a first compound semiconductor layer formed of a GaN-based compound semiconductor, a third compound semiconductor layer constituting a light emitting region and a saturable absorption region and a second compound semiconductor; a second electrode formed on the second compound semiconductor layer; and a first electrode which is electrically connected to the first compound semiconductor layer. The second electrode is isolated into: a first part for making a forward bias state by making current flow to the first electrode via the light emitting region; and a second part for applying an electric field to the saturable absorption region by an isolation groove. In the driving method of the self-oscillation type semiconductor laser element, current having a current value in which kink occurs or above in optical output-current characteristic, is made to flow to the first part of the second electrode. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor element capable of increasing the composition ratio of indium contained in an indium-containing layer such as a GaInN mixed crystal layer or the like while being capable of improving a crystal quality and capable of enhancing characteristics. SOLUTION: A low-temperature buffer layer 11, a first intermediate layer 21, a polarity inversion layer 20, a second intermediate layer 22, an n-side contact layer 31, an n-type clad layer 32, a first guide layer 33, an active layer 34, a second guide layer 35, a p-type clad layer 36, and a p-side contact layer 37, are laminated successively on one surface side of a substrate 10. The polarity inversion layer 20 is composed of GaN, and contains magnesium (Mg) as impurities and a polarity is inverted from a Ga polarity to an N polarity. A section from the second intermediate layer 22 to an upper section (the p-type contact layer 37) is brought to the N polarity, and the active layer 34 has the indium composition ratio, and the crystal quality higher than the active layer 34 is formed on the layer having the Ga polarity. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming an ohmic electrode whose contact specific resistance is small and thermostability is high, capable of stably operating a device over a long period. SOLUTION: A contact layer 2, comprising a p-type compound semiconductor containing at least one kind of element out of a group comprising gallium, aluminum, boron and indium as the group-III elements and nitrogen, is formed on a p-type compound semiconductor 1. A transition element layer 3a, containing at least one kind of element from among the transition elements other than gold and platinum, is formed on the contact layer 2; a platinum layer 3b comprising platinum is formed on the layer 3a; and after a gold layer 3c comprising gold is further formed on the platinum layer 3b, the layers are annealed as a whole. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve crystallinity and electric conductivity, and also to homogenize the composition ratio and p-type impurity concentration in a growth surface of a crystal. SOLUTION: Alternate stacking of a plurality of first and second layers 11 and 12, respectively, with each first layer 11 and each second layer 12 stacking one over another and subsequent heat-treatment yield third layers between the first layers 11 and second layers 12, wherein the first layers 11 are AlGaN mixed crystal approximately 1 to 100nm thick and second layers 12 are Mg-doped p-type GaN approximately 1 to 100 nm thick. The third layers contain aluminum in a lower concentration than the first layers and contain p-type impurity in a lower concentration than the second layers. It is feasible to form the third layers by forming the first and second layers that have different contents of aluminum and different concentrations of the p-type impurity from each other, through separate processes, and subsequently heat-treatment, whereby it is enabled to manufacture with facility a good-quality p-type group III nitride compound semiconductor having properties of p-type AlGaN mixed crystal as a whole. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To manufacture a compound semiconductor substrate by forming a compound semiconductor layer of proper quality having a small number of crystal defects on a single-crystal substrate and peeling the single-crystal substrate, without damaging the compound semiconductor layer. SOLUTION: On the single-crystal substrate (sapphire substrate) 11, 1st, 2nd, and 3rd compound semiconductor layers 12, 13, and 17 formed by carrying out crystal growth, while a space 18 is partially formed with the sapphire substrate 11. The 1st, 2nd, and 3rd compound semiconductor layers 12, 13, and 17 are peeled off of the sapphire substrate 11, through fusing of the interface between the sapphire substrate 11 and 1st compound semiconductor layer 12, by irradiating the 1st compound semiconductor layer 12 with a laser beam L, which is transmitted through the sapphire substrate 11 and is absorbed by the 1st compound semiconductor layer 12 from the side of the sapphire substrate 11.
Abstract:
PROBLEM TO BE SOLVED: To improve crystalline property and electrical conductivity and to uniformize a composition ratio in the growing surface of crystal and p-type impurity concentration. SOLUTION: Plural 1st layers 11, each of which consists of AlGaN mixed crystal and has about 1 to 100 nm thickness and plural 2nd layers 12 each of which is Mg-added p-type GaN and has about 1 to 100 nm thickness, are laminated alternately. Since respective layers 11, 12 are thin, the laminated layers as a whole have properties of a p-type AlGaN mixed crystal, even when Mg is not included in the 1st layers 11 and Al is not included in the 2nd layers 12. Since an Al material and a Mg material are supplied so as to be timewisely separated, reaction between the Al material and the Mg material which interfere with the growth of fine crystal can be prevented. Thereby fine crystals can be allowed to grow.
Abstract:
PURPOSE:To improve activation ratio of impurity atom doped to a compound semiconductor crystal. CONSTITUTION:A ZnSe crystal 1 is doped with 0 atom, for example, at high concentration as p-type impurities to make at least a part thereof exist in an interstitial position. Then, atomic vacancy is formed in at least an Se atom position by irradiating electronic beam 2 to the ZnSe crystal 1. Thereafter, at least a part of 0 atom existing in the interstitial position is put in the atomic vacancy for activation.
Abstract:
PURPOSE:To enable formation of a thin film having a super-lattice-structure by transporting starting materials in the form of mist onto a substrate and depositing a thin film of metal compds. to the substrate by decomposing thermally the starting materials so as to enhance controllability of film compsn., laminating thus thin films of metal compds. of several compsns. by executing further a series of operation. CONSTITUTION:Several kinds of mist contg. each atomized metal salt(atomizing device 2) is transported individually from plural reservoirs (e.g. S1, S2...) of solns. of starting metal salts onto a substrate 1 successively or simultaneously(using carrier gas such as gaseous O2). Thus, compds. contg. the metal are deposited on the substrate 1. The thin films heaped by this method form a thin film of the metal compds. by being heat-treated in desired atmosphere.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor optical amplifier comprising a GaN-based compound semiconductor and capable of achieving still higher optical output.SOLUTION: A semiconductor optical amplifier 200 is provided with: (a) a layered structure created by sequentially stacking a first compound semiconductor layer comprising a GaN-based compound semiconductor, a third compound semiconductor layer, and a second compound semiconductor layer; (b) a second electrode 262 formed on the second compound semiconductor layer; (c) a first electrode electrically connected to the first compound semiconductor layer. The layered structure has a ridge stripe structure in which, when Wrepresents the width of the ridge stripe structure in a light emission end face 203 and Wrepresents the width of the ridge stripe structure in a light incident end face 201, W>Wis satisfied. In a region inward of the layered structure from the light emission end face 201 along an axial line AXof the semiconductor optical amplifier is provided with a carrier non-injection region 205. The second electrode 262 is configured from a first portion 262A and a second portion 262B separated by a separation groove 262C. The carrier non-injection region 205 is provided with the second portion 262B of the second electrode.