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公开(公告)号:DE69711344D1
公开(公告)日:2002-05-02
申请号:DE69711344
申请日:1997-12-05
Applicant: SONY CORP
Inventor: YANASHIMA KATSUNORI , IKEDA MASAO , TOMIOKA SATOSHI
IPC: H01L21/205 , C30B25/02 , H01L21/20 , H01L21/203 , H01L33/12 , H01L33/32 , H01S5/00 , H01S5/323 , C30B29/40
Abstract: A method for growing nitride III-V compound semiconductor layers, comprises the steps of: growing a first BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on a substrate by first vapor deposition at a growth rate not higher than 4 mu m/h; and growing a second BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on the first BwAlxGayInzN layer by second vapor deposition at a growth rate higher than 4 mu m/h and not higher than 200 mu m/h. A method for fabricating a nitride III-V compound semiconductor substrate, comprises the steps of: growing a first BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on a substrate by first vapor deposition at a growth rate not higher than 4 mu m/h; growing a second BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤y≤1 and w+x+y+z=1) on the first BwAlxGayInzN layer by second vapor deposition at a growth rate higher than 4 mu m/h and not higher than 200 mu m/h; and removing the substrate.
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公开(公告)号:DE60013039T2
公开(公告)日:2005-09-08
申请号:DE60013039
申请日:2000-06-05
Applicant: SONY CORP
Inventor: HASHIMOTO SHIGEKI , YANASHIMA KATSUNORI , IKEDA MASAO , NAKAJIMA HIROSHI
Abstract: A semiconductor light emitting device using nitride III-V compound semiconductors is improved to reduce the threshold current density with almost no increase of the operation voltage. In a GaN semiconductor laser as one version thereof, the p-type cladding layer (10) is made of two or more semiconductor layers (10a, 10b) different in band gap, and a part (10a) of the p-type cladding layer (10) near one of its boundaries nearer to the active layer is made of a semiconductor layer having a larger band gap than that of the remainder part (10b). More specifically, in a AlGaN/GaN/GaInN SCH-structured GaN semiconductor laser, a p-type AlGaN cladding layer (10) is made of a p-type Alx1Ga1-x1N layer (10a) in contact with a p- type GaN optical guide layer (9), and a p-type Alx2Ga1-x2N layer (10b) overlying the p-type Alx1Ga1-x1N layer (10a) (where 0≤x2
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公开(公告)号:DE112019003802T5
公开(公告)日:2021-04-08
申请号:DE112019003802
申请日:2019-07-01
Applicant: SONY CORP
Inventor: TASAI KUNIHIKO , NAKAJIMA HIROSHI , KAWANISHI HIDEKAZU , YANASHIMA KATSUNORI
IPC: H01S5/343 , F21K9/00 , H01L21/205 , H01L33/12 , H01L33/32
Abstract: Eine Lichtemissionsvorrichtung gemäß einer Ausführungsform der vorliegenden Offenbarung ist mit Folgendem versehen: einer ersten Schicht, die Alx2Inx1Ga(1-x1-x2)N (0
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公开(公告)号:DE112019004126T5
公开(公告)日:2021-05-06
申请号:DE112019004126
申请日:2019-08-02
Applicant: SONY CORP
Inventor: TASAI KUNIHIKO , KAWANISHI HIDEKAZU , YANASHIMA KATSUNORI
Abstract: Eine lichtemittierende Vorrichtung gemäß einer Ausführungsform der vorliegenden Offenbarung ist mit Folgenden bereitgestellt: einem Substrat; einer ersten Quantentopfschicht, die aus Alx2Inx1Ga(1-x1-x2)N ausgebildet ist (wobei 0
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公开(公告)号:DE69803721T3
公开(公告)日:2011-06-09
申请号:DE69803721
申请日:1998-05-22
Applicant: SONY CORP
Inventor: ASATSUMA TSUNENORI , YANASHIMA KATSUNORI , MIYAJIMA TAKAO
IPC: H01L33/00 , H01L21/203 , H01L21/205 , H01L29/205 , H01L29/207 , H01L33/32 , H01S5/00 , H01S5/323
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公开(公告)号:DE60013039D1
公开(公告)日:2004-09-23
申请号:DE60013039
申请日:2000-06-05
Applicant: SONY CORP
Inventor: HASHIMOTO SHIGEKI , YANASHIMA KATSUNORI , IKEDA MASAO , NAKAJIMA HIROSHI
Abstract: A semiconductor light emitting device using nitride III-V compound semiconductors is improved to reduce the threshold current density with almost no increase of the operation voltage. In a GaN semiconductor laser as one version thereof, the p-type cladding layer (10) is made of two or more semiconductor layers (10a, 10b) different in band gap, and a part (10a) of the p-type cladding layer (10) near one of its boundaries nearer to the active layer is made of a semiconductor layer having a larger band gap than that of the remainder part (10b). More specifically, in a AlGaN/GaN/GaInN SCH-structured GaN semiconductor laser, a p-type AlGaN cladding layer (10) is made of a p-type Alx1Ga1-x1N layer (10a) in contact with a p- type GaN optical guide layer (9), and a p-type Alx2Ga1-x2N layer (10b) overlying the p-type Alx1Ga1-x1N layer (10a) (where 0≤x2
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公开(公告)号:DE69711344T2
公开(公告)日:2002-11-14
申请号:DE69711344
申请日:1997-12-05
Applicant: SONY CORP
Inventor: YANASHIMA KATSUNORI , IKEDA MASAO , TOMIOKA SATOSHI
IPC: H01L21/205 , C30B25/02 , H01L21/20 , H01L21/203 , H01L33/12 , H01L33/32 , H01S5/00 , H01S5/323 , C30B29/40
Abstract: A method for growing nitride III-V compound semiconductor layers, comprises the steps of: growing a first BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on a substrate by first vapor deposition at a growth rate not higher than 4 mu m/h; and growing a second BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on the first BwAlxGayInzN layer by second vapor deposition at a growth rate higher than 4 mu m/h and not higher than 200 mu m/h. A method for fabricating a nitride III-V compound semiconductor substrate, comprises the steps of: growing a first BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤z≤1 and w+x+y+z=1) on a substrate by first vapor deposition at a growth rate not higher than 4 mu m/h; growing a second BwAlxGayInzN layer (where 0≤w≤1, 0≤x≤1, 0≤y≤1, 0≤y≤1 and w+x+y+z=1) on the first BwAlxGayInzN layer by second vapor deposition at a growth rate higher than 4 mu m/h and not higher than 200 mu m/h; and removing the substrate.
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公开(公告)号:DE69803721T2
公开(公告)日:2002-09-12
申请号:DE69803721
申请日:1998-05-22
Applicant: SONY CORP
Inventor: ASATSUMA TSUNENORI , YANASHIMA KATSUNORI , MIYAJIMA TAKAO
IPC: H01L21/203 , H01L21/205 , H01L29/205 , H01L29/207 , H01L33/32 , H01S5/00 , H01S5/323 , H01L33/00
Abstract: A plurality of first layers made of AlGaN mixed crystal each having a thickness of the order of 1 to 100 nm and a plurality of second layers of p-type GaN with Mg each having a thickness of the order of 1 to 100 nm are alternately stacked. Since each of the first and second layers is thin, the stacked layers as a whole have properties of p-type AlGaN mixed crystal although the first layers do not include Mg and the second layers do not include Al. An Al source and a Mg source are temporally separated to be introduced in a stacking process. A reaction between the Al source and Mg source which may interfere desirable crystal growth is thereby prevented. Crystals of good quality are thus grown and electrical conductivity is thereby improved.
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公开(公告)号:DE69803721D1
公开(公告)日:2002-03-21
申请号:DE69803721
申请日:1998-05-22
Applicant: SONY CORP
Inventor: ASATSUMA TSUNENORI , YANASHIMA KATSUNORI , MIYAJIMA TAKAO
IPC: H01L21/203 , H01L21/205 , H01L29/205 , H01L29/207 , H01L33/32 , H01S5/00 , H01S5/323 , H01L33/00
Abstract: A plurality of first layers made of AlGaN mixed crystal each having a thickness of the order of 1 to 100 nm and a plurality of second layers of p-type GaN with Mg each having a thickness of the order of 1 to 100 nm are alternately stacked. Since each of the first and second layers is thin, the stacked layers as a whole have properties of p-type AlGaN mixed crystal although the first layers do not include Mg and the second layers do not include Al. An Al source and a Mg source are temporally separated to be introduced in a stacking process. A reaction between the Al source and Mg source which may interfere desirable crystal growth is thereby prevented. Crystals of good quality are thus grown and electrical conductivity is thereby improved.
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公开(公告)号:EP2701251A4
公开(公告)日:2015-01-28
申请号:EP12773524
申请日:2012-02-07
Applicant: SUMITOMO ELECTRIC INDUSTRIES , SONY CORP
Inventor: KYONO TAKASHI , ENYA YOHEI , SUMITOMO TAKAMICHI , YOSHIZUMI YUSUKE , UENO MASAKI , YANASHIMA KATSUNORI , TASAI KUNIHIKO , NAKAJIMA HIROSHI
IPC: H01S5/343 , H01L21/205
CPC classification number: H01S5/3201 , B82Y20/00 , H01S5/028 , H01S5/2009 , H01S5/2031 , H01S5/3063 , H01S5/3202 , H01S5/3211 , H01S5/34333 , H01S2304/04
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