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公开(公告)号：JP2008103620A
公开(公告)日：2008-05-01
申请号：JP2006286395
申请日：2006-10-20
Inventor： TANAKA TORU
IPC: H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L24/97 , H01L2224/16145 , H01L2224/26175 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can separate and dislodge a support substrate from a semiconductor wafer without giving damage to a bump for electrical connection.
SOLUTION: A second bump 22 for substrate bonding is formed on a semiconductor wafer W adjacent to a first bump 21 for electrical connection, this second bump 22 is crimp-bonded to a support bump (bump support portion) 32 on the support substrate for temporarily fixing the semiconductor wafer W and the support substrate 30. After segmenting the semiconductor wafer W per chip area to be turned into the individual piece of a semiconductor chip C1, this semiconductor chip C1 is vacuum-held so that the second bump 22 is torn off from the support bump 32. Thereby, it becomes possible to attain separation from the support substrate 30 without giving damage to the first bump 22. Thereby, the deterioration of the reliability of the electrical connection structure of the semiconductor device can be prevented.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种用于制造半导体器件的方法，该半导体器件能够从半导体晶片分离和移出支撑衬底而不损坏用于电连接的凸块。 解决方案：用于基板接合的第二凸起22形成在与用于电连接的第一凸起21相邻的半导体晶片W上，该第二凸起22被压接在支撑件上的支撑凸块（凸起支撑部）32上 用于临时固定半导体晶片W和支撑基板30.将半导体晶片W每切片面积分割成半导体芯片C1的单个片段之后，将该半导体芯片C1真空保持，使得第二凸块22 从支撑凸块32脱落。由此，可以在不损害第一凸块22的情况下从支撑基板30获得分离。由此，可以防止半导体器件的电连接结构的可靠性的劣化 。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2006040448A
公开(公告)日：2006-02-09
申请号：JP2004220757
申请日：2004-07-28
Inventor： OMORI KIYOSHI , MUTO SATOSHI , SUZUKI YUJI , TANAKA TORU , MAEDA HIDEHO , HOSHINO NAOYA
CPC classification number: G11B7/08582 , G11B7/22
Abstract: PROBLEM TO BE SOLVED: To load common optical pickup units on disk drive units different in opposite space between a pair of guide shafts.
SOLUTION: Adapter members 50 and 60 each adjusting the opposite space between a main shaft 29a and a secondary shaft 29b are mounted on an optical pickup 20 mounted on a first disk drive unit 5, and thereby the loading of the optical pickup 20 on a second disk drive unit 5a longer in the opposite space between the main shaft 29a and the secondary shaft 29b than that of the first disk drive unit 5 is made possible. Otherwise, the adapter member 70 for adjusting the opposite space between the main shaft 29a and the secondary shaft 29b is mounted integrally or as a separate body to the secondary shaft 29b of the second disk drive unit 5a, and thereby the loading of the optical pickup 20 loaded in the first disk drive unit 5 on the second disk drive unit 5a is made possible.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：将普通光拾取单元装载在一对引导轴之间相对空间不同的磁盘驱动单元上。 解决方案：每个调整主轴29a和副轴29b之间的相对空间的适配器构件50和60安装在安装在第一盘驱动单元5上的光拾取器20上，从而装载光学拾取器20 在主轴29a和副轴29b之间相对于第一盘驱动单元5的相对空间中较长的第二盘驱动单元5a成为可能。 否则，用于调整主轴29a和副轴29b之间的相对空间的适配器构件70一体地或作为单独的本体安装到第二盘驱动单元5a的次轴29b上，从而将光学拾取器 装在第二磁盘驱动器单元5a上的第一磁盘驱动器单元5中的磁带盘20成为可能。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2001175268A
公开(公告)日：2001-06-29
申请号：JP36161399
申请日：1999-12-20
Applicant: SONY CORP
Inventor： SAWADA TAKESHI , TANAKA TORU , SAKAI TADASHI
Abstract: PROBLEM TO BE SOLVED: To provide a music reproducing device, with which audio data or the like can be easily downloaded into an internal storage means. SOLUTION: A connector part connectable with the prescribed card slot of a data processor, a storage means for audio data, an audio reproducing circuit and an output part for audio data are integrally housed in a card-shaped casing so that the device can be easily connected to the data processor such as personal computer system.
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公开(公告)号：JP2000330292A
公开(公告)日：2000-11-30
申请号：JP14044399
申请日：1999-05-20
Applicant: SONY CORP
Inventor： TANAKA TORU
Abstract: PROBLEM TO BE SOLVED: To obtain a screen for printing which is capable of suppressing the printing defect occurring in the distortion of the screen arising at the time of detaching a surface to be printed and the screen and is capable of printing a printing material of prescribed patterns at a high accuracy by transferring the printing material to the surface to be printed of an object to be printed. SOLUTION: This screen for printing has a planar screen part 2 which includes a mask part 2a formed with apertures of prescribed patterns to be packed with the printing material, a frame 6 which is arranged on the outer side of the screen part 2 isolatedly therefrom and a supporting body 4 which connects the frame 6 and the screen part 2 and supports the screen part 2 movably relative to the frame 6. The screen prints the surface to be printed of the object to be printed in contact with the other surface with the printing material supplied on one direction side of the screen part 2 through the mask part 2a. In such a case, the contour shape of the juncture between the screen part 2 to which the supporting body 4 is connected and the frame 6 is constituted to a circular shape.
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公开(公告)号：JP2000138248A
公开(公告)日：2000-05-16
申请号：JP31096798
申请日：1998-10-30
Applicant: SONY CORP
Inventor： TANAKA TORU
IPC: H01L21/60
Abstract: PROBLEM TO BE SOLVED: To obtain a mask for high precision printing which can simultaneously form a plurality of solder bumps of uniform height, and a screen printing method using the mask. SOLUTION: A mask 10 for high precision printing has a contact surface, which is in surface-contact with a flat surface of a semiconductor wafer W as a board to be printed. A corner part 13 of a through-hole 12, which is formed for surface-contact with the surface of the semiconductor wafer W and for transferring a solder paste P composed of solder particles Pa having uniform and fine diameter to a plurality of electrode pads T by a screen printing method, is formed in an R-shape having a diameter smaller than that of the solder particle Pa, and a gap is formed between the solder particle Pa and the corner parts 13.
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Patent Agency Ranking
公开(公告)号：JPH1079336A
公开(公告)日：1998-03-24
申请号：JP23398596
申请日：1996-09-04
Applicant: SONY CORP
Inventor： TANAKA TORU
IPC: G03F7/16 , B05C11/08 , H01L21/027
Abstract: PROBLEM TO BE SOLVED: To provide a spin coater improved to reduce time required for dripping coating solution onto a wafer by an economical means. SOLUTION: A spin coater 26 includes a spin fastener for holding a wafer 12 on a horizontal holding face and rotating it around a vertical-rotation axis, and a dripping mechanism 30 for dripping coating solution onto the wafer for coating. The dripping mechanism 30 includes two supply tubes 34, 36 respectively including dripping nozzles 38, 40 at a tip, and a pressurizer 48 for receiving the coating solution and pressurizing the coating solution to feed it to the respective supply tubes 34, 36 in parallel. Since dripping has been conventionally done by a single supply tube and a single nozzle, dripping can be done in a shorter time than conventional and high quality spin coating is possible.
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公开(公告)号：JPH03214491A
公开(公告)日：1991-09-19
申请号：JP1029290
申请日：1990-01-19
Applicant: SONY CORP
Inventor： TANAKA TORU , MIIKE MASAMI
IPC: G11B33/14
Abstract: PURPOSE:To measure the cleanliness of air with high accuracy by arranging a hole for measurement at a position in the neighborhood of the outer periphery of a disk, and a circulating filter neighboring to the downstream side in the rotating direction of the disk for the hole for measurement, respectively. CONSTITUTION:The circulating filter 8 is arranged at a recessed part 19 provided at the position in the neighborhood of the outer periphery of a hard disk 4 in the disk housing room 2 of a sealed case 1. The hole 17 for measurement is provided at either the lower wall 20 or the upper wall 21 of the case 1 so as to communicate with the recessed part 19. At this time, the hole 17 and the filter 8 are arranged neighboring to each other in sequence of the hole 17 and the filter 8 in the rotating direction (direction of arrow head (a)) of the disk 4. By employing such constitution, it is possible to directly measure the cleanliness of air current by measuring the cleanliness of the air in the case 1 with a vertical counter 26 in a state where a nozzle 25 for measurement is inserted from the hole 17 to the case 1 and the disk 4 is driven rotatably in the direction of arrow head (a).
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公开(公告)号：JPH0384792A
公开(公告)日：1991-04-10
申请号：JP22109189
申请日：1989-08-28
Applicant: SONY CORP
Inventor： TANAKA TORU , SETO HIDEKAZU
IPC: G11B33/02
Abstract: PURPOSE:To tighten a mount frame with a cushion to a reproduction device and a printed circuit board without the cushion by means of a common screw by fitting part of a mount frame between flanges of bushes and fastening the printed circuit board onto a boss with a screw so as to retain the bush. CONSTITUTION:A printed circuit board 33 is screwed directly to a boss 35 to retain and fit a bush 38 with flange clipping a mount frame 34 between a couple of flanges 37 and fitted to the outer circumference of the boss 35 by means of the printed circuit board 33. Thus, the printed circuit board 33 and the mount frame 34 are tightened a common screw 40 to one face of a recording and reproducing device. Moreover, the mount frame 34 is fitted to the recording and reproducing device with the elasticity of the bush 38 with flange so as to have a cushion and the printed circuit board 33 is fitted to the recording and reproducing device without any cushion.
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29.发明专利
公开(公告)号：JP2009302357A
公开(公告)日：2009-12-24
申请号：JP2008156133
申请日：2008-06-16
Inventor： KOBAYASHI KENJIN , ASAMI HIROSHI , ISHIKAWA NATSUYA , TANAKA TORU
IPC: H01L21/60
CPC classification number: H01L2224/11
Abstract: PROBLEM TO BE SOLVED: To prevent both the etching residue of a plating base film and an excessively etched electrode pad in removing the plating base film used for bump formation by etching.
SOLUTION: The semiconductor device production method includes: a process of forming extended wiring 6 from the inside of a semiconductor element region to the outside in such a manner as to be conducted to multiple electrode pads 3, 4 on a semiconductor substrate 1 on which the multiple electrode pads 3, 4 are formed in the inside of the semiconductor element region; a process of forming, on the semiconductor substrate 1, a plating base film 7 in such a manner as to cover the multiple electrode pads 3, 4; a process of forming a bump 13 on a predetermined electrode pad 4 by a plating method using the plating base film 7; a process of forming a resist film 14 for protecting the extended wiring 6 in the outside of the semiconductor element region; and a process of removing the plating base film 7 by etching while maintaining the multiple electrode pads 3, 4 conducted to each other via the extended wiring 6.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：为了在通过蚀刻去除用于凸块形成的镀覆基底膜时，防止电镀基底膜和过度蚀刻的电极焊盘的蚀刻残留。 解决方案：半导体器件制造方法包括：从半导体元件区域的内部向外部形成延伸布线6的方法，以将其传导到半导体衬底1上的多个电极焊盘3,4 多个电极焊盘3,4形成在半导体元件区域的内部; 在半导体基板1上以覆盖多个电极焊盘3,4的方式形成镀覆基底膜7的工序; 通过使用电镀基底膜7的镀覆方法在预定电极焊盘4上形成凸块13的工序; 形成用于保护半导体元件区域外侧的延长布线6的抗蚀剂膜14的工序; 以及通过蚀刻除去电镀基膜7的过程，同时保持通过延伸布线6彼此导通的多个电极焊盘3,4。（C）2010，JPO＆INPIT
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30.发明专利Optical pickup device, adjustment method of optical pickup device and optical information recording and/or reproducing apparatus 审中-公开光学拾取装置，光学拾取装置的调整方法和光信息记录和/或再现装置
公开(公告)号：JP2005216330A
公开(公告)日：2005-08-11
申请号：JP2002030031
申请日：2002-02-06
Inventor： TANAKA TORU , KUBO TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide an optical pickup device which can adjust a beam spot spacing according to predetermined track pitch after fixing diffraction-grating to a slide base, etc. to raise sensitivity of a tracking error signal.
SOLUTION: The optical pickup device is provided with a base member 22 to which an optical system which makes an information recording face of an optical disk 50 irradiated with an optical beam for recording and/or reproducing of an information signal is attached; and a cover member 23 which can be attached movably to a disk drive unit 80, while to which the base member 22 can be attached rotatably. In the base member 22, a reference hole 51 which is to be made a center of rotation for the cover member 23 and a fixing screw 70 which can attach the base member 22 to the cover member 23 are arranged.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种光拾取装置，其可以在将衍射光栅固定到滑动基座等之后根据预定轨道间距调整光束间距，以提高跟踪误差信号的灵敏度。 解决方案：光拾取装置设置有基座构件22，附接有使用用于记录和/或再现信息信号的光束照射的光盘50的信息记录面的光学系统; 以及可以可移动地附接到盘驱动单元80的盖构件23，同时基座构件22可旋转地附接到该构件。 在基部构件22中，布置有用作盖构件23的旋转中心的基准孔51和能够将基座构件22附接到盖构件23的固定螺钉70。 版权所有（C）2005，JPO＆NCIPI
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