Abstract:
An EEPROM memory cell (1,30) integrated in a semiconductor substrate (2) comprises a floating gate MOS transistor (3,31) having a source region (4,33), a drain region (5,34), and a gate region (6,35) projecting from the substrate (2) and is isolated from the substrate (2) by an oxide layer (7,36') including a thinner tunnel portion (8,36) and heavily doped regions (9,37) formed under said tunnel portion (8,36) and extending to beneath the drain region (5,34), and a selection transistor (10,32) having a source region (38), a drain region (39) and a gate region (40), wherein said source region (4,33) is heavily doped and formed simultaneously with said heavily doped regions (9,37).
Abstract:
An HV transistor (2) integrated in a semiconductor substrate (1) with a first type of conductivity, comprising a gate region (12) included between corresponding drain (16) and source (17) regions, and being of the type wherein at least said drain region (16) is lightly doped with a second type of conductivity. The drain region (16) comprises a contact region (7) with the second type of conductivity but being more heavily doped, from which a contact pad (21) stands proud.
Abstract:
This invention relates to a method of adjusting the erase/program voltage in semiconductor non-volatile memories. The memories are formed of at least one matrix of memory cells having a floating gate, a control gate, and drain and source terminals, and are organised by the byte in rows (WL) and columns (BL), each byte comprising a group of cells having respective control gates connected in parallel with one another to a common control line (CG) through a selection element of the byte switch type, and each cell being connected to a respective control column (BL) through a selection element of the bit switch type. Advantageously, a double adjustment is provided for the program voltage of the memory cells, whereby the program voltage during the erasing phase can be higher in modulo than the program voltage during the writing phase. This is achieved by forming the bit switch element (20) inside a well (13) and the byte switch element (21) directly in the substrate.
Abstract:
A word line selector for selecting word lines ( WL1 - WLm ) of an array ( 101 ) of semiconductor memory cells ( MC ) formed in a doped semiconductor region ( 103 ) of a semiconductor substrate ( 107 ) comprises a plurality of word line drivers ( 3011 , 3012 ) responsive to word line selection signals ( WLSA1 , WLSa2 ). Each word line driver is associated with a respective word line for driving the word line to prescribed word line electric potentials, depending on an operation to be conducted on the array of memory cells, in accordance with the word line selection signal. A plurality of distinct doped semiconductor well structures ( 115a - 115p ) is provided in the semiconductor substrate. Each doped semiconductor well structure accommodates a respective group ( 113a - 113p ) of at least one word line driver associated with a respective group ( WL1 - WLh , WLk - WLm ) of at least one word line. The different doped semiconductor well structures can thus be biased independently of each other to respective semiconductor well bias potentials, so that the word line potentials of word lines of different groups need not be correlated.
Abstract:
Method for refreshing data stored in an electrically erasable and programmable non-volatile semiconductor memory comprising at least one two-dimensional array (1) of memory cells (MC) containing a plurality of individually erasable and programmable memory pages (R). Each time a request to modify a content of a memory page is received by the memory, the method provides for modifying (201;502;602) the content of said memory page and submitting a portion (S1-SZ;R) of the two-dimensional array to a refresh procedure (202-208;501,503-509;601,603-612). The refresh procedure comprises detecting (203;505;606) memory cells of that memory portion that have partially lost a respective datum stored therein and reprogramming the datum in the detected memory cells.
Abstract:
During critical plasma etching steps, the wafer's surface is illuminated with electromagnetic radiation in the visible and/or in UV spectrum of energy and power density sufficient to enhance the reverse current through protective junctions that are commonly realized for providing electrical discharge paths for electrical charges picked up by exposed conductive parts to limit the level of induced voltages to values compatible with the preservation of the integrity of functional dielectric layers coupled to the exposed conductors parts and to the semiconductor substrate or to another conductive part.