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公开(公告)号：JPH04248843A
公开(公告)日：1992-09-04
申请号：JP102891
申请日：1991-01-09
Applicant: TORAY INDUSTRIES
Inventor： HIRAOKA TOSHIHIKO , TSUNASHIMA KENJI , KUROME TAIICHI
IPC: B29C55/14 , B29K67/00 , B29K105/32 , B29L7/00 , B32B27/06 , C08G63/66 , C08G63/672 , C08G63/688 , C08J5/18 , C08L67/02
Abstract: PURPOSE:To obtain an antistatic film, composed of a polyester containing a specific dicarboxylic acid component, suitable as OHP sheets, packaging films, etc., for perishables and excellent in transparency, water absorptivity, mechanical characteristics and heat resistance. CONSTITUTION:An antistatic polyester film is composed of a polyester containing (A) 2-20wt.% aromatic dicarboxylic acid having a metallic sulfonate and/or its derivative (e.g. 5-sodium sulfoisophthalic acid) and (B) 2-20wt.% polyether-dicarboxylic acid, expressed by formula I [R and R are H or 1-8C alkyl; R is 2-8C alkylene; (n) is a positive integer] and having 600-20000 average molecular weight and/or its derivative, preferably a polyethyleneoxydicarboxylic acid expressed by formula II (R is H or 1-8C alkyl) as a dicarboxylic acid copolymerization component of the polyester. The aforementioned antistatic polyester film has >=10g/m .24hr/0.1mm water vapor permeability and
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公开(公告)号：JPH03145075A
公开(公告)日：1991-06-20
申请号：JP28217989
申请日：1989-10-30
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , ITO NOBUAKI
Abstract: PURPOSE:To stabilize the size in response to variation in environmental conditions by using a basic film made of heat resistant film having specific thermal expansion coefficient in the width and length directions of a film connector, humidity expansion coefficient in the width direction, and the tensile elastic modulus. CONSTITUTION:A plurality of parallel independent conductive wires are arranged in a side facing a side of a rectangular basic film, and on both sides of the wires terminals for connection are provided. The basic film is made of heat resistant film of which thermal expansion coefficients in the directions of the width and length of a connector aW, aL, humidity expansion coefficient in the width direction thereof BW and tensile elastic modulus YW in the same direction thereof are shown by the formula I. It is thus possible to have a film connector with stabilized size in response to change in environmental conditions such as temperature and humidity.
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公开(公告)号：JPH01228842A
公开(公告)日：1989-09-12
申请号：JP5465388
申请日：1988-03-08
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , KOBAYASHI HIROAKI , ITO NOBUAKI
Abstract: PURPOSE:To obtain a fire retarding sheet of almost incombustible and excellent in workability, solvent resistance, abrasion resistance and the like by laminating the heat resistant film made up of the polymer having substantially no melting point and with a specified oxygen index at least on one side of a flexible base material. CONSTITUTION:As a flexible base material, natural fibre, textile comprising chemical fibre, non-woven fabric, paper or synthetic resin sheet are used: it is preferable that these materials are made to be fire retardant. Aromatic polyamide, aromatic polyimide and the like are given as the polymer having substantially no melting point and comprising the heat resistant film laminating on at least one side of the flexible base material. The heat resistant film has the oxygen index 25 or above; if not 25 or above, it is not suitable because the combusting part becomes large when it is exposed to fire.
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公开(公告)号：JPH01186380A
公开(公告)日：1989-07-25
申请号：JP1149088
申请日：1988-01-21
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , KOBAYASHI HIROAKI , ITO NOBUAKI
Abstract: PURPOSE:To enhance slitting properties and running properties in transfer recording by a method wherein, the longitudinal and crosswise Young's moduluses of an aromatic polyamide film containing a specific amount of carbon black meet specific requirements respectively, and a longitudinal F5 value and a longitudinal thermal-shrinkage stress are determined to be specific values. CONSTITUTION:The addition amount of a carbon black is 10-40wt.% per the total weight of an aromatic polyamide film. In this aromatic polyamide film, a Young's modulus (Ym) in a longitudinal direction (MD) and a Young's modulus (Yt) in a width direction (TD) are required to meet the following formulas (1) and (2). Furthermore, an F5 value is 10kg/mm or more longitudinally, and a thermal shrinkage stress is 2.0kg/mm or less at 100-250 deg.C longitudinally. A thermal recording transfer body using this film can exhibit good high-speed slitting properties even if the film is made very thin, prevent the occurrence of wrinkles or break during the production of the transfer body or during the transfer recording, and keep a contact condition with a conduction head satisfactory to enable a sharp recording.
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公开(公告)号：JPH0196993A
公开(公告)日：1989-04-14
申请号：JP25546787
申请日：1987-10-08
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , KOBAYASHI HIROAKI , ITO NOBUAKI
Abstract: PURPOSE:To realize sufficient heat-resisting properties, at the time of rotary transfer, and prevent the hindrance in the transferring process even in the case where a mold release is not provided, by using, as a base film, aromatic polyamide or aromatic polyimide film having specific surface characteristics and mechanical characteristics at a high temperature. CONSTITUTION:In a sheet wherein a circuit pattern is formed on at least a single surface of a base film, an aromatic polyamide film or an aromatic polyimide film wherein contact angle of surface water is in the range of 30-85 deg., and elongation at 250 deg.C is more than or equal to 40% is used for the base film. When a circuit pattern is formed on the base film, and transferred to the molding resin side in an injection mold, suitable properties of close contact and mold release are obtained. Further suitable heat-resisting properties are maintained, and a certain amount of elongation is allowed in accordance with the shape of a molded article.
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Patent Agency Ranking
公开(公告)号：JPS63237989A
公开(公告)日：1988-10-04
申请号：JP7254587
申请日：1987-03-26
Applicant: TORAY INDUSTRIES
Inventor： ITO NOBUAKI , KOBAYASHI HIROAKI , KUROME TAIICHI
Abstract: PURPOSE:To eliminate the need for a back coat layer by providing a thermal transfer layer on a laminate of an aromatic polyamide layer having a surface roughness of not more than 0.1mum and a glossiness of at least 400 and an aro matic polyamide layer having a surface roughness of 0.12-1.0mum, on said layer. CONSTITUTION:A raw liquid of an aromatic polyamide A comprising less than 5wt.% of inorganic or organic particles of ZnO, Al2O3, carbon black or the like with a particle diameter of 20mmum-5mum and a raw liquid of an aromatic polyamide B comprising 0.1-80wt.% of inorganic or organic particles (similar to the above) with a particle diameter of 20mmum-10mum are laminated through a mixing pipe to obtain a laminate which comprises an aromatic polyamide layer A having a surface roughness of not more than 0.1mum and a glossiness of at least 400 and an aromatic polyamide layer B having a surface roughness of 0.12-1.0mum, and has a Young's modulus at 200 deg.C of at least 100kg/mm . A thermal transfer layer is provided on the layer A of the laminate to produce a transfer material for thermal recording.
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公开(公告)号：JPS60201914A
公开(公告)日：1985-10-12
申请号：JP5888684
申请日：1984-03-27
Applicant: TORAY INDUSTRIES
Inventor： KUROME TAIICHI , KOBAYASHI HIROAKI , ITOU NOBUAKI
Abstract: PURPOSE:To improve surface smoothness or surface slipperiness by stretching in a sheet form the dope in which hydrophobic inorganic particles having each primary particle diameter 5-500mum and the hydrophobic grade 10 or higher are contained by 0.03-5wt% to polymer. CONSTITUTION:Heat-resisting polymer having the glass transition point 200 deg.C or higher is dissolved in solvent to prepare dope. Aromatic polyimide, aromatic polyamide, aromatic polyamidoimide, etc. are enumerated as heat-resisting polymer with a glass transition point 200 deg.C or higher. Amide solvent is used as organic solvent for the dope while sulfuric acid etc. is used as inorganic solvent. Heat-resisting film is obtained by the solution film making process where hydrophobic inorganic particles having the primary particle diameter 5-500mum and the hydrophobic grade 10 or higher are added to the above-mentioned dope by 0.03-5wt% to the polymer, stretched in a sheet form and then the solvent is removed.
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28.发明专利
公开(公告)号：JP2002140810A
公开(公告)日：2002-05-17
申请号：JP2000335028
申请日：2000-11-01
Applicant: TORAY INDUSTRIES
Inventor： KATO HIDEKAZU , TAKAUCHI SHINJI , KUROME TAIICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polyester film for a magnetic recording medium suitable for manufacturing a digital video tape provided with both durability and electric characteristics with good productivity. SOLUTION: A discontinuous coating film containing fine particles and easily adhering resin is formed on one side surface of the polyester film for the magnetic recording medium. The easily adhering resin contains an element S(sulfur) and has 3,500-4,100 [count/40 sec] intensity value of the element S measured by a fluorescent X-ray analyzer and the surface A on the side of the discontinuous coating film has 1-4 nm surface roughness.
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公开(公告)号：JP2002083414A
公开(公告)日：2002-03-22
申请号：JP2000269690
申请日：2000-09-06
Applicant: TORAY INDUSTRIES
Inventor： MORI MASAMI , TAKAUCHI SHINJI , KUROME TAIICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polyester film for a magnetic recording medium suitable for manufacturing a magnetic recording tape having favorable durability or surface roughness of a magnetic layer and reduced dropout. SOLUTION: In the polyester film for the magnetic recording medium, no linear flaws extending in the longitudinal direction of the film including flaws having 0.05-0.27 μm flaw height exist in the film surface A on the side on which the magnetic layer is formed.
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公开(公告)号：JPH11323130A
公开(公告)日：1999-11-26
申请号：JP15534998
申请日：1998-05-20
Applicant: TORAY INDUSTRIES
Inventor： WATANABE YASUTOSHI , MIYAJI SHINICHIRO , KUROME TAIICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polyphenylene sulfide film which can be formed stably in improved yields without encountering defects of spinneret streaks and is excellent in processability in use for capacitors. SOLUTION: There are provided a polyphenylene sulfide resin composition, wherein the difference between the content of volatiles at 250 deg.C and that of volatiles at 150 deg.C is at most 0.3 wt.% based on the total resin composition and a polyphenylene sulfide film based on a polyphenylene sulfide resin composition, wherein the difference between the content of volatiles at 250 deg.C and that of volatiles at 150 deg.C is at most 0.02 wt.% based on the total film.
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