-
公开(公告)号：EP2757577A4
公开(公告)日：2015-05-20
申请号：EP12831282
申请日：2012-09-14
Applicant: TORAY INDUSTRIES
Inventor： HONDA TOMOYUKI , FUKUDA SEIJI , OKUDA RYOJI
CPC classification number: B24B37/26 , B24B37/20 , B24B37/22 , H01L21/304
-
公开(公告)号：EP3225647A4
公开(公告)日：2018-08-01
申请号：EP15863856
申请日：2015-11-19
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , KIUCHI YOHEI , OKUDA RYOJI
IPC: C08G73/10 , C08G69/42 , G03F7/004 , G03F7/023 , H01L21/027
CPC classification number: C08G73/1064 , C08G69/42 , C08G73/10 , C09D179/08 , G03F7/022 , G03F7/0233 , G03F7/039 , G03F7/0755 , G03F7/162 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H01L21/027 , H01L21/0274 , H01L21/78 , H01L24/02 , H01L24/13 , H01L24/94 , H01L2224/02311 , H01L2224/13024
Abstract: Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R 2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).
-
公开(公告)号：JP2000327775A
公开(公告)日：2000-11-28
申请号：JP13715599
申请日：1999-05-18
Applicant: TORAY INDUSTRIES
Inventor： OKUDA RYOJI , TOMIKAWA MASAO , FUJITA YOJI
Abstract: PROBLEM TO BE SOLVED: To treat the subject composition by a method by which an edge part of the cross section of a pattern is hardly sagged, and more rectangular shape can be provided by heat-treating the pattern formed on a substrate out of a specific polymer under a specified condition. SOLUTION: A pattern formed out of a polymer consisting essentially of a structural unit of the formula (R1 is a tri- to octa-valent organic group having two or more carbon atoms; R2 is a di- to hexa-valent organic group having two or more carbon atoms; R3 is H, an alkali metal ion, ammonium ion or a 1-20C organic group; (m) is 3-100,000; (n) is 0-2; and (p) is 0-4 with the proviso that n+q is larger than 0) on a substrate is heat-treated at (T±10) deg.C [T is the boiling point ( deg.C) of the solvent included in the polymer under 1 atm] for >=10 min in the treating method. The polymer consisting essentially of the structural unit of the formula can be obtained, for example, by selectively combining a tetracarboxylic acid dianhydride with a diamine, and reacting them in an adequate polar solvent or a solvent consisting essentially of γ- butyrolactone.
-
公开(公告)号：JP2000241974A
公开(公告)日：2000-09-08
申请号：JP3847399
申请日：1999-02-17
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , OKUDA RYOJI , YOSHIDA TOMOYUKI
IPC: H01L21/027 , C08K5/41 , C08K5/42 , C08L61/14 , C08L79/04 , C08L79/08 , C08L101/14 , C09D161/14 , C09D179/04 , C09D179/08 , G03F7/004 , G03F7/032 , G03F7/039
Abstract: PROBLEM TO BE SOLVED: To control a developing time and to increase the adhesiveness of a composition with a substrate by preparing the composition from a polymer which is soluble with an alkali aqueous solution, a compound which generates an acid by irradiation of active actinic rays, and a compound having sulfone groups. SOLUTION: The positive photosensitive composition used contains a polymer which is soluble with an alkali aqueous solution, a compound which generates an acid by irradiation of active actinic rays, and a compound having sulfone groups. As for the alkali-soluble polymer, for example, a polyamide acid as a polyimide precursor or polyhydroxyamide as a polybenzoxazole precursor are preferably used. As for the compound which generates an acid by active actinic rays, especially a naphthoquinone diazide sulfonate is preferable. The compound having sulfone groups is added to control the dissolving rate and to increase the adhesiveness with a substrate. As for the compound, for example, benzene sulfonamide and toluene sulfonamide can be used.
-
公开(公告)号：JP2000187317A
公开(公告)日：2000-07-04
申请号：JP28548299
申请日：1999-10-06
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , OKUDA RYOJI , FUJITA YOJI
Abstract: PROBLEM TO BE SOLVED: To provide a positive heat resistant photosensitive resin precursor composition developable in an alkaline solution in a short time and small in film thickness reduction in development on unexposed areas by incorporating the specified polyimide precursor and the specified naphthoquinone diazide compound. SOLUTION: The photosensitive resin precursor composition comprises the polyimide polymer composed essentially of structural units represented by formula I and at least one of quinone diazide compounds represented by formula II and in formula I and II, R1 is a 3-8 valent and >=2 C organic group; R2 is a 2-6 valent and >=2 C organic group; R3 is an H atom or a 1-10 C organic group; (n) is an integer of 10-100,000; (m) is 1 or 2; each of (p) and (q) is 0, 1, 2, 3, or 4, and each is not 0 at the same time; (x) is 0, 1, or 2; and all of plural Qs are not 0 in one quinonediazide compound.
-
Patent Agency Ranking26.发明专利
公开(公告)号：JP2004010696A
公开(公告)日：2004-01-15
申请号：JP2002163998
申请日：2002-06-05
Applicant: TORAY INDUSTRIES
Inventor： ARAI NANA , TOMIKAWA MASAO , OKUDA RYOJI
Abstract: PROBLEM TO BE SOLVED: To obtain an oxidation decomposition-resistant resin composition having excellent film thickness retention in UV ozone treatment and oxygen plasma treatment carried out as a cleaning process and to obtain an organic electroluminescent element using the composition as an insulating film. SOLUTION: The oxidation decomposition-resistant resin composition is made into a resin film having 0.05-20.0 μm film thickness. The resin film has ≤ 0.015 μm/minute film thickness reduction rate when resin film is subjected to UV ozone treatment and ≤0.005 μm/minute when subjected to oxygen plasma treatment. COPYRIGHT: (C)2004,JPO
-
公开(公告)号：JP2001049118A
公开(公告)日：2001-02-20
申请号：JP22781399
申请日：1999-08-11
Applicant: TORAY INDUSTRIES
Inventor： OKUDA RYOJI , TOMIKAWA MASAO
Abstract: PROBLEM TO BE SOLVED: To obtain a heat resistant resin composition low in decrease of film properties useful as an interlayer dielectric or the like in the semiconductor field by using a polymer having a specific structural unit and a photo acid generating agent or the like. SOLUTION: This heat resistant resin composition comprises (a) a polymer mainly comprising a structural unit expressed by the formula (R1 is a 2-8 valent C>=2 organic group; R2 is a 2-6 valent C>=2 organic group; R3 is H, an alkali metal ion, ammonium ion or a 1-20C organic group; m is an integer of 3-100,000; n is an integer of 0-2 and in the case of n=2 then R3 may be the same or different; p and q are each an integer of 0-4; p+q>0) and (b) a photo acid generating agent and/or a dissolution adjusting agent, and the thermal weight decreasing rate of the photo acid generating agent and the dissolution adjusting agent at 200 deg.C to 350 deg.C is
-
公开(公告)号：JP2000143980A
公开(公告)日：2000-05-26
申请号：JP31474598
申请日：1998-11-05
Applicant: TORAY INDUSTRIES
Inventor： FUJITA YOJI , OKUDA RYOJI , TOMIKAWA MASAO
Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition capable of being developed by an alkali, and excellent in resolution by compounding a polyimide precursor having a specific structure, with a new quinonediazide compound. SOLUTION: This composition comprises (A) a polymer consisting essentially of a structural unit of formula I (R1 is a >=2C tri- to octa-valent organic group; R2 is a >=2C di- to hexa-valent organic group; R3 is H or a 1-20C organic group; n is 10-100,000; m is 0-2; p and q are each 0-4, with the proviso that both of p and q are not simultaneously 0), and (B) a quinonediazide compound of formula II (X is a group of formulas III or IV; R4 and R5 are each a 1-10C monovalent organic group; b and c are each 0-2 with the proviso that both of b and c are not simultaneously 0; d and e are each 0-2). The component A can be obtained, for example, by reacting a tetracarboxylic dianhydride with a diamine compound at a low temperature. The component B is preferably the one having a hydroxy-containing naphthalene skeleton bonded to the sulfonyl group of naphthoquinonediazide by an ester bond.
-
公开(公告)号：JP2000119519A
公开(公告)日：2000-04-25
申请号：JP28956798
申请日：1998-10-12
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , OKUDA RYOJI , OKAMOTO HISAYO
Abstract: PROBLEM TO BE SOLVED: To obtain a photosensitive resin precursor composition developable with an alkali aqueous solution in a short time, having excellent viscosity stability of photosensitive varnish by making the composition include a polymer of a specific structure and a quinonediazidosulfonic acid ester compound. SOLUTION: This photosensitive resin precursor composition comprises a polymer of cyclic structure composed of a structure of formula I and/or formula II [R0 and R3 are each a 3-30C monofunctional (Si-containing) organic group; R1(OH)p is at least one group of formula III (R4 is a >=2C 4-8 functional organic group; (r) is 0-4) or formula IV (R5 is a >=2C 3-8 functional organic group; R6 is H or a 1-10C organic group; (s) is 0-4; (t) is 0-1) or the like; R2 is >=2C bifunctional to hexafunctional; (n) is 1-100; (p) and (q) are each 0-4] as a main component and a quinonediazidosulfonic acid ester compound.
-
公开(公告)号：JP2000039714A
公开(公告)日：2000-02-08
申请号：JP12816699
申请日：1999-05-10
Applicant: TORAY INDUSTRIES
Inventor： TOMIKAWA MASAO , YOSHIDA HISAYO , OKUDA RYOJI
IPC: H01L21/027 , C08K5/28 , C08L79/08 , C09D5/00 , C09D179/04 , C09D179/08 , G03F7/022 , G03F7/037 , H01L21/312 , H01L23/29 , H01L23/31
Abstract: PROBLEM TO BE SOLVED: To obtain an alkali-developable photosensitive heat resistant resin precursor compsn. SOLUTION: The photosensitive heat resistant resin precursor compsn. contains a polymer consisting essentially of structural units of formula 1, a quinonediazido compd. and a hardening agent. In the formula, R1 is a tetra- to octavalent >=2C org. group, R2 is a di- to hexavalent >=2C org. group, R3 H or a 1-20C org. group, (n) is an integer of 10-100,000, (m) is an integer of 0-2, each of (p) and (q) is an integer of 0-4 and m+p+q>=1.
-
-
-
-
-
-
-
-
-
Search Results
46
records
(took 0.024 seconds)
