-
1.发明公开
公开(公告)号：KR20200135318A
公开(公告)日：2020-12-02
申请号：KR20207025476
申请日：2019-03-15
Applicant: TORAY INDUSTRIES
Inventor： KOYAMA YUTARO , MASUDA YUKI , TOMIKAWA MASAO
Abstract: 본발명은, 고신도, 저응력, 고금속밀착, 고내열성의경화막을얻을수 있는알칼리가용성수지및 그것을함유하는감광성수지조성물을제공한다. 본발명은, 일반식 (1)로표시되는구조를갖고, 또한다음의 (I)과 (II)를만족시키는것을특징으로하는 (A) 알칼리가용성수지이다. (I) 일반식 (1)의 X1로서탄소수 8 내지 30의지방족쇄를갖는유기기를, X1과 X2의총량 100몰%에대하여 30 내지 70몰% 함유한다 (II) 일반식 (1)의 Y1로서디페닐에테르구조를갖는유기기를, Y1과 Y2의총량 100몰%에대하여 1 내지 30몰% 함유한다 JPEGpct00025.jpg2894 (일반식 (1) 중의 X1은탄소수 2 내지 100개의 2가의유기기를나타내고, Y1 및 Y2는탄소수 2 내지 100개의 2 내지 6가의유기기를나타내고, X2는탄소수 2 내지 100개의 4가의유기기를나타내고, p 및 q는 0 내지 4의범위의정수를나타내고, n1 및 n2는 5 내지 100,000의범위의정수를나타냄.)
-
公开(公告)号：KR20180071281A
公开(公告)日：2018-06-27
申请号：KR20187012483
申请日：2016-09-21
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , SHOJI YU , ISOBE KIMIO , OKUDA RYOJI
Abstract: 고신도, 저응력, 고금속밀착의경화막을얻을수 있는수지및 감광성수지조성물을제공한다. (A) 폴리아미드구조와, 이미드전구체구조및 이미드구조중 적어도어느것의구조를갖는수지이며, 상기 (A) 수지의구조중 적어도어느것에, 지방족기를갖는디아민잔기를갖는것을특징으로하는수지.
-
公开(公告)号：SG11201707712TA
公开(公告)日：2017-10-30
申请号：SG11201707712T
申请日：2016-03-18
Applicant: TORAY INDUSTRIES
Inventor： SHOJI YU , MASUDA YUKI , KOYAMA YUTARO , OKUDA RYOJI
Abstract: A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
-
公开(公告)号：PH12020551405A1
公开(公告)日：2021-07-19
申请号：PH12020551405
申请日：2020-09-08
Applicant: TORAY INDUSTRIES
Inventor： KOYAMA YUTARO , MASUDA YUKI , TOMIKAWA MASAO
Abstract: The present invention provides an alkali-soluble resin from which a cured film having a high degree of elongation, low stress, high metal adhesion, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin. The present invention is (A) an alkali-soluble resin characterized by having a structure represented by general formula (1) and satisfying (I) and (II). (I) 30-70 mol pcnt of an organic group having an aliphatic chain having 8-30 carbon atoms is contained as X1 of general formula (1) with respect to a total amount of 100 mol pcnt of X1 and X2. (II) 1-30 mol pcnt of an organic group having a diphenyl ether structure is contained as Y1 of general formula (1) with respect to a total amount of 100 mol pcnt of Y1 and Y2 (in general formula (1), X1 represents a divalent organic group having 2-100 carbon atoms, Y1 and Y2 represent an organic group having a valence of 2-6 and having 2-100 carbon atoms, X2 represents a tetravalent organic group having 2-100 carbon atoms, p and q represent an integer in the range of 0-4, and n1 and n2 represent an integer in the range of 5-100,000).
-
公开(公告)号：SG11201802512WA
公开(公告)日：2018-04-27
申请号：SG11201802512W
申请日：2016-09-21
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , SHOJI YU , ISOBE KIMIO , OKUDA RYOJI
Abstract: A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
-
Patent Agency Ranking
公开(公告)号：SG11201706733UA
公开(公告)日：2017-10-30
申请号：SG11201706733U
申请日：2016-02-09
Applicant: TORAY INDUSTRIES
Inventor： ARIMOTO YUKARI , MASUDA YUKI , OKUDA RYOJI
-
公开(公告)号：SG11202008583YA
公开(公告)日：2020-10-29
申请号：SG11202008583Y
申请日：2019-03-15
Applicant: TORAY INDUSTRIES
Inventor： KOYAMA YUTARO , MASUDA YUKI , TOMIKAWA MASAO
Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.
-
公开(公告)号：SG11201701691PA
公开(公告)日：2017-04-27
申请号：SG11201701691P
申请日：2015-08-24
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , ARIMOTO YUKARI , YUBA TOMOYUKI
Abstract: The purpose of the present invention is to provide a resin that is capable of producing a photosensitive resin composition having high sensitivity and high film retention ratio. The present invention provides a resin which has a polyamide structure, a polyimide precursor structure or a polyimide structure wherein an acid having an alicyclic structure with 6-40 carbon atoms or a semi-alicyclic structure with 6-40 carbon atoms or an anhydride of the acid is contained in an amount of 5-95% by mole if the total amount of acids or anhydrides thereof is taken as 100% by mole.
-
公开(公告)号：SG11201501594UA
公开(公告)日：2015-05-28
申请号：SG11201501594U
申请日：2013-09-11
Applicant: TORAY INDUSTRIES
Inventor： ONISHI HIROYUKI , MASUDA YUKI , TOMIKAWA MASAO
-
公开(公告)号：PH12018500669A1
公开(公告)日：2018-10-01
申请号：PH12018500669
申请日：2018-03-26
Applicant: TORAY INDUSTRIES
Inventor： MASUDA YUKI , SHOJI YU , ISOBE KIMIO , OKUDA RYOJI
Abstract: Provided are: a resin which enables the achievement of a cured film having high degree of elongation, low stress and high metal adhesion; and a photosensitive resin composition. A resin (A) which has a polyamide structure and at least one of an imide precursor structure and an imide structure, and which is characterized in that at least one of the structures of the resin (A) has a diamine residue having an aliphatic group.
-
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.026 seconds)
