公开(公告)号：SG181979A1

公开(公告)日：2012-08-30

申请号：SG2012048153

申请日：2010-12-07

Applicant: TORAY INDUSTRIES

Inventor： MIYABE TOMOTSUGU ,  FUJITA YOJI

Abstract: POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITIONAbstractDisclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350°C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.(No suitable figure)

公开(公告)号：DE60035482T2

公开(公告)日：2008-04-17

申请号：DE60035482

申请日：2000-05-30

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

IPC: G03F7/022 ,  C08G73/10 ,  C08L77/06 ,  C08L79/08 ,  G03F7/023 ,  G03F7/037

Abstract: The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.6 debye (b) There is included a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid and/or an ester of a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid (In general formula (1), R represents a bivalent to octavalent organic group with at least two carbon atoms, R represents a bivalent to hexavalent organic group with at least two carbon atoms, and R represents hydrogen or an organic group with from one to ten carbons. n is an integer in the range 10 to 100,000, m is an integer in the range 0 to 2, and p and q are integers in the range 0 to 4, but p and q are not simultaneously 0.) (In the formula, R , R , R and R each represents a hydrogen atom or a C1-8 alkyl group, alkoxy group, carboxyl group or ester group. At least one R is hydroxyl group, while the rest represent hydrogen atoms and C1-8 alkyl groups. aa, bb, cc and dd represent integers in the range 0 to 3. However, aa + bb ≤ 5, bb + dd ≤ 5 and aa + bb > 0. ee represents an integer in the range 1 to 3.)

公开(公告)号：AT366952T

公开(公告)日：2007-08-15

申请号：AT00931608

申请日：2000-05-30

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

IPC: G03F7/022 ,  C08G73/10 ,  C08L77/06 ,  C08L79/08 ,  G03F7/023 ,  G03F7/037

Abstract: The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.6 debye (b) There is included a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid and/or an ester of a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid (In general formula (1), R represents a bivalent to octavalent organic group with at least two carbon atoms, R represents a bivalent to hexavalent organic group with at least two carbon atoms, and R represents hydrogen or an organic group with from one to ten carbons. n is an integer in the range 10 to 100,000, m is an integer in the range 0 to 2, and p and q are integers in the range 0 to 4, but p and q are not simultaneously 0.) (In the formula, R , R , R and R each represents a hydrogen atom or a C1-8 alkyl group, alkoxy group, carboxyl group or ester group. At least one R is hydroxyl group, while the rest represent hydrogen atoms and C1-8 alkyl groups. aa, bb, cc and dd represent integers in the range 0 to 3. However, aa + bb ≤ 5, bb + dd ≤ 5 and aa + bb > 0. ee represents an integer in the range 1 to 3.)

公开(公告)号：DE60035482D1

公开(公告)日：2007-08-23

申请号：DE60035482

申请日：2000-05-30

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

IPC: G03F7/022 ,  C08G73/10 ,  C08L77/06 ,  C08L79/08 ,  G03F7/023 ,  G03F7/037

Abstract: The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.6 debye (b) There is included a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid and/or an ester of a phenol compound represented by general formula (8) and a naphthoquinone diazide sulphonic acid (In general formula (1), R represents a bivalent to octavalent organic group with at least two carbon atoms, R represents a bivalent to hexavalent organic group with at least two carbon atoms, and R represents hydrogen or an organic group with from one to ten carbons. n is an integer in the range 10 to 100,000, m is an integer in the range 0 to 2, and p and q are integers in the range 0 to 4, but p and q are not simultaneously 0.) (In the formula, R , R , R and R each represents a hydrogen atom or a C1-8 alkyl group, alkoxy group, carboxyl group or ester group. At least one R is hydroxyl group, while the rest represent hydrogen atoms and C1-8 alkyl groups. aa, bb, cc and dd represent integers in the range 0 to 3. However, aa + bb ≤ 5, bb + dd ≤ 5 and aa + bb > 0. ee represents an integer in the range 1 to 3.)

公开(公告)号：EP1132773A4

公开(公告)日：2002-09-18

申请号：EP00931608

申请日：2000-05-30

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

IPC: C08G73/10 ,  G03F7/022 ,  G03F7/023 ,  C08L77/06 ,  C08L79/08 ,  G03F7/037

CPC classification number: G03F7/0233 ,  C08G73/10 ,  G03F7/022

Abstract: A positive-type photosensitive polyimide precursor composition comprising a hydroxylated polyimide precursor and the following photosensitive compound (a) or (b): (a) an ester of a phenol having a dipole moment of 0.1 to 1.6 D with naphthoquinone diazide sulfonic acid, or (b) a mixture or ester of a phenol represented by general formula (8) with naphthoquinone diazide sulfonic acid: wherein R , R , R and R are each alkyl or the like; R is hydroxyl or the like; aa, bb, cc, and dd are each an integer of 0 to 3; and ee is an integer of 1 to 3.

Abstract translation: 本发明涉及一种正型感光性树脂前体组合物，其特征在于，其含有以下述通式（1）表示的结构单元作为主要成分的聚合物，此外，其具有满足以下条件（ a）和/或（b）。 本发明提供了一种可显影光敏组合物。 （a）包括萘醌二叠氮磺酸的酯和偶极矩0.1至1.6德拜的酚化合物（b）包括由通式（8）表示的酚化合物和萘醌二叠氮磺酸和/或 由通式（8）表示的酚化合物和萘醌二叠氮磺酸的酯（通式（1）中，R 1表示具有至少两个碳原子的二价至八价有机基团， 2>表示具有至少两个碳原子的二价至六价有机基团，R 3表示氢或具有1至10个碳的有机基团，n为10至100,000的整数，m为整数 范围0〜2，p和q为0〜4的整数，p和q不同时为0）（式中，R 23，R 24，R 26 >和R 27各自表示氢原子或C 1-8烷基，烷氧基，羧基或酯基，至少一个R 25是羟基 组，而其余表示氢原子和C 1-8烷基。 aa，bb，cc和dd表示0〜3的整数。但aa +bb≤5，bb +dd≤5，aa + bb> 0e表示1〜3的整数。

公开(公告)号：EP2520977A4

公开(公告)日：2013-04-03

申请号：EP10840850

申请日：2010-12-07

Applicant: TORAY INDUSTRIES

Inventor： MIYABE TOMOTSUGU ,  FUJITA YOJI

IPC: G03F7/023 ,  C08G73/10 ,  C08G73/22 ,  G03F7/075 ,  H01L21/027

CPC classification number: C08L79/08 ,  C08G73/10 ,  C08K5/29 ,  C08K5/5425 ,  C08K5/5435 ,  C08L63/00 ,  G03F7/0233 ,  G03F7/0751

Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350°C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

公开(公告)号：EP2110708A4

公开(公告)日：2010-11-24

申请号：EP08710777

申请日：2008-02-05

Applicant: TORAY INDUSTRIES

Inventor： FUJITA YOJI ,  ARIMOTO SHINJI ,  IKE RINSEI

IPC: G03F7/023 ,  C08F290/06 ,  C08F299/02 ,  C08G73/10 ,  C08G73/22 ,  G03F7/004 ,  G03F7/022 ,  H01L21/027

CPC classification number: C08F290/06 ,  C08F290/14 ,  C08F299/02 ,  C08F299/06 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/121 ,  C08G73/122 ,  C08G73/123 ,  C08G73/124 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08G73/14 ,  C08L61/00 ,  C08L61/06 ,  C08L79/085 ,  G03F7/0236 ,  C08L2666/20 ,  C08L2666/16

公开(公告)号：EP1909142A4

公开(公告)日：2010-11-10

申请号：EP06732022

申请日：2006-04-18

Applicant: TORAY INDUSTRIES

Inventor： YUBA TOMOYUKI ,  FUJITA YOJI ,  TOMIKAWA MASAO

IPC: G03F7/085 ,  C08K5/544 ,  G03F7/075

CPC classification number: G03F7/0751 ,  C08K5/0025 ,  C08K5/544 ,  G03F7/0045 ,  G03F7/0226 ,  G03F7/0755 ,  Y10S430/106 ,  Y10S430/111 ,  Y10S430/115 ,  Y10S430/117

公开(公告)号：JP2001139806A

公开(公告)日：2001-05-22

申请号：JP32515499

申请日：1999-11-16

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  FUJITA YOJI ,  SUWA MITSUFUMI

IPC: H01L21/027 ,  C08L79/08 ,  G03F7/027

Abstract: PROBLEM TO BE SOLVED: To provide a heat-resistant photosensitive resin compositions which can be pattern-processed in a low exposure and have a small shrink after pattern processing. SOLUTION: The heat-resistant photosensitive resin compositions comprise (a) a polymer having a structural unit represented by the formula, wherein R1 is >=2C di- to octa-valent organic group; R2 is >=2C di- to octa-valent organic group; R3; R4, R5, and R6 re each a hydrogen atom, 1-20C monovalent alkyl group or a monovalent organic group having one to three unsaturated bonds, provided that all R5s and R6s are not simultaneously hydrogen atoms; n is an integer of 3-100,000; p and q are each an integer of 0-4; and r and s are each an integer of 0-2, (b) a photosensitizer, and (c) a solvent.

公开(公告)号：JP2001049119A

公开(公告)日：2001-02-20

申请号：JP22781499

申请日：1999-08-11

Applicant: TORAY INDUSTRIES

Inventor： OKUDA RYOJI ,  TOMIKAWA MASAO ,  FUJITA YOJI

IPC: H01L21/312 ,  C08K5/544 ,  C08L79/08 ,  G03F7/022 ,  G03F7/037

Abstract: PROBLEM TO BE SOLVED: To obtain a heat resistant resin composition simply improving adhesive property without effecting on physical properties of the resin and storing stability usefull as an interlayer dielectric, surface protective layer by including a heat resistant resin, solvent and a specific ratio of a silicone-diamine. SOLUTION: This composition includes (A) a heat resistant resin or it's precursor, (B) a solvent (e.g. a polar aprotic solvent, ethers, ketones, esters or aromatic hydrocarbons) and (C) 1-10 wt.% of a silicone-diamine [e.g. bis(3- aminopropyl)tetramethyldisiloxane or the like] per resin of the component A. The component A preferably a polymer mainly comprising a structural unit of the formula (R1 is a 2-8 valent C>=2 organic group; R2 is a 2-6 valent C>=2 organic group; R3 is H, an alkali metal ion, ammonium ion or a 1-20C organic group; m is an integer of 3-100,000; n is an integer of 0-2; p and q are each 0-4).