公开(公告)号：EP2255378A4

公开(公告)日：2012-07-25

申请号：EP09716695

申请日：2009-03-05

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  HUANG YONGGANG ,  KO HEUNG CHO ,  STOYKOVICH MARK ,  CHOI WON MOOK ,  SONG JIZHOU ,  AHN JONG HYUN ,  KIM DAE HYEONG

IPC: H01L21/20

CPC classification number: H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Disclosed herein is an electronic device comprising a substrate, a plurality of device islands supported by said substrate; and a serpentine electrical interconnect having a first end electrically connected to a first device island and a second end electrically connected to a second device island.

公开(公告)号：EP1915774A4

公开(公告)日：2012-05-02

申请号：EP06771761

申请日：2006-06-01

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO ,  KO HEUNG CHO ,  MACK SHAWN

IPC: H01L21/302 ,  B82Y10/00 ,  H01L21/336 ,  H01L21/683 ,  H01L21/8242 ,  H01L23/62 ,  H01L29/06 ,  H01L29/16 ,  H01L29/22 ,  H01L29/66 ,  H01L29/786 ,  H01L51/00 ,  H01R12/00 ,  H05K3/36

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L21/6835 ,  H01L27/1266 ,  H01L27/1292 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/22 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78696 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/1033 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00

公开(公告)号：EP2984910A4

公开(公告)日：2017-01-04

申请号：EP14782878

申请日：2014-04-11

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  KANG SEUNG-KYUN ,  HWANG SUKWON ,  CHENG JIANJUN ,  ZHANG YANFENG ,  YING HANZE

IPC: H05K1/09 ,  A61B5/00 ,  A61M5/44 ,  G06K19/077 ,  H01L21/70 ,  H01L23/00 ,  H01L23/06 ,  H05K1/02 ,  H05K1/03 ,  H05K3/02 ,  H05K3/22 ,  H05K3/28

CPC classification number: H05K1/185 ,  A61B5/686 ,  A61B2562/125 ,  A61M5/44 ,  G06K19/0775 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/0286 ,  H05K1/0306 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K5/069 ,  H05K13/0023 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/17 ,  H05K2203/175 ,  H05K2203/178 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

Abstract translation: 本发明提供瞬态装置，包括在应用至少一个内部和/或外部刺激时物理，化学和/或电转化的有源和无源装置。 每个具有可编程，可控和/或可选择的降解速率的可降解装置组件，可降解底物和/或可降解封装材料的结合提供了改变装置的手段。 在一些实施例中，例如，本发明的瞬态装置将可降解的高性能单晶无机材料与选择性可移除的基底和/或密封剂结合。

公开(公告)号：EP2064710A4

公开(公告)日：2011-05-04

申请号：EP07841968

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  KANG SEONG JUN ,  LEE KEON JAE ,  ZHU ZHENGTAO ,  MENARD ETIENNE ,  KIM HOON-SIK ,  KHANG DAHL-YOUNG ,  AHN JONG-HYUN

IPC: H01B7/06 ,  H01R35/00

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

公开(公告)号：EP1700161A4

公开(公告)日：2010-12-01

申请号：EP04812651

申请日：2004-12-01

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  JEON SEOKWOO ,  PARK JANGUNG

IPC: G03F7/00 ,  B81C99/00 ,  B82B20060101 ,  B82B3/00 ,  G03F1/00 ,  G03F1/60 ,  G03F7/20

CPC classification number: B81C99/00 ,  B82B3/00 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/703 ,  G03F7/7035 ,  G03F7/70408 ,  Y10S430/146

Abstract: The present invention provides methods and devices for fabricating 3D structures and patterns of 3D structures on substrate surfaces, including symmetrical and asymmetrical patterns of 3D structures. Methods of the present invention provide a means of fabricating 3D structures having accurately selected physical dimensions, including lateral and vertical dimensions ranging from 10s of nanometers to 1000s of nanometers. In one aspect, methods are provided using a mask element comprising a conformable, elastomeric phase mask capable of establishing conformal contact with a radiation sensitive material undergoing photoprocessing. In another aspect, the temporal and/or spatial coherence of electromagnetic radiation using for photoprocessing is selected to fabricate complex structures having nanoscale features that do not extend entirely through the thickness of the structure fabricated.

Abstract translation: 本发明提供了用于在衬底表面上制造3D结构的3D结构和图案的方法和装置，包括3D结构的对称和非对称图案。 本发明的方法提供了一种制造具有精确选择的物理尺寸的3D结构的方法，其包括范围从10纳米到1000纳米的横向和垂直尺寸。 在一个方面，提供了使用掩模元件的方法，所述掩模元件包括能够与正在进行光刻处理的辐射敏感材料建立保形接触的适形弹性相位掩模。 在另一方面，选择用于光处理的电磁辐射的时间和/或空间相干性以制造具有纳米尺度特征的复杂结构，其不完全延伸通过制造的结构的厚度。

公开(公告)号：EP2544598A4

公开(公告)日：2013-12-18

申请号：EP11754158

申请日：2011-03-11

Applicant: UNIV ILLINOIS ,  TUFTS COLLEGE

Inventor： ROGERS JOHN A ,  KIM RAK-HWAN ,  KIM DAE-HYEONG ,  KAPLAN DAVID L ,  OMENETTO FIORENZO G

IPC: A61B17/04 ,  A61B1/00 ,  A61B5/00 ,  A61B17/00 ,  A61B17/06 ,  A61N1/05 ,  A61N5/06 ,  G01L1/00 ,  G01N21/17 ,  G01N21/49 ,  H01L21/20 ,  H01L23/498 ,  H01L25/075 ,  H01L27/06 ,  H01L27/32 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61B17/06166 ,  A61B5/686 ,  A61B2017/00057 ,  A61B2017/00084 ,  A61B2017/00526 ,  A61B2017/00831 ,  A61B2017/00893 ,  A61B2017/06176 ,  A61B2017/0618 ,  A61B2562/18 ,  A61B2562/247 ,  A61N1/05 ,  A61N5/0616 ,  A61N2005/063 ,  A61N2005/0645 ,  A61N2005/0652 ,  G01N21/49 ,  H01L23/4985 ,  H01L24/32 ,  H01L25/0753 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/284 ,  H01L2924/00

Abstract: Described herein are flexible and stretchable LED arrays and methods utilizing flexible and stretchable LED arrays. Assembly of flexible LED arrays alongside flexible plasmonic crystals is useful for construction of fluid monitors, permitting sensitive detection of fluid refractive index and composition. Co-integration of flexible LED arrays with flexible photodetector arrays is useful for construction of flexible proximity sensors. Application of stretchable LED arrays onto flexible threads as light emitting sutures provides novel means for performing radiation therapy on wounds.

Abstract translation: 这里描述的是使用柔性和可拉伸LED阵列的柔性和可拉伸LED阵列和方法。 柔性LED阵列与柔性等离子体晶体一起组装对于流体监测器的构造是有用的，从而允许灵敏地检测流体折射率和组成。 柔性LED阵列与柔性光电探测器阵列的协同集成对于构建灵活的接近传感器非常有用。 将可拉伸的LED阵列作为发光缝合线施加到柔性线上为在伤口上进行放射治疗提供了新的手段。

公开(公告)号：EP2954551A4

公开(公告)日：2017-05-10

申请号：EP14748754

申请日：2014-02-05

Applicant: UNIV ILLINOIS ,  NORTH WESTERN UNIV

Inventor： ROGERS JOHN A ,  FAN JONATHAN ,  YEO WOON-HONG ,  SU YEWANG ,  HUANG YONGGANG ,  ZHANG YIHUI

IPC: H01L23/14 ,  H01L23/498 ,  H01L29/06 ,  H05K1/02

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15747 ,  H05K2201/09263 ,  H01L2924/00

Abstract: The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

Abstract translation: 本发明提供了包括装置阵列的电子系统，其包括经由一个或多个容纳室至少部分地封闭的功能装置和/或装置部件，使得装置和/或装置部件（一个或多个） ）至少部分地并且可选地完全浸没在密闭流体中。 用于本发明的电子设备的密闭室的有用的密封流体包括润滑剂，电解质和/或电子电阻流体。 在一些实施例中，例如，本发明的电子系统包括一个或多个电子设备和/或以独立和/或栓系配置提供的设备组件，其解除由于支撑衬底从自由状态变形，拉伸或压缩而产生的力 站立或系留设备或设备组件。

公开(公告)号：EP2984912A4

公开(公告)日：2017-01-25

申请号：EP14782216

申请日：2014-04-11

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  LEE CHI HWAN ,  YIN LAN ,  HUANG XIAN ,  LEAL CECILIA MARIA DAS NEVES BARBOSA ,  HARBURG DANIEL VINCENT

IPC: H05K7/00 ,  A61B5/00 ,  A61M5/44 ,  G06K19/077 ,  H01L21/70 ,  H01L23/00 ,  H01L23/06 ,  H05K1/02 ,  H05K1/03 ,  H05K3/22 ,  H05K3/28

CPC classification number: H05K1/185 ,  A61B5/686 ,  A61B2562/125 ,  A61M5/44 ,  G06K19/0775 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/31111 ,  H01L21/31133 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/0286 ,  H05K1/0306 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K5/069 ,  H05K13/0023 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/17 ,  H05K2203/175 ,  H05K2203/178 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

公开(公告)号：EP2786644A4

公开(公告)日：2015-09-02

申请号：EP12858625

申请日：2012-09-21

Applicant: UNIV ILLINOIS ,  TUFTS COLLEGE

Inventor： ROGERS JOHN A ,  OMENETTO FIORENZO G ,  HWANG SUK-WON ,  TAO HU ,  KIM DAE-HYEONG ,  KAPLAN DAVID

IPC: H05K1/03 ,  B82Y10/00 ,  H01L23/29 ,  H01L27/01 ,  H01L29/06 ,  H01L29/778 ,  H01L29/786 ,  H01L29/812 ,  H01L29/861 ,  H01L29/872 ,  H01L31/08 ,  H01L49/02 ,  H01Q1/22 ,  H01Q7/00 ,  H05K1/00 ,  H05K1/09

CPC classification number: H01L29/66 ,  B82Y10/00 ,  G11B23/282 ,  H01L23/293 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L29/0669 ,  H01L29/66007 ,  H01L29/7787 ,  H01L29/78603 ,  H01L29/7869 ,  H01L29/78696 ,  H01L29/812 ,  H01L29/861 ,  H01L29/872 ,  H01L31/08 ,  H01L2924/0002 ,  H01Q1/2283 ,  H01Q7/00 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level examples of transient electronics are provided.

公开(公告)号：EP1759422A4

公开(公告)日：2011-04-06

申请号：EP05755193

申请日：2005-06-02

Applicant: UNIV ILLINOIS

Inventor： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC: H01L21/20 ,  B81C1/00 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC classification number: H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。