公开(公告)号：US20220095464A1

公开(公告)日：2022-03-24

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K3/34 ,  H05K1/02

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

公开(公告)号：US20160266334A1

公开(公告)日：2016-09-15

申请号：US15164878

申请日：2016-05-26

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/42 ,  G02B6/43 ,  G02B6/12

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US20160252689A1

公开(公告)日：2016-09-01

申请号：US15152569

申请日：2016-05-12

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/12

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US09335470B2

公开(公告)日：2016-05-10

申请号：US14490688

申请日：2014-09-19

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/4203 ,  G02B6/4231 ,  G02B6/428 ,  Y10T29/49131

Abstract: A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.

Abstract translation: 光电路基板的组装方法如下所述。 在基底上有序地形成底部包层，芯层和顶部覆层，使得波导完成。 在基材中形成第一导光孔，在基材上设置光源，形成发光成分。 在另一个基材中形成第二导光孔，然后将光接收器设置在另一个基材上，从而形成接收器部件。 处理电路基板以在基板的第一电路层上形成第一空腔，第二空腔和第三空腔。 波导，发射部件和接收器部件分别设置在第一腔体，第二腔体和第三腔体中。

公开(公告)号：US09159713B1

公开(公告)日：2015-10-13

申请号：US14493336

申请日：2014-09-22

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: H01L23/52 ,  H01L25/16 ,  G02B6/12

CPC classification number: H01L25/167 ,  G02B6/12004 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An opto-electronic circuit board includes a substrate, a cavity, blind vias, metal layers, a first chip, a second chip, and the optical component. The substrate includes a first circuit layer, a second circuit layer, and a dielectric layer disposed between the first circuit layer and the second circuit layer. The cavity is disposed on the dielectric layer, in which the cavity extends from the first circuit layer to the second circuit layer. The blind vias are disposed at opposite sides of the cavity. The first chip is disposed on the second circuit layer with corresponding to one of the blind vias. The second chip is disposed on the second circuit layer with corresponding to the other one of the blind vias. The optical component is disposed in the cavity, in which the second surface of the optical component is connected to the first circuit layer.

Abstract translation: 光电子电路板包括基板，空腔，盲孔，金属层，第一芯片，第二芯片和光学部件。 衬底包括第一电路层，第二电路层和布置在第一电路层和第二电路层之间的电介质层。 空腔设置在电介质层上，空腔从第一电路层延伸到第二电路层。 盲孔设置在空腔的相对侧。 第一芯片设置在与其中一个盲孔相对应的第二电路层上。 第二芯片设置在第二电路层上，对应于盲孔中的另一个。 光学部件设置在空腔中，光学部件的第二表面连接到第一电路层。

公开(公告)号：US20150121694A1

公开(公告)日：2015-05-07

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。