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公开(公告)号：US11114782B2
公开(公告)日：2021-09-07
申请号：US16540038
申请日：2019-08-13
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Pei-Wei Wang , Ching-Ho Hsieh , Shao-Chien Lee , Kuo-Wei Li
Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
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公开(公告)号：US20240282687A1
公开(公告)日：2024-08-22
申请号：US18650005
申请日：2024-04-29
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Hsin-Ning Liu , Jun-Rui Huang , Pei-Wei Wang , Ching Sheng Chen , Shih-Lian Cheng
CPC classification number: H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49822 , H05K1/0222 , H05K3/0094 , H05K3/429 , H05K3/4614 , H05K3/4623 , H01L24/16 , H01L2224/16227 , H05K2201/09509 , H05K2201/0959
Abstract: A manufacturing method of the circuit board includes the following steps. A metal layer, a first substrate, a second substrate, and a third substrate are laminated. Multiple blind holes and a through hole are formed. A conductive material layer is formed, which covers the metal layer, the conductive layer of the third substrate, and an inner wall of the through hole, and fills the blind holes to define multiple conductive holes. The conductive material layer, the metal layer, and the conductive layer are patterned to form a first external circuit layer located on the first substrate and electrically connected to the conductive pillars, and a second external circuit layer located on the insulating layer and electrically connected to the conductive holes, and define a conductive through hole structure connecting the first external circuit layer and the second external circuit layer and located in the through hole.
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公开(公告)号：US11641720B2
公开(公告)日：2023-05-02
申请号：US17224078
申请日：2021-04-06
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Shao-Chien Lee , Ra-Min Tain , Chi-Chun Po , Po-Hsiang Wang , Pei-Chang Huang , Chin-Min Hu
Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.
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公开(公告)号：US10854803B2
公开(公告)日：2020-12-01
申请号：US16842716
申请日：2020-04-07
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Cheng-Ta Ko , Yu-Hua Chen , De-Shiang Liu , Tzyy-Jang Tseng
IPC: H01L33/62
Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.
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公开(公告)号：US10651358B2
公开(公告)日：2020-05-12
申请号：US16140563
申请日：2018-09-25
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Cheng-Ta Ko , Yu-Hua Chen , De-Shiang Liu , Tzyy-Jang Tseng
IPC: H01L33/62
Abstract: A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.
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Patent Agency Ranking
公开(公告)号：US20220095464A1
公开(公告)日：2022-03-24
申请号：US17224078
申请日：2021-04-06
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Shao-Chien Lee , Ra-Min Tain , Chi-Chun Po , Po-Hsiang Wang , Pei-Chang Huang , Chin-Min Hu
Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.
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公开(公告)号：US11145610B2
公开(公告)日：2021-10-12
申请号：US16729488
申请日：2019-12-30
Applicant: Unimicron Technology Corp.
Inventor： John Hon-Shing Lau , Yu-Chi Shen , Tzyy-Jang Tseng , Chen-Hua Cheng , Pei-Wei Wang
Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.
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公开(公告)号：US12057381B2
公开(公告)日：2024-08-06
申请号：US17498757
申请日：2021-10-12
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Hsin-Ning Liu , Jun-Rui Huang , Pei-Wei Wang , Ching Sheng Chen , Shih-Lian Cheng
CPC classification number: H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49822 , H05K1/0222 , H05K3/0094 , H05K3/429 , H05K3/4614 , H05K3/4623 , H01L24/16 , H01L2224/16227 , H05K2201/09509 , H05K2201/0959
Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.
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公开(公告)号：US11545412B2
公开(公告)日：2023-01-03
申请号：US16952080
申请日：2020-11-19
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Ching Sheng Chen , Ra-Min Tain , Ming-Hao Wu , Hsuan-Wei Chen
IPC: H01L21/48 , H01L23/373 , H01L23/498
Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.
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公开(公告)号：US20220230949A1
公开(公告)日：2022-07-21
申请号：US17498757
申请日：2021-10-12
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Hsin-Ning Liu , Jun-Rui Huang , Pei-Wei Wang , Ching Sheng Chen , Shih-Lian Cheng
Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.
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