公开(公告)号：US20210102067A1

公开(公告)日：2021-04-08

申请号：US17121616

申请日：2020-12-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： SZU-HSIANG SU ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  MING-JAAN HO

IPC: C08L79/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03 ,  C08L51/08

Abstract: A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

公开(公告)号：US20190359852A1

公开(公告)日：2019-11-28

申请号：US16533932

申请日：2019-08-07

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  NAN-KUN HUANG ,  YU-WEN KAO ,  CHIA-YIN TENG ,  CHING-HSUAN LIN

IPC: C09D179/08 ,  C08G73/10 ,  C08L63/00

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

公开(公告)号：US20180201805A1

公开(公告)日：2018-07-19

申请号：US15689166

申请日：2017-08-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO ,  MAO-FENG HSU ,  SHOU-JUI HSIANG ,  NAN-KUN HUANG ,  YU-WEN KAO ,  CHIA-YIN TENG ,  CHING-HSUAN LIN

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

CPC classification number: C09D179/08 ,  C08G73/101 ,  C08G73/1028 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08L63/00 ,  C08L2203/202 ,  C08K7/22

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

公开(公告)号：US20140158407A1

公开(公告)日：2014-06-12

申请号：US14078544

申请日：2013-11-13

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： MING-JAAN HO

IPC: H05K1/02

CPC classification number: H05K1/118 ,  H05K1/0393 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0373 ,  H05K2201/09681

Abstract: A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and includes two conductive pads and a grid-shaped conductive trace pattern. the grid-shaped conductive trace pattern includes a plurality of conductive traces, the conductive traces form a plurality of strips connected one by one, each strip includes a plurality of triangles arranged in a line, each two adjacent triangles in a same strip have a same side, each two adjacent triangles in different strips have a same side, two distal ends of each strip are connected to the two conductive pads respectively. The transparent cover layer s the grid-shaped conductive trace pattern and parts of the first surface without forming the conductive trace layer.

Abstract translation: 印刷电路板包括透明基层，导电迹线层和透明覆盖层。 所述导电迹线层形成在所述基底层的第一表面上，并且包括两个导电焊盘和格栅状导电迹线图案。 栅状导电迹线图形包括多个导电迹线，导电迹线形成多个连接的条带，每个条带包括排成一行的多个三角形，同一条带中的每个相邻的三角形具有相同的 侧，不同条带中的每两个相邻的三角形具有相同的侧面，每个条带的两个远端分别连接到两个导电焊盘。 透明覆盖层是栅格状导电迹线图案和第一表面的部分，而不形成导电迹线层。

公开(公告)号：US20130284692A1

公开(公告)日：2013-10-31

申请号：US13757857

申请日：2013-02-04

Applicant: ZHEN DING TECHNOLOGY CO., LTD.

Inventor： MING-JAAN HO

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4626 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2804

Abstract: A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 4,4′-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board.

Abstract translation: 在铜箔上制造树脂涂层的方法包括以下步骤。 首先，将2-二[4-（4-氨基苯氧基）苯基]丙烷和4,4'-氧联二苯胺的二胺和均苯四甲酸二二异氰酸酯和氧联二邻苯二甲酸酐的两种酸酐加入极性非质子溶剂中，溶剂为 搅拌形成混合溶液。 其次，将混合溶液加热至约170℃-190℃的温度，以便在两种二胺和两种酸酐之间完成交联反应，由此形成热塑性聚酰亚胺粘合剂流体。 将热塑性聚酰亚胺粘合剂流体涂覆在铜箔上并固化以在铜箔上形成热塑性聚酰亚胺粘合剂层，从而获得涂覆有树脂的铜箔。 本公开还涉及树脂涂布铜箔和制造多层电路板的方法。