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    Method for the removal of a surface layer by a laser beam
    21.
    发明授权
    Method for the removal of a surface layer by a laser beam 失效
    用激光束去除表面层的方法

    公开(公告)号：US5681395A

    公开(公告)日：1997-10-28

    申请号：US642902

    申请日：1996-05-06

    Applicant: Linus Werner

    Inventor： Linus Werner

    IPC: B05D3/06 ,  B23K26/073 ,  B23K26/40 ,  B23K26/402 ,  B08B7/00 ,  B23K26/06

    CPC classification number: B23K26/0732 ,  B05D3/06 ,  B23K26/073 ,  B23K26/40 ,  B23K26/402 ,  B23K2201/35 ,  B23K2203/42 ,  B23K2203/52

    Abstract: In a method for uniformly removing layers from a coated surface, a laser beam is used for scanning the surface along parallel scanning lines wherein the laser beam has a surface illuminating cross-section with a central area defined between parallel lines extending transverse to the scanning lines and tapered marginal end areas extending from the transverse opposite ends of the central area to a predetermined distance and the scanning line distance is so selected that the central areas of the surface illuminating cross-sections of adjacent scanning lines are spaced by the predetermined distance and the tapered marginal end areas of the beam overlap between the scanning lines and together provide, in the overlap area, for essentially the same laser beam exposure as in the central area.

    Abstract translation: 在用于从涂覆表面均匀地去除层的方法中，使用激光束沿着平行扫描线扫描表面，其中激光束具有照射横截面的表面，中心区域限定在横向于扫描线的平行线之间 以及从中心区域的横向相对端延伸到预定距离的锥形边缘端部区域，并且扫描线距离被选择成使得照射相邻扫描线的横截面的表面的中心区域间隔开预定距离，并且 扫描线之间的光束重叠的锥形边缘端部区域一起在重叠区域中提供与中央区域基本相同的激光束曝光。

    Method for manufacturing an ink jet head in which droplets of conductive ink are expelled
    22.
    发明授权
    Method for manufacturing an ink jet head in which droplets of conductive ink are expelled 失效
    制造喷墨头的方法，其中导电油墨的液滴被排出

    公开(公告)号：US5455998A

    公开(公告)日：1995-10-10

    申请号：US981735

    申请日：1992-11-25

    Applicant: Yutaka Miyazono ,  Mitsuhide Matsuda ,  Hideaki Horio ,  Kazumi Ohtsubo ,  Takumi Inoue

    Inventor： Yutaka Miyazono ,  Mitsuhide Matsuda ,  Hideaki Horio ,  Kazumi Ohtsubo ,  Takumi Inoue

    IPC: B41J2/135 ,  B23K26/38 ,  B23K26/40 ,  B41J2/14 ,  B41J2/16 ,  H05B3/00 ,  G01D15/16

    CPC classification number: B41J2/1643 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B41J2/14096 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B23K2201/35 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  Y10T29/49083 ,  Y10T29/49401

    Abstract: A method for manufacturing an ink jet head which involves the steps of casting a first synthetic film on a metal film, etching the conductive metal to produce a pair of etched electrodes facing each other across an opening according to lithography and etching techniques, casting a second synthetic resin film being transparent on the etched electrodes and the first synthetic resin film, ablating both the first and second synthetic resin films with an excimer laser without damaging the electrodes to form both an expelling nozzle which penetrates the second synthetic resin film and an ink passageway which penetrates the first synthetic resin film through the opening, attaching an ink holding cap to the first synthetic resin film to hold conductive ink in a hollow portion thereof, and electrically connecting the etched electrodes with a voltage generator through electrical leads for applying a voltage generated in the voltage generator to the etched electrodes, wherein the etched electrodes project into the expelling nozzle. The conductive ink held in the ink holding cap is expelled from the nozzle through the ink passageway upon vaporization.

    Abstract translation: 一种制造喷墨头的方法，包括以下步骤：在金属膜上铸造第一合成膜，蚀刻导电金属，以根据光刻和蚀刻技术产生一对沿着开口面对的蚀刻电极，铸造第二合金膜 合成树脂膜在蚀刻电极和第一合成树脂膜上是透明的，用准分子激光器切割第一和第二合成树脂膜，而不损坏电极，以形成穿透第二合成树脂膜的排出喷嘴和油墨通道 其通过开口穿透第一合成树脂膜，将墨保持帽附接到第一合成树脂膜，以将导电油墨保持在其中空部分中，并且通过电引线将蚀刻的电极与电压发生器电连接，用于施加产生的电压 在电压发生器中到蚀刻电极，其中蚀刻电极 s进入排水喷嘴。 保持在墨水保持盖中的导电油墨在蒸发时通过墨水通道从喷嘴排出。

    Method of and apparatus for perforating printed circuit board
    24.
    发明授权
    Method of and apparatus for perforating printed circuit board 失效
    印刷电路板穿孔方法和装置

    公开(公告)号：US5010232A

    公开(公告)日：1991-04-23

    申请号：US468914

    申请日：1990-01-23

    Applicant: Kunio Arai ,  Yasuhiko Kanaya

    Inventor： Kunio Arai ,  Yasuhiko Kanaya

    IPC: B23B41/00 ,  B23K26/00 ,  B23K26/38 ,  B23P23/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

    CPC classification number: B23K26/0093 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  B23P23/00 ,  H05K3/0035 ,  H05K3/0047 ,  B23K2201/35 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  H05K1/0366 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2203/0207 ,  H05K2203/0554 ,  H05K3/0044 ,  H05K3/4652

    Abstract: A method of perforating a printed circuit board having a copper foil layer on one side thereof, at least one intermediate resin layer and a layer on the other side thereof, so as to form a connection hole for providing an electrical connection between the copper foil layer and the layer on the other side of the printed circuit board. The method employs a printed circuit board perforation apparatus which has a laser processing head capable of processing the printed circuit board by means of a laser beam and a drill head capable of driling the printed circuit board. After the apparatus is suitably located with respect to the printed circuit board, the drilling head operates to conduct drilling into the resin layer through the copper foil layer by the drilling head so as to form a pilot hole. Then, the pilot hole is located with respect to the laser processing head and the laser processing head operates to irradiate a laser beam to the portion of the resin layer remaining at the bottom of the pilot hole so as to remove the resin, thereby forming the connection hole reaching the layer on the other side of the printed circuit board. An apparatus for carrying out this method is also disclosed.

    Abstract translation: 一种在其一面上具有铜箔层的印刷电路板穿孔的方法，至少一个中间树脂层和另一侧的层，以形成用于在铜箔层之间提供电连接的连接孔 和印刷电路板另一侧的层。 该方法采用印刷电路板穿孔装置，其具有能够通过激光束处理印刷电路板的激光加工头和能够打印印刷电路板的钻头。 在装置相对于印刷电路板适当定位之后，钻头操作以通过钻头通过铜箔层进行树脂层的钻孔，从而形成引导孔。 然后，引导孔相对于激光加工头定位，激光加工头操作以将激光束照射到残留在导孔的底部的树脂层的部分，以除去树脂，从而形成 连接孔到达印刷电路板另一侧的层。 还公开了一种用于执行该方法的装置。

    Method for laser-induced removal of a surface coating
    25.
    发明授权
    Method for laser-induced removal of a surface coating 失效
    激光去除表面涂层的方法

    公开(公告)号：US4671848A

    公开(公告)日：1987-06-09

    申请号：US682710

    申请日：1984-12-17

    Applicant: Richard T. Miller ,  Yefim P. Sukhman

    Inventor： Richard T. Miller ,  Yefim P. Sukhman

    IPC: B01J19/12 ,  B23K26/40 ,  H02G1/12 ,  B44C1/22 ,  B23K26/00

    CPC classification number: H02G1/128 ,  B01J19/121 ,  B23K26/40 ,  B23K26/402 ,  B23K2201/35 ,  B23K2203/42 ,  B23K2203/52

    Abstract: In order to remove a dielectric coating from a conducting material, a high energy radiation source, such as a laser source, is focused in a region having a predefined relationship with the coating of the conducting material. The focused radiation results in a plasma or ionized region being formed. The coating in the vicinity of the plasma region is removed. The region of the focusing of the radiation is varied spatially to remove the dielectric coating in a pre-selected region of the conducting material. According to one embodiment, the radiation is focused in a region spatially removed from the conducting material in order that the direct radiation does not directly impact the conducting material.

    Abstract translation: 为了从导电材料去除电介质涂层，诸如激光源的高能量辐射源被聚焦在与导电材料的涂层具有预定关系的区域中。 聚焦辐射导致形成等离子体或电离区域。 除去等离子体区域附近的涂层。 辐射聚焦的区域在空间上变化以去除导电材料的预选区域中的电介质涂层。 根据一个实施例，辐射被聚焦在从导电材料空间上去除的区域中，以便直接辐射不直接影响导电材料。

    Method of welding galvanized steel
    28.
    发明授权
    Method of welding galvanized steel 失效
    镀锌钢焊接方法

    公开(公告)号：US3881084A

    公开(公告)日：1975-04-29

    申请号：US40359073

    申请日：1973-10-04

    Applicant: FORD MOTOR CO

    Inventor： BAARDSEN EDWARD LUND

    IPC: B23K15/00 ,  B23K26/00 ,  B23K26/32 ,  B23K27/00

    CPC classification number: B23K26/32 ,  B23K15/0093 ,  B23K2201/34 ,  B23K2201/35 ,  B23K2203/04 ,  B23K2203/08 ,  B23K2203/50 ,  Y10T29/49885

    Abstract: A method of welding galvanized steel with a high energy density beam is disclosed. The high energy density can be created by an electron or laser beam with a power density of at least 4 X 106 watts per square inch. A flux material, such as iron oxide, is disposed adjacent the welding zone, preferably by painting thereon, which is effective to from a compound with the zinc of the galvanized steel upon heating. The compound has a vapor pressure substantially the same or lower than the vapor pressure of the steel substrate so that disruption of the weld puddle is prevented to insure that all of the weld puddle will be available to properly close the weld void.

    Abstract translation: 公开了一种以高能量密度束焊接镀锌钢的方法。 高能量密度可以通过功率密度至少为4×10 6瓦每平方英寸的电子或激光束产生。 助焊剂材料，例如氧化铁，被设置在焊接区附近，优选通过在其上喷涂，这在加热时可以与镀锌钢的锌化合物有效。 该化合物的蒸汽压基本上等于或低于钢基材的蒸汽压力，从而防止焊接熔池的破裂，以确保所有焊接熔池都可用于适当地封闭焊缝空隙。

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