Abstract:
One object of the present invention is to provide a pattern transferring mold which can provide a starting area of mold release easily and certainly and a pattern transferring apparatus with the same. A pattern transferring mold is disclosed which is used in a pattern transferring apparatus that brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed on the mold onto the photo-curing resin. The mold comprises a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area. The mold has a mold-releasing shape in the second area, the mold-releasing shape providing a starting area of mold release from the cured photo-curing resin.
Abstract:
One object of the present invention is to provide a pattern transferring mold which can provide a starting area of mold release easily and certainly and a pattern transferring apparatus with the same. A pattern transferring mold is disclosed which is used in a pattern transferring apparatus that brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed on the mold onto the photo-curing resin. The mold comprises a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area. The mold has a mold-releasing shape in the second area, the mold-releasing shape providing a starting area of mold release from the cured photo-curing resin.
Abstract:
A method for fabricating optical MEMS (optical Micro-Electro-Mechanical Systems or Micro-Opto-Electro-Mechanical Systems (MOEMS)) is described. The basic process involves deposition and patterning of a sacrificial spacer layer and a combined moulding and photolithography step. The method described allows the fabrication of micromechanical elements incorporating micro-optical structures such as lenses (diffractive or refractive), gratings (for polarisers or resonant filters), waveguides or other micro-optical relief structures fabricated by UV-curing replication processes.
Abstract:
A multilayer resist structure is irradiated more than one time with ultraviolet rays through a photomask. Each time the structure is irradiated, ultraviolet rays of a little greater quantity of light than those used in the last irradiation are used. Also, with each exposure, a photomask which has a larger lightproof section than that used in the last irradiation is used. Next, the multilayer resist structure is developed, and the exposed area of each photoresist is removed with a developing solution. Also, in amorphous silicon layers, the areas under the removed photoresist are easily removed with the developing solution. A resist structure having desired steps is thus completed. Using the resist structure, a three-dimensional microstructure can be formed.
Abstract:
A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%.
Abstract:
A method of fine-pattern formation in which in forming a pattern, a fine pattern formed in a mold can be transferred to a patterning material in a short time at a low temperature and low pressure and, after the transfer of the fine pattern to the patterning material, the fine pattern formed in the patterning material does not readily deform. The method for fine-pattern formation comprises: a first step in which a mold having a fine structure with recesses/protrusions is pressed against a patterning material comprising a polysilane; a second step in which the patterning material is irradiated with ultraviolet to photooxidize the patterning material; a third step in which the pressing of the mold against the patterning material is relieved and the mold is drawn from the patterning material; and a fourth step in which that surface of the patterning material to which the fine pattern has been transferred is irradiated with an oxygen plasma to oxidize the surface.
Abstract:
The present invention relates to a method for manufacturing a stamp for plasmonic nano-lithography. The method for manufacturing a stamp for plasmonic nano-lithography comprises: a metal pattern formation step which forms metal patterns on a substrate; a hydrophobic treatment step which coats the outer surface of the substrate and the metal patterns with hydrophobic thin films for hydrophobic treatment; a hydrophilic treatment step which selectively conducts hydrophilic treatment on the outer surface of the metal patterns; a buffer layer lamination step which laminates the buffer layer on the substrate and the metal patterns; and a combination step which transfers the metal patterns and the buffer layer from the substrate to a light permeable base side. The present invention provides the method for manufacturing the stamp for plasmonic nano-lithography and the apparatus for plasmonic nano-lithography which can overcome limitation of light diffraction using surface plasmon energy and form micropatterns. [Reference numerals] (AA) Start; (BB) End; (S105) Pretreatment step; (S110,S210) Metal pattern formation step; (S120) Hydrophobic treatment step; (S130) Hydrophilic treatment step; (S131) Polymer layer lamination step; (S132) First lamination step; (S133) Plasma treatment step; (S134) Second lamination step; (S135) First removal step; (S136) Selective treatment step; (S137) Second removal step; (S140) Buffer layer lamination step; (S150) Combination step; (S160) Anti-sticking layer lamination step
Abstract:
A method of fine-pattern formation in which in forming a pattern, a fine pattern formed in a mold can be transferred to a pattering material in a short time at a low temperature and low pressure and, after the transfer of the fine pattern to the patterning material, the fine pattern formed in the patterning material does not readily deform. The method for fine-pattern formation comprises: a first step in which a mold having a fine structure with recesses/protrusions is pressed against a pattering material comprising a polysilane; a second step in which the patterning material is irradiated with ultraviolet to photooxidize the patterning material; a third in which the pressing of the mold against the patterning material is relieved and the mold is drawn from the pattering material; and a fourth step in which that surface of the patterning material to which the fine pattern has been transferred is irradiated with an oxygen plasma to oxidize the surface.