公开(公告)号：US20220299889A1

公开(公告)日：2022-09-22

申请号：US17636765

申请日：2020-07-24

Applicant: ASML Netherlands B.V.

Inventor： Thijs Adriaan Cornelis VAN KEULEN ,  Hendrikus COX ,  Ramidin Izair KAMIDI ,  Willem Herman Gertruda Anna KOENEN

IPC: G03F7/20 ,  G03F9/00 ,  H01L21/68

Abstract: A method of determining a desired relative position between a first object of a lithographic apparatus and a second object of the lithographic apparatus. Generating a measurement signal representing a position of the first object relative to the second object, at an initial relative position. Determining a gradient associated with the initial relative position, based on the measurement signal. Determining a position set point based on the gradient and wherein the position set point comprises a three-dimensional dither signal. Controlling the position of the first object relative to the second object to a further relative position, based on the position set point.

公开(公告)号：US20220299881A1

公开(公告)日：2022-09-22

申请号：US17636103

申请日：2020-08-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Yunan ZHENG ,  Yongfa FAN ,  Mu FENG ,  Leiwu ZHENG ,  Jen-Shiang WANG ,  Ya LUO ,  Chenji ZHANG ,  Jun CHEN ,  Zhenyu HOU ,  Jinze WANG ,  Feng CHEN ,  Ziyang MA ,  Xin GUO ,  Jin CHENG

IPC: G03F7/20

Abstract: A method for generating modified contours and/or generating metrology gauges based on the modified contours. A method of generating metrology gauges for measuring a physical characteristic of a structure on a substrate includes obtaining (i) measured data associated with the physical characteristic of the structure printed on the substrate, and (ii) at least portion of a simulated contour of the structure, the at least a portion of the simulated contour being associated with the measured data; modifying, based on the measured data, the at least a portion of the simulated contour of the structure; and generating the metrology gauges on or adjacent to the modified at least a portion of the simulated contour, the metrology gauges being placed to measure the physical characteristic of the simulated contour of the structure.

公开(公告)号：US11448607B2

公开(公告)日：2022-09-20

申请号：US16470928

申请日：2017-12-04

Applicant: ASML Netherlands B.V.

Inventor： Chiyan Kuan

IPC: G01N23/225 ,  H01J37/22 ,  H01J37/30 ,  H01J37/153 ,  H01J37/21

Abstract: Systems and methods are provided for dynamically compensating position errors of a sample. The system can comprise one or more sensing units configured to generate a signal based on a position of a sample and a controller. The controller can be configured to determine the position of the sample based on the signal and in response to the determined position, provide information associated with the determined position for control of one of a first handling unit in a first chamber, a second handling unit in a second chamber, and a beam location unit in the second chamber.

公开(公告)号：US20220293389A1

公开(公告)日：2022-09-15

申请号：US17636344

申请日：2020-08-15

Applicant: ASML Netherlands B.V.

Inventor： Thomas Jarik HUISMAN ,  Shakeeb Bin HASAN

IPC: H01J37/22 ,  H01J37/28 ,  G06T5/00

Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include acquiring a scanning electron microscopy (SEM) image. The method may also include simulating diffused charge associated with a position of the SEM image. The method may further include providing an enhanced SEM image based on the SEM image and the diffused charge.

公开(公告)号：US20220291590A1

公开(公告)日：2022-09-15

申请号：US17634309

申请日：2020-07-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Jing SU ,  Yana CHENG ,  Zchenxi LIN ,  Yi ZOU ,  Ddavit HARUTYUNYAN ,  Emil Peter SCHMITT-WEAVER ,  Kaustuve BHATTACHARYYA ,  Cornelis Johannes Henricus LAMBREGTS ,  Hadi YAGUBIZADE

IPC: G03F7/20

Abstract: A method for determining a model to predict overlay data associated with a current substrate being patterned. The method involves obtaining (i) a first data set associated with one or more prior layers and/or current layer of the current substrate, (ii) a second data set including overlay metrology data associated with one or more prior substrates, and (iii) de-corrected measured overlay data associated with the current layer of the current substrate; and determining, based on (i) the first data set, (ii) the second data set, and (iii) the de-corrected measured overlay data, values of a set of model parameters associated with the model such that the model predicts overlay data for the current substrate, wherein the values are determined such that a cost function is minimized, the cost function comprising a difference between the predicted data and the de-corrected measured overlay data.

公开(公告)号：US20220290734A1

公开(公告)日：2022-09-15

申请号：US17633000

申请日：2020-07-09

Applicant: ASML Netherlands B.V.

Inventor： Jeroen Johan Maarten VAN DE WIJDEVEN ,  Johannes VERMEULEN ,  Jeroen Pieter STARREVELD ,  Stan Henricus VAN DER MEULEN

IPC: F16F15/02 ,  F16F13/00 ,  G03F7/20

Abstract: The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.

公开(公告)号：US11443915B2

公开(公告)日：2022-09-13

申请号：US16649975

申请日：2018-09-21

Applicant: ASML Netherlands B.V.

Inventor： Joe Wang ,  Chia Wen Lin ,  Zhongwei Chen ,  Chang-Chun Yeh

IPC: H01J37/28 ,  H01J37/244 ,  H01J37/22

Abstract: Disclosed herein an apparatus and a method for detecting buried features using backscattered particles. In an example, the apparatus comprises a source of charged particles; a stage; optics configured to direct a beam of the charged particles to a sample supported on the stage; a signal detector configured to detect backscattered particles of the charged particles in the beam from the sample; wherein the signal detector has angular resolution. In an example, the methods comprises obtaining an image of backscattered particles from a region of a sample; determining existence or location of a buried feature based on the image.

公开(公告)号：US11442372B2

公开(公告)日：2022-09-13

申请号：US17442951

申请日：2020-02-25

Applicant: ASML Netherlands B.V.

Inventor： Franciscus Godefridus Casper Bijnen ,  Ralph Brinkhof

IPC: G03F9/00

Abstract: The invention provides a method of measuring an alignment mark or an alignment mark assembly, wherein the alignment mark comprises grid features extending in at least two directions, the method comprising: measuring the alignment mark or alignment mark assembly using an expected location of the alignment mark or alignment mark assembly, determining a first position of the alignment mark or alignment mark assembly in a first direction, determining a second position of the alignment mark or alignment mark assembly in a second direction, wherein the second direction is perpendicular to the first direction, determining a second direction scan offset between the expected location of the alignment mark or alignment mark assembly in the second direction and the determined second position, and correcting the first position on the basis of the second direction scan offset using at least one correction data set to provide a first corrected position.

公开(公告)号：US11442369B2

公开(公告)日：2022-09-13

申请号：US16763487

申请日：2018-11-07

Applicant: ASML Netherlands B.V.

Inventor： Yang-Shan Huang ,  Pieter Cornelis Johan De Jager ,  Rob Reilink ,  Christiaan Louis Valentin ,  Jasper Leonardus Johannes Scholten ,  Antonie Hendrik Verweij ,  Edwin Van Horne

IPC: G03F7/20

Abstract: An object stage bearing system can include an object stage, a hollow shaft coupled to the object stage, and an in-vacuum gas bearing assembly coupled to the hollow shaft and the object stage. The in-vacuum gas bearing assembly can include a gas bearing, a scavenging groove, and a vacuum groove. The gas bearing is disposed along an inner wall of the in-vacuum gas bearing assembly and along an external wall of the hollow shaft. The scavenging groove is disposed along the inner wall such that the scavenging groove is isolated from the gas bearing. The vacuum groove is disposed along the inner wall such that the vacuum groove is isolated from the scavenging groove and the gas bearing.

公开(公告)号：US20220283515A1

公开(公告)日：2022-09-08

申请号：US17637156

申请日：2020-08-25

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Tamer Mohamed Tawfik Ahmed Mohamed ELAZHARY ,  Simon Reinald HUISMAN ,  Justin Lloyd KREUZER ,  Sebastianus Adrianus GOORDEN

IPC: G03F7/20

Abstract: A method of determining an overlay measurement associated with a substrate and a system to obtain an overlay measurement associated with a patterning process. A method for determining an overlay measurement may be used in a lithography patterning process. The method includes generating a diffraction signal by illuminating a first overlay pattern and a second overlay pattern using a coherent beam. The method also includes obtaining an interference pattern based on the diffraction signal. The method further includes determining an overlay measurement between the first overlay pattern and the second overlay pattern based on the interference pattern.