Abstract:
A curved multimorph actuator is provided composed of a plurality of materials, each material exhibiting different deformations in response to a stimulus, such as heat. Application of different stimuli causes the actuator to bend and/or twist. In an embodiment, the actuator is capable of rotating an object about its center without significantly shifting the center in one or more dimensions. In a further embodiment, the actuator can be used to rotate an object about a first axis and a second axis, wherein the first axis and the second axis are mutually perpendicular. In an embodiment, rotation about the first axis and the second axis are achieved in combination. In another embodiment, rotation about the first axis is produced in response to a first stimulus and rotation about the second axis is produced in response to a second stimulus.
Abstract:
A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.
Abstract:
A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.
Abstract:
A micro or nano electromechanical transducer device (200) formed on a semiconductor substrate (210) comprises a movable structure (203) which is arranged to be movable in response to actuation of an actuating structure. First (206) and second (207) compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer (202) of the actuating structure such that movement of the movable structure (203) is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer (202) of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device (200) is in an inactive state.
Abstract:
The invention relates to a method for producing a micromechanical component (10), encompassing the following steps: a first electrode unit (14) is formed in a first position relative to a bottom substrate (16); a supporting element (22) is formed which comprises a first subunit (23, 28, 30) having a first internal stress and a second subunit (23, 28, 30) having a second internal stress that differs from the first internal stress, said supporting element (22) being fastened to the first electrode unit (14) at a first end while being fastened to the bottom substrate (16) at a second end; and the supporting element (22) is bent as a result of the difference between the first internal stress and the second internal stress, the bending action causing the first electrode unit (14) to be moved from the first position relative to the bottom substrate (16) into a second position relative to the bottom substrate (16). The invention further relates to a micromechanical component (10).
Abstract:
A method of forming a suspended beam in a MEMS process is disclosed. In the process a pit (8) is etched into a substrate (5). Sacrificial material (10) is deposited in the pit (8) and on the surrounding substrate surface. The sacrificial material (10) is then removed from the surrounding substrate surface and from the periphery of the pit (8) so that there is a gap between the sacrificial material and at least two sidewalls of the pit. The sacrificial material is then heated so that it reftows such that the remaining sacrificial material contacts the sidewalls of the pit. Material for the beam (12), which is typically a metal, is then deposited on the substrate surface and the reflowed sacrificial material, and the sacrificial material is then removed to form the suspended beam. The beam could be used as the heating element in an inkjet printer.
Abstract:
Auf einem Substrat (1) ist eine Epitaxieschicht (3, 5) mit nebeneinander aufgewachsenem mono- und polykristallinen Silizium abgeschieden, wobei durch Ätzung ein Bereich (5, 6) als vertikal auslenkbare polykristalline Membran, insbesondere für einen Drucksensor, freigelegt ist. Die Poly/Mono Übergangsbereiche zu beiden Seiten der Membran weisen jeweils ein schräges Profil auf, derart, dass sich das monokristalline Silizium in Form eines Überhangs (6) oberhalb des polykristallinen Siliziums in den Membran-Bereich (5, 6) hinein erstreckt. Im Überhang (6) sind Piezoelemente (10) implantiert.