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公开(公告)号：US20150318614A1
公开(公告)日：2015-11-05
申请号：US14798488
申请日：2015-07-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Jun SASAKI
CPC classification number: H01Q7/06 , H01L23/5387 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/3011 , H01Q1/20 , H01Q1/38 , H01Q7/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/0281 , H05K1/165 , H05K1/189 , H05K3/4632 , H05K2201/05 , H05K2201/09336 , H05K2201/10098 , H05K2201/10189 , H01L2924/00
Abstract: A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.
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公开(公告)号：US09178295B1
公开(公告)日：2015-11-03
申请号：US14515209
申请日：2014-10-15
Applicant: DELTA ELECTRONICS, INC.
Inventor： Yu-Liang Lin , Wen-Ping Teng , Jie Li , Guang Yang , Wen-Yi Chien
CPC classification number: H01R12/62 , H01R4/02 , H01R12/51 , H05K1/0298 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/115 , H05K1/117 , H05K1/118 , H05K3/363 , H05K2201/0154 , H05K2201/0338 , H05K2201/05 , H05K2201/09027 , H05K2201/09572
Abstract: The present invention provides a flexible printed circuit board having gold fingers, comprising a base sheet, a metallic layer and a protective sheet. The base sheet has a plurality of voids thereon. The metallic layer is provided on the base sheet, and has at least one plated through hole. The protective sheet is provided on the base sheet and the metallic layer to expose a portion of the metallic layer and the plated through hole. The flexible printed circuit board may electrically be connected to a conductive terminal of a rigid printed circuit board with one gold finger and electrically be connected to a system with another gold finger. The plated through hole has a function of heat conduction and soldering, and the voids of the flexible printed circuit board can provide a space for overflowing solder and heat dissipation.
Abstract translation: 本发明提供一种具有金指的柔性印刷电路板，包括基片，金属层和保护片。 基片在其上具有多个空隙。 金属层设置在基片上，并且具有至少一个电镀通孔。 保护片设置在基片和金属层上，以露出金属层和电镀通孔的一部分。 柔性印刷电路板可以用一个金手指电连接到刚性印刷电路板的导电端子，并用另一个金手指连接到系统。 电镀通孔具有导热和焊接的功能，并且柔性印刷电路板的空隙可以提供溢出焊料和散热的空间。
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公开(公告)号：US09147089B2
公开(公告)日：2015-09-29
申请号：US14563124
申请日：2014-12-08
Applicant: Nobuo Takahashi
Inventor： Nobuo Takahashi
CPC classification number: G06F21/86 , G01R19/00 , G06F21/82 , H05K1/0268 , H05K1/0275 , H05K1/0298 , H05K1/118 , H05K2201/05 , H05K2201/09236
Abstract: It is an object of this invention to provide an FPC capable of improving tamper resistance. An FPC (1) of this invention includes: a signal line pattern (2) for inputting a communication signal; and signal protective line patterns (3, 4) provided to be opposed to an upper surface and a lower surface of the signal line pattern and having the same width as a width of the signal line pattern (2) or a larger width than the width of the signal line pattern (2). The signal protective line patterns are provided along the signal line pattern within a region that requires tamper resistance.
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334.发明申请公开(公告)号：US20150156879A1
公开(公告)日：2015-06-04
申请号：US14539035
申请日：2014-11-12
Applicant: ZODIAC AERO ELECfRIC
Inventor： Vianney Pouget , Antonio Simao
CPC classification number: H05K1/148 , H05K1/028 , H05K1/11 , H05K1/189 , H05K3/361 , H05K2201/047 , H05K2201/05 , H05K2201/058 , H05K2201/10106 , H05K2201/10151
Abstract: This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.
Abstract translation: 该电子电路包括一组旨在支撑部件并通过连接元件连接在一起的电子板。 连接元件包括连接并排运行的两个电子板的两个相对端的弯曲柔性印刷电路，所述弯曲的柔性印刷电路可折叠，用于将电子电路竖立成体积，使得电子电路包括彼此相对放置的电子板。
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公开(公告)号：US20150084822A1
公开(公告)日：2015-03-26
申请号：US14557609
申请日：2014-12-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Jun SASAKI
CPC classification number: H01Q7/06 , H01L23/5387 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/3011 , H01Q1/20 , H01Q1/38 , H01Q7/00 , H05K1/0233 , H05K1/0243 , H05K1/025 , H05K1/0281 , H05K1/165 , H05K1/189 , H05K3/4632 , H05K2201/05 , H05K2201/09336 , H05K2201/10098 , H05K2201/10189 , H01L2924/00
Abstract: A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.
Abstract translation: 电路板和电路模块更准确地提供天线线圈和与天线线圈电连接的电子部件之间的阻抗匹配，并且包括板主体，其包括由柔性材料制成的板部分和多个层叠绝缘材料层。 天线线圈包括设置在板部分中的线圈导体。 配线导体设置在电路板部分中并电连接到天线线圈。 板部分具有不如板部分变形的结构。 电连接到布线导体的集成电路安装在基板部分上。
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Patent Agency Ranking
336.发明申请CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD 审中-公开可固化树脂组合物，其固化产品，印刷电路板和印刷电路板的树脂组合物公开(公告)号：US20150072583A1
公开(公告)日：2015-03-12
申请号：US14389024
申请日：2013-02-20
Applicant: DIC Corporation
Inventor： Yoshiaki Murata , Takamitsu Nakamura , Koji Hayashi
CPC classification number: C08L63/04 , C08G59/621 , C08L61/14 , C08L2201/02 , C08L2201/08 , C08L2203/20 , H05K1/0326 , H05K1/0366 , H05K2201/029 , H05K2201/05 , Y10T442/2672
Abstract: In the fields of printed wiring boards and circuit boards, a good glass cloth-penetrating property is exhibited and prepreg appearance is excellent. A cured product thereof exhibits good heat resistance. A phenolic resin is a phosphorus-atom-containing phenolic resin that has phosphorus-atom-containing structural portions (i) represented by structural formula (Y1) or (Y2) below and alkoxymethyl groups (ii) in an aromatic nucleus of a phenolic compound: (In structural formulae (Y1) and (Y2), R1 to R4 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms). A ratio of the number of the alkoxymethyl groups (ii) relative to the total number of the phosphorus-atom-containing structural portions (i) and the alkoxymethyl groups (ii) is 5 to 20%.
Abstract translation: 在印刷线路板和电路板领域中，展现了良好的玻璃布穿透性，预浸料外观优异。 其固化产物具有良好的耐热性。 酚醛树脂是含有磷原子的酚醛树脂，其具有由以下结构式（Y1）或（Y2）表示的含磷原子的结构部分（i）和在酚化合物的芳香核中的烷氧基甲基（ii） ：（结构式（Y1）和（Y2）中，R 1〜R 4各自独立地表示氢原子或碳原子数1〜4的烷基）。 烷氧基甲基（ii）的数量相对于含磷原子的结构部分（i）和烷氧基甲基（ii）的总数的比例为5〜20％。
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公开(公告)号：US08977868B2
公开(公告)日：2015-03-10
申请号：US14127821
申请日：2012-03-16
Applicant: Nubuo Takahashi
Inventor： Nubuo Takahashi
CPC classification number: G06F21/86 , G01R19/00 , G06F21/82 , H05K1/0268 , H05K1/0275 , H05K1/0298 , H05K1/118 , H05K2201/05 , H05K2201/09236
Abstract: It is an object of this invention to provide an FPC capable of improving tamper resistance. An FPC (1) of this invention includes: a signal line pattern (2) for inputting a communication signal; and signal protective line patterns (3, 4) provided to be opposed to an upper surface and a lower surface of the signal line pattern and having the same width as a width of the signal line pattern (2) or a larger width than the width of the signal line pattern (2). The signal protective line patterns are provided along the signal line pattern within a region that requires tamper resistance.
Abstract translation: 本发明的目的是提供一种能够提高防篡改性的FPC。 本发明的FPC（1）包括：用于输入通信信号的信号线图形（2）; 以及设置成与信号线图案的上表面和下表面相对并且具有与信号线图案（2）的宽度相同的宽度或宽度大于宽度的信号保护线图案（3,4） 的信号线图案（2）。 信号保护线图案沿着需要防篡改的区域内的信号线图形提供。
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338.发明申请公开(公告)号：US20150021069A1
公开(公告)日：2015-01-22
申请号：US14058504
申请日：2013-10-21
Applicant: ICHIA TECHNOLOGIES,INC.
Inventor： CHIEN-HWA CHIU , Chih-Min Chao , Peir-Rong Kuo , Chia-Hua Chiang , Chih-Cheng Hsiao , Feng-Ping Kuan , Ying-Wei Lee , Wei-Cheng Lee
CPC classification number: H05K1/115 , C23C18/16 , C23C28/021 , C23C28/023 , C23C28/32 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/118 , H05K3/06 , H05K3/181 , H05K3/188 , H05K3/381 , H05K3/426 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/05 , Y10T29/49124 , Y10T29/49155
Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
Abstract translation: 制造印刷电路板前体的方法包括提供基板的步骤。 然后催化底物的表面形成催化剂层。 随后，形成导电层并附着到催化层的表面。 最后，将金属层电镀在导电层上。 印刷电路板前体包括具有表面的基板。 具体地，表面被催化处理以形成催化层。 前体还包括附着到覆盖催化剂层的导电层和设置在导电层上的金属层。
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公开(公告)号：US20140218873A1
公开(公告)日：2014-08-07
申请号：US14166277
申请日：2014-01-28
Applicant: MOTOROLA MOBILITY LLC
Inventor： XiaoPing Bai , John W. Kaehler , Weihong Zhang , Zhiming Zhuang
IPC: H05K1/11
CPC classification number: H05K1/118 , H01L27/3276 , H01L27/3288 , H01L27/3297 , H01L51/524 , H05K2201/05
Abstract: A display includes an encapsulation layer and a substrate. The substrate includes a chip on glass (COG) seat and a flexible printed circuit (FPC) connector seat. The COG seat and the FPC seats are positioned on different edges of the substrate. A cross-connection layer between the substrate layer and the encapsulation layer, the cross-connection layer including traces connected between the COG seat and the FPC seat. A device incorporating the display may take advantage of the symmetrical display to achieve new designs.
Abstract translation: 显示器包括封装层和衬底。 衬底包括玻璃上的芯片（COG）座和柔性印刷电路（FPC）连接座。 COG座椅和FPC座椅位于基板的不同边缘上。 衬底层和封装层之间的交叉连接层，交联连接层包括连接在COG座和FPC座之间的迹线。 结合显示器的装置可以利用对称显示器来实现新的设计。
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公开(公告)号：US07631424B2
公开(公告)日：2009-12-15
申请号：US11928698
申请日：2007-10-30
Applicant: Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
Inventor： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
CPC classification number: A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape.The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.
Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。
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