公开(公告)号：US20160353575A1

公开(公告)日：2016-12-01

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

Abstract translation: 封装结构包括基板，传感器，基座，引线框架，导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面，并且包括接收腔，在接收腔的底表面和接合表面之间延伸的倾斜表面，以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。