公开(公告)号：JP2006257393A

公开(公告)日：2006-09-28

申请号：JP2005352173

申请日：2005-12-06

Applicant: Compal Electronics Inc ,  仁寶▼電▲腦工業股▼分▲有限公司

Inventor： LIU PO-TAU ,  LIU CHAN-MING

IPC: C09D201/00 ,  C09D5/00 ,  C09D7/12 ,  C09D183/04 ,  C09D183/06 ,  C09D183/07

CPC classification number: C09D7/65 ,  C08L83/04

Abstract: PROBLEM TO BE SOLVED: To provide a UV-curable coating material having a high surface energy and reworkability.
SOLUTION: The UV-curable coating composition containing 1-10 pts.wt photopolymerization initiator, 5-20 pts.wt organosilane compound, 5-30 pts.wt binder, 0.1-15 pts.wt catalyst and a UV-curable resin, is cured by the irradiation with a UV light and, after the curing, it has a high surface energy and can be re-worked with ease.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有高表面能和可再加工性的UV固化涂料。 解决方案：包含1-10重量份光聚合引发剂，5-20重量份有机硅烷化合物，5-30重量份粘合剂，0.1-15重量份催化剂和UV可固化的UV可固化涂料组合物 树脂通过紫外线的照射而固化，固化后具有高的表面能，可以容易地重新加工。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：DE102012218523A1

公开(公告)日：2014-02-06

申请号：DE102012218523

申请日：2012-10-11

Applicant: COMPAL ELECTRONICS INC

Inventor： WU JUNG-CHIN ,  LIN PO-AN ,  HUANG HAN-CHING ,  CHIANG CHIH-WEN ,  LIU YEN-LING

IPC: B32B5/22 ,  B32B15/00

Abstract: Eine Verbundplattenstruktur wird bereitgestellt, die eine Faserverbundlage, eine Metallschicht und eine Harzschicht beinhaltet. Die Faserverbundlage beinhaltet eine erste Faserschicht, eine Kernschicht und eine zweite Faserschicht. Die Kernschicht ist zwischen der ersten Faserschicht und der zweiten Faserschicht angeordnet. Die Metallschicht ist auf der Faserverbundlage angeordnet und weist wenigstens eine Öffnung auf. Ein Abschnitt der zweiten Faserschicht befindet sich in der Öffnung. Die Harzschicht ist auf der Metallschicht angeordnet. Zusätzlich wird auch ein Herstellungsverfahren der Verbundplattenstruktur bereitgestellt.

公开(公告)号：GB2491467B

公开(公告)日：2013-08-14

申请号：GB201209520

申请日：2012-05-29

Applicant: COMPAL ELECTRONICS INC

Inventor： WU CHUN-LIANG ,  CHOU YING-CHI ,  PAN HUNG-SUNG ,  LU CHIH-WEI ,  CHANG LONG-CHENG ,  YU PO-CHIN ,  HSU WEI-CHIH

IPC: G06F1/16

公开(公告)号：DE102012209884A1

公开(公告)日：2012-12-20

申请号：DE102012209884

申请日：2012-06-13

Applicant: COMPAL ELECTRONICS INC

Inventor： WU JUNG-CHIN ,  LIN PO-AN ,  HUANG HAN-CHING

IPC: F16S1/04

Abstract: Ein Verfahren zur Herstellung eines dreidimensionalen Werkstücks wird bereitgestellt. In diesem Verfahren werden eine duktile Platte, eine Kernschicht und ein Prepreg kombiniert, um eine Sandwichstruktur zu bilden. Die Kernschicht befindet sich zwischen der duktilen Platte und dem Prepreg. Die Sandwichstruktur wird ausgeformt, um die dreidimensionale Sandwichstruktur zu sein. Die dreidimensionale Sandwichstruktur wird erhitzt, um das Prepreg zu härten.

公开(公告)号：GB2484394A

公开(公告)日：2012-04-11

申请号：GB201117083

申请日：2011-10-05

Applicant: COMPAL ELECTRONICS INC

Inventor： CHEN SHI-KUAN ,  MEDICA JOHN ,  TSAI LEONARD

IPC: G06F1/16

Abstract: A portable personal electronic device 20, such as a notebook or netbook computer or a smartphone, can be connected to a slave device 22 with an enhanced user interface. The processor in the master device controls the slave via an electrical interface. When the master device detects that the slave device has been connected, it uses the user interface on the slave device. An adapter 24 may be used to match the shape of the master device to the shape of a docking bay in the slave device. The adapter may also provide the electrical connection between the master and slave. The connection may be a combination of HDMI and USB interfaces. Multiple adapters may be used to connect different master devices to the same slave device. The master and slave devices may both have batteries. The connected devices may be charged based on the charge levels in the devices.

公开(公告)号：GB2467387B

公开(公告)日：2010-12-29

申请号：GB0908622

申请日：2009-05-19

Applicant: COMPAL ELECTRONICS INC

Inventor： SHEN WEI-HSIANG

IPC: H04N5/262

公开(公告)号：DE102009005001A1

公开(公告)日：2010-01-14

申请号：DE102009005001

申请日：2009-01-09

Applicant: COMPAL ELECTRONICS INC

Inventor： WU FAY

IPC: H04W92/08 ,  G06F3/01 ,  H04M1/00

Abstract: A method for operating a map-based menu interface for a mobile electronic device is provided. In the present method, a map-based menu interface divided into one first type area and n second type areas is provided first, n is a positive integer. At least one function group item is comprised in the first type area, and each of the function group items corresponds to one of the second type areas. Then, a visible region only displaying the first type area is defined. After selecting one of the function group items, the visible region is moved to fully display the second type area corresponding to the selected function group item. As a result, a diverse and interesting manner to operate the menu interface is provided to increase the user experience of the mobile electronic device.

公开(公告)号：GB2461353A

公开(公告)日：2010-01-06

申请号：GB0900207

申请日：2009-01-07

Applicant: COMPAL ELECTRONICS INC

Inventor： WU FAY

IPC: H04M1/247 ,  G06F3/048 ,  H04M1/725

Abstract: A method for operating a map-based menu interface (200) for a mobile electronic device is provided. In the present method, a map-based menu interface divided into one first type area and n second type areas is provided first, n is a positive integer. At least one function group item (210) is comprised in the first type area, and each of the function group items (211 - 218) corresponds to one of the second type areas (220 - 240). Then, a visible region only displaying the first type area is defined. After selecting one of the function group items (211 - 218), the visible region is moved to fully display the second type area corresponding to the selected function group item. As a result, a diverse and interesting manner to operate the menu interface is provided to increase the user experience of the mobile electronic device. The function menu is designed to be a map-based menu interface having only one hierarchy, and a part of content of the map-based interface can be displayed by moving the visible region, so that the user may view each of the function groups. Repeat access of various hierarchies can be avoided.

公开(公告)号：GB0916738D0

公开(公告)日：2009-11-04

申请号：GB0916738

申请日：2009-09-23

Applicant: COMPAL ELECTRONICS INC

公开(公告)号：GB2453547A

公开(公告)日：2009-04-15

申请号：GB0719641

申请日：2007-10-08

Applicant: COMPAL ELECTRONICS INC

Inventor： CHEN YUNG-HUI ,  LIN PO-AN

IPC: H05K7/14 ,  H05K9/00

Abstract: A mounting structure for retaining a printed circuit board within a housing comprises an outer plastic cylinder 210, an inner metal cylinder 220, and a metal layer 230 covering the exposed surfaces of both cylinders. The inner metal cylinder is threaded to receive a screw to affix a printed circuit board into the housing. The plastic cylinder has a first flat 212 on the top thereof and the metal cylinder has a second flat 222 on the top thereof, the second flat being higher than the first flat relative to the top of the plastic cylinder. When a PCB is fixed to the mounting structure, a grounding portion of the PCB contacts the metal flat 222 rather than the plastic flat 212 and thus avoids damage to the metal layer 230. The metal layer, metal cylinder and PCB grounding portion connected in this way provide screening from electromagnetic interference.