公开(公告)号：WO2017206149A1

公开(公告)日：2017-12-07

申请号：PCT/CN2016/084544

申请日：2016-06-02

Applicant: GOERTEK.INC

Inventor： ZOU, Quanbo

IPC: B81B7/02 ,  B81B7/04

CPC classification number: G01P15/093 ,  B81C1/00134 ,  B81C1/00261 ,  G01P3/36

Abstract: A MEMS device (10,20,30) and an electronic apparatus (40). The MEMS device (10,20,30) comprises: a micro-LED (11,21,31), and a movable member (12,22,32), wherein the micro-LED (11,21,31) is mounted on the movable member (12,22,32) and is configured for moving with the movable member (12,22,32). The signal detection of a MEMS (10,20,30) device can be simplified and/or the contents of signals produced by the MEMS device (10,20,30) can be enriched.

Abstract translation: MEMS装置（10,20,30）和电子设备（40）。 MEMS装置（10,20,30）包括：微型LED（11,21,31）和可动构件（12,22,32），其中微型LED（11,21,31）被安装 在可移动构件（12,22,32）上并且构造成与可移动构件（12,22,32）一起移动。 可以简化MEMS（10,20,30）装置的信号检测和/或可以丰富由MEMS装置（10,20,30）产生的信号的内容。

公开(公告)号：WO2017124332A1

公开(公告)日：2017-07-27

申请号：PCT/CN2016/071474

申请日：2016-01-20

Applicant: GOERTEK.INC

Inventor： ZOU, Quanbo

IPC: H01L33/00 ,  G09F9/30 ,  H01S5/343

CPC classification number: H01L33/48

Abstract: A micro-LED(3r) transfer method and a manufacturing method are disclosed. The micro-LED(3r) transfer method comprises: forming a sacrificial post(4) on a micro-LED(3r) to be picked-up on a carrier substrate(1); bonding the micro-LED(3r) to be picked-up with a pickup substrate(5) via the sacrificial post(4); lifting-off the micro-LED(3r) to be picked-up from the carrier substrate(1); bonding the micro-LED(3r) on the pickup substrate(5) with a receiving substrate(12); and lifting-off the micro-LED(3r) from the pickup substrate(5). A complicated pickup head is not necessary, and the technical solution is relatively simple.

Abstract translation: 公开了微LED（3r）转印方法和制造方法。 微LED（3r）传输方法包括：在微型LED（3r）上形成牺牲柱（4）以在载体衬底（1）上拾取; 通过牺牲柱（4）将待拾取的微型LED（3r）与拾取基板（5）键合; 抬起待从载体基板（1）拾取的微型LED（3r）; 将拾取基板（5）上的微型LED（3r）与接收基板（12）结合; 并从拾取基板（5）上提起微型LED（3r）。 复杂的拾音头不是必需的，技术解决方案相对简单。

公开(公告)号：WO2016154960A1

公开(公告)日：2016-10-06

申请号：PCT/CN2015/075650

申请日：2015-04-01

Applicant: GOERTEK.INC

Inventor： ZOU, Quanbo ,  WANG, Zhe

IPC: H01L25/16

CPC classification number: B81C1/00896 ,  B81C2201/0194 ,  B81C2203/01 ,  B81C2203/0127 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/11312 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/81

Abstract: A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.

Abstract translation: MEMS的传输方法，制造方法，器件和电子设备。 一种用于MEMS传输的方法，包括：在激光透明载体的第一表面上沉积激光吸收层; 在激光吸收层上形成MEMS结构; 将MEMS结构附接到接收器; 并从载体的侧面进行激光剥离，以移除载体。 可以以简单，低成本的方式实现高质量MEMS结构的转移。

公开(公告)号：US10533911B2

公开(公告)日：2020-01-14

申请号：US15553093

申请日：2016-11-04

Applicant: GOERTEK.INC

Inventor： Li-Te Wu ,  Ching-Tzung Lin ,  Ssu-Ying Chen

IPC: G01L19/00 ,  G01L9/00 ,  G01C5/06

Abstract: The present invention discloses a signal processing device, an air pressure sensor assembly and an electronics apparatus. The signal processing device for a sensing signal comprises: an input unit, which is configured to receive the sensing signal; and a processing unit, which is configured to attenuate a higher frequency component of the sensing signal so that the value of the higher frequency component when the sensing signal is stable is lower than that when the sensing signal is changing. According to an embodiment of this invention, the present invention can reduce the noise in a sensing signal from an air pressure sensor during a stable state.

公开(公告)号：US10433037B2

公开(公告)日：2019-10-01

申请号：US15540180

申请日：2015-12-09

Applicant: Goertek.Inc

Inventor： Zhenjun Li ,  Gang Chen ,  Yun Yang

IPC: H04R1/28 ,  H04M1/03 ,  H04R1/02

Abstract: A protective apparatus for sound-absorbing particles (4) in a sounding apparatus, comprising a housing (1) and a rear acoustic cavity formed inside the housing (1). The rear acoustic cavity is filled with sound-absorbing particles (4). A sound circulation channel (5) communicating the rear acoustic cavity with the outside is provided on the housing (1). A sound transmission layer (3) used for preventing the sound-absorbing particles (4) from being exposed covers an entrance of the sound circulation channel (5). The sound transmission layer (3) of the protective apparatus separates the sound circulation channel (5) from the rear acoustic cavity, such that airflow in the rear acoustic cavity passes through the sound transmission layer (3) and then flows out of the sound circulation channel (5). Configuration of the sound transmission layer (3) can hinder the sound-absorbing particles (4), prevent the sound-absorbing particles (4) from entering the sound circulation channel (5), and do not influence outflow of airflow. The problem in the prior art that sound-absorbing particles (4) are easily exposed or block a sound circulation channel (5) is solved, and the quality of a sounding apparatus is ensured.

公开(公告)号：US10277968B2

公开(公告)日：2019-04-30

申请号：US15521151

申请日：2015-01-05

Applicant: Goertek.Inc

Inventor： Guanxun Qiu ,  Qinglin Song

IPC: H04R25/00 ,  H04R1/08 ,  H04R19/00 ,  H04R19/04 ,  H04R1/02

Abstract: The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

公开(公告)号：US10264360B2

公开(公告)日：2019-04-16

申请号：US15551262

申请日：2015-11-26

Applicant: Goertek.Inc

Inventor： Minghui Shao ,  Jianbin Yang

IPC: H04R9/06 ,  H04R3/00 ,  H04R7/06 ,  H04R7/18 ,  H04R9/02 ,  H04R29/00 ,  H04R31/00 ,  H04R19/01

Abstract: Disclosed is a structure for detecting the vibration displacement of a speaker, including: a vibration system having a movable pole plate; a magnetic circuit system; and a fixed pole plate provided under the vibration system and opposite to the movable pole plate, the movable pole plate and the fixed pole plate constituting a capacitor. Also disclosed is an acoustoelectric inter-conversion dual-effect device, further including an impedance transformer connected to the capacitor and including a field effect transistor and a diode. In the present invention, a movable pole plate of a capacitor is provided on a vibration system and a fixed pole plate is provided under the vibration system and fixed in position. When the vibration system vibrates, the change in capacitance is detected to calculate the actual displacement of the vibration system, which can reduce the power of the speaker device when the actual displacement of the vibration system exceeds a safety threshold. For an electronic device adopting such a speaker structure, the displacement of the vibration system of a speaker product can be detected in real time at the system end of the electronic device.

公开(公告)号：US10250962B2

公开(公告)日：2019-04-02

申请号：US15554980

申请日：2015-12-10

Applicant: GOERTEK.INC

Inventor： Guoguang Zheng

IPC: H04R1/04 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.

公开(公告)号：US10237671B2

公开(公告)日：2019-03-19

申请号：US15570616

申请日：2015-12-16

Applicant: Goertek.Inc

Inventor： Qingbin Dong

IPC: H04R7/16 ,  H04R31/00 ,  B29C65/54 ,  B29L31/38

Abstract: A speaker vibration assembly is provided, comprising: a voice coil, a reinforcement part and a diaphragm, wherein the diaphragm is provided with a central part. The voice coil and the reinforcement part are respectively pasted on two surfaces of the central part, and the central part is provided with a through hole for adhering configured to accommodate an adhesive applied to the surfaces of the diaphragm. In addition, an assembling method of a speaker vibration assembly is provided.

公开(公告)号：US10177016B2

公开(公告)日：2019-01-08

申请号：US15529590

申请日：2015-08-18

Applicant: Goertek.Inc

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/40 ,  H01L21/67 ,  H01L23/00 ,  H01L27/15

Abstract: A pre-screening method, manufacturing method, device and electronic apparatus of micro-LED. The method for pre-screening defect micro-LEDs comprises: obtaining a defect pattern of defect micro-LEDs on a laser-transparent substrate (S6100); and irradiating the laser-transparent substrate with laser from the laser-transparent substrate side in accordance with the defect pattern (S6200), to lift-off the defect micro-LEDs from the laser-transparent substrate.