公开(公告)号：US09801282B2

公开(公告)日：2017-10-24

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H05K3/18 ,  H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

公开(公告)号：US20160353575A1

公开(公告)日：2016-12-01

申请号：US15232808

申请日：2016-08-10

Applicant: IBIS Innotech Inc.

Inventor： Wen-Chun Liu

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0218 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/188 ,  H05K3/4007 ,  H05K3/4697 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.

Abstract translation: 封装结构包括基板，传感器，基座，引线框架，导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面，并且包括接收腔，在接收腔的底表面和接合表面之间延伸的倾斜表面，以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。

公开(公告)号：US20160034083A1

公开(公告)日：2016-02-04

申请号：US14581835

申请日：2014-12-23

Applicant: IBIS INNOTECH INC.

Inventor： Wei-Jen LAI ,  Chih-Kung HUANG

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103

Abstract: A touch sensing device includes a light-transmitting substrate, an edge layer and sensing lines. The light-transmitting substrate has an upper surface and a lower surface opposite to the upper surface, and the edge layer is covered on an edge of the upper surface of the light-transmitting substrate. The edge layer has a main body made of insulated material, and conductive wires. The main body has a first surface attached on the upper surface of the light-transmitting substrate, a second surface opposite and parallel to the first surface, and slots recessed downwardly from the second surface. The conductive wires are embedded in the slots, respectively. The sensing lines are disposed on the upper surface of the light-transmitting substrate and electrically connected with the conductive wires, respectively. Therefore, the touch sensing device can have simple and quick manufacturing process, high yield rate and low cost.

Abstract translation: 触摸感测装置包括透光衬底，边缘层和感测线。 透光基板具有与上表面相对的上表面和下表面，并且边缘层被覆盖在透光基板的上表面的边缘上。 边缘层具有由绝缘材料制成的主体和导电线。 主体具有附着在透光基板的上表面上的第一表面，与第一表面相对并平行的第二表面，以及从第二表面向下凹陷的槽。 导线分别嵌入槽中。 感测线设置在透光基板的上表面上并分别与导电线电连接。 因此，触摸传感装置可以具有简单快速的制造工艺，高产率和低成本。

公开(公告)号：DE202014100619U1

公开(公告)日：2014-06-12

申请号：DE202014100619

申请日：2014-02-12

Applicant: IBIS INNOTECH INC

IPC: H01L23/48 ,  H01L23/12 ,  H01L33/62

Abstract: Keramischer Schaltkreis (10), welcher umfasst ein Substrat (20) aus Aluminiumoxid (Al2O3) oder Aluminiumnitrid (AlN) mit einer äußeren Oberfläche (22) und einer Vertiefung (24), die von der äußeren Oberfläche (22) zurückversetzt ist, worin die Vertiefung (24) eine Boden-Oberfläche (242) aufweist, die mit einer Rauheit Ra von 1–20 μm, mehreren Scheiteln (242a) und mehreren Senken (242b) ausgestattet ist, worin die Scheitel (242a) im Wesentlichen in einer imaginären Ebene (P) angeordnet sind, die im Wesentlichen parallel von der äußeren Oberfläche (22) verläuft und davon in einer Entfernung von 1–100 μm beabstandet ist, und einen elektrisch leitenden Draht (30), der in der Vertiefung (24) des Substrats (20) eingebettet ist und eine obere Oberfläche (32) aufweist, die im Wesentlichen bündig ist mit der äußeren Oberfläche (22) des Substrats (20).