公开(公告)号：HK1159023A1

公开(公告)日：2012-07-27

申请号：HK11113546

申请日：2011-12-15

Applicant: INNOVA DYNAMICS INC

Inventor： YOUNG MICHAEL EUGENE ,  MITTAL ALEXANDER CHOW ,  SRINIVAS ARJUN DANIEL ,  PENG CALVIN

IPC: B28B20060101 ,  B05D20060101

Abstract: A method of modifying a coating material includes applying a fluid including a population of particles to a wet coating material disposed on a substrate. The method also includes drying the wet coating material so as to give rise to a coated article, where the particles are at least partially embedded in a surface of the dried coating material. The particles can be metallic nanowires, and a loading of the metallic nanowires in the dried coating material can be above an electric percolation threshold.

公开(公告)号：CA2829242A1

公开(公告)日：2012-02-16

申请号：CA2829242

申请日：2011-08-08

Applicant: INNOVA DYNAMICS INC

Inventor： SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  MITTAL ALEXANDER CHOW ,  YOUNG MICHAEL EUGENE

IPC: H01L31/048

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

公开(公告)号：CA2734864A1

公开(公告)日：2010-02-25

申请号：CA2734864

申请日：2009-08-21

Applicant: INNOVA DYNAMICS INC

Inventor： YOUNG MICHAEL EUGENE ,  MITTAL ALEXANDER CHOW ,  SRINIVAS ARJUN DANIEL ,  PENG CALVIN

IPC: B28B23/00 ,  B05D5/00 ,  B28B19/00

Abstract: Disclosed are methods for incorporating additives, such as chemically active particles, into the surfaces of articles or into coatings disposed atop articles. The disclosed methods are also applicable to conventional molding techniques, and can be performed in batch or continuous fashion.

公开(公告)号：AU2011289620B2

公开(公告)日：2014-02-13

申请号：AU2011289620

申请日：2011-08-08

Applicant: INNOVA DYNAMICS INC

Inventor： YOUNG MICHAEL EUGENE ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  MITTAL ALEXANDER CHOW

IPC: H01L31/048

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

公开(公告)号：CA2828468A1

公开(公告)日：2011-09-01

申请号：CA2828468

申请日：2011-02-25

Applicant: INNOVA DYNAMICS INC

Inventor： MITTAL ALEXANDER CHOW ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  YOUNG MICHAEL EUGENE

IPC: H01B5/14

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

公开(公告)号：EP2727165A4

公开(公告)日：2015-08-05

申请号：EP12804628

申请日：2012-06-28

Applicant: INNOVA DYNAMICS INC

Inventor： SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  YOUNG MICHAEL EUGENE

IPC: H01L51/52 ,  H01B5/14 ,  H01L51/00 ,  H01L51/56 ,  H05B33/26

CPC classification number: H01B1/02 ,  G02F1/13439 ,  G06F3/044 ,  G06F3/045 ,  H01B13/30 ,  H01L51/0021 ,  H01L51/5206 ,  H01L2251/5369

公开(公告)号：EP2539904A4

公开(公告)日：2018-01-10

申请号：EP11748200

申请日：2011-02-25

Applicant: INNOVA DYNAMICS INC

Inventor： MITTAL ALEXANDER CHOW ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  YOUNG MICHAEL EUGENE

IPC: H01B5/14 ,  H01L31/0224

CPC classification number: H01B1/22 ,  B05D1/005 ,  B05D3/007 ,  H01L23/373 ,  H01L31/022466 ,  H01L31/035209 ,  H01L31/1884 ,  H01L51/442 ,  H01L51/5206 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/097 ,  Y02E10/50 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/249921 ,  Y10T428/25 ,  H01L2924/00

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

公开(公告)号：EP2748827A2

公开(公告)日：2014-07-02

申请号：EP12825962.9

申请日：2012-08-24

Applicant: Innova Dynamics, Inc.

Inventor： SRINIVAS, Arjun Daniel ,  ROBINSON, Matthew R. ,  MITTAL, Alexander ,  YOUNG, Michael Eugene ,  BUCHANAN, David ,  GEORGE, Joseph ,  YOSHIOKA, Yuka

IPC: H01B5/14 ,  G06F3/041

CPC classification number: H05K1/0274 ,  B82Y30/00 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0091 ,  H05K3/027 ,  Y10S977/932 ,  Y10T428/25 ,  Y10T428/254

Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.

公开(公告)号：EP2601688A2

公开(公告)日：2013-06-12

申请号：EP11816885.5

申请日：2011-08-08

Applicant: Innova Dynamics, Inc.

Inventor： YOUNG, Michael Eugene ,  SRINIVAS, Arjun Daniel ,  ROBINSON, Matthew R. ,  MITTAL, Alexander Chow

IPC: H01L31/048

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能性添加剂嵌入到主体材料的表面中，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：EP2539904A2

公开(公告)日：2013-01-02

申请号：EP11748200.0

申请日：2011-02-25

Applicant: Innova Dynamics, Inc.

Inventor： MITTAL, Alexander Chow ,  SRINIVAS, Arjun Daniel ,  ROBINSON, Matthew R. ,  YOUNG, Michael Eugene

IPC: H01B5/14

CPC classification number: H01B1/22 ,  B05D1/005 ,  B05D3/007 ,  H01L23/373 ,  H01L31/022466 ,  H01L31/035209 ,  H01L31/1884 ,  H01L51/442 ,  H01L51/5206 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/097 ,  Y02E10/50 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/249921 ,  Y10T428/25 ,  H01L2924/00

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.