반도체 장치
    34.
    发明授权
    반도체 장치 失效
    半导体器件

    公开(公告)号:KR101247876B1

    公开(公告)日:2013-03-26

    申请号:KR1020077029218

    申请日:2006-06-16

    CPC classification number: H01L27/1203 H01L29/045

    Abstract: 본 발명에 의한 반도체 장치는, SOI 기판 상에 형성한 반도체층 (SOI 층) 과, 상기 SOI 층 상에 형성된 게이트 전극을 구비하고, 상기 게이트 전극과 상기 SOI 층의 일 함수차에 의한 공핍층의 두께가 상기 SOI 층의 막두께보다 커지도록, 상기 SOI 층의 막두께를 설정하여 노멀리 오프로 한 MOS 트랜지스터를 적어도 일 종류 구비한다.
    MOS 트랜지스터, 반도체 장치

    Abstract translation: 根据本发明的半导体器件包括:形成在SOI衬底上的半导体层(SOI层);以及形成在SOI层上的栅电极,其中栅电极和SOI层之间的功函数差的耗尽层 提供至少一个MOS晶体管,其将SOI层的厚度设定为常关,使得SOI层的厚度变得大于SOI层的厚度。

    다층 회로 기판 및 전자기기
    38.
    发明公开
    다층 회로 기판 및 전자기기 失效
    多层电路板和电子设备

    公开(公告)号:KR1020080036984A

    公开(公告)日:2008-04-29

    申请号:KR1020087000784

    申请日:2006-08-18

    Abstract: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the lowering of production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board. The multilayered circuit board (10) comprises, mounted on a substrate, a plurality of wiring layers and a plurality of insulating layers positioned between the plurality of wiring layers, wherein at least part of the plurality of insulating layers are composed of a porous insulating layer (1) containing at least any of materials selected from a porous material group consisting of porous material, aerogel, porous silica, porous polymer, hollow silica and hollow polymer, and a non-porous insulating layer (2) that is the porous insulating layer (1) not containing the porous material group on at least one surface thereof. This multilayered circuit board is used in electronic equipment.

    Abstract translation: 具有低介电常数层间绝缘膜的多层电路板,能够显着地提高诸如封装和印刷电路板的多层电路板的信号传输特性等性能,因为与中间层 电路板的绝缘膜没有不均匀性,消除了生产成本的降低和高频信号传输特性的恶化; 和使用电路板的电子设备。 多层电路板(10)包括安装在基板上的多个布线层和位于多个布线层之间的多个绝缘层,其中多个绝缘层的至少一部分由多孔绝缘层 (1),其含有选自由多孔质材料,气凝胶,多孔二氧化硅,多孔聚合物,中空二氧化硅和中空聚合物构成的多孔质材料组中的至少任意一种材料,以及作为多孔绝缘层的无孔绝缘层(2) (1)在其至少一个表面上不含多孔材料组。 该多层电路板用于电子设备。

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