公开(公告)号：KR1020100066362A

公开(公告)日：2010-06-17

申请号：KR1020090113993

申请日：2009-11-24

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 난바히로미츠

IPC: H01L21/302

CPC classification number: H01L21/67051 ,  H01L21/68742 ,  H01L21/68792

Abstract: PURPOSE: A liquid processing method, a liquid processing device, and a storage medium are provided to clean the inside of a multi-valve more efficiently with a rinse solution by discharging the rinse solution, which is inserted into the multi-valve from a rinse solution supplying valve located on one side, from a rinse solution discharging valve located on another side. CONSTITUTION: A maintenance unit(31) supports a obbject(W). A rotating driver(60) rotates the maintenance unit. A chemical solution supplying tool supplies a chemical solution to the object. A rinse solution supplying tool(17) supplies a rinse solution to the object. A gas supplying unit supplies gas to the side of the maintenance unit of the object.

Abstract translation: 目的：提供液体处理方法，液体处理装置和存储介质，以便通过从漂洗溶液中排出冲洗溶液来更有效地清洗多阀的内部，该冲洗溶液从冲洗液 位于一侧的溶液供应阀，位于另一侧的冲洗溶液排出阀。 构成：维护单元（31）支持对象（W）。 旋转驱动器（60）使维护单元旋转。 化学溶液供应工具向物体提供化学溶液。 冲洗溶液供应工具（17）将冲洗溶液提供给物体。 气体供给单元向对象的维护单元的一侧供给气体。

公开(公告)号：KR1020080056165A

公开(公告)日：2008-06-20

申请号：KR1020087006814

申请日：2007-10-04

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 난바히로미츠 ,  이토노리히로

IPC: H01L21/304

CPC classification number: H01L21/67051 ,  H01L21/68728

Abstract: Provided is a substrate treating apparatus, which holds a wafer (W) rotatably by a substrate holding portion, which subjects the wafer (W) to a rinsing treatment such that a drainage cup (51) is disposed to enclose the outer side of the wafer (W), by feeding a treating liquid to the wafer (W) while rotating the wafer (W), and which then subjects the wafer (W) to a rinsing treatment by feeding a rinsing liquid to the wafer (W) while rotating the substrate. The rinsing treatment is controlled to execute at first the step of feeding the rinsing liquid while controlling the rotating speed of the wafer (W) to that for the rinsing treatment, the step of raising the liquid level of the rinsing liquid in the drainage cup (51) by decreasing the speed of the wafer (W) or increasing the feed of the rinsing liquid, and the step of increasing the speed of the wafer (W) thereby to raise the arriving position of the rinsing liquid at the outer circumference wall of the drainage cup (51).

Abstract translation: 提供了一种基板处理装置，其通过基板保持部可旋转地保持晶片（W），所述基板保持部使晶片（W）进行漂洗处理，使得布置排液杯（51）以包围晶片的外侧 （W），同时旋转晶片（W）将处理液供给到晶片（W），然后通过在旋转晶片（W）的同时向晶片（W）供给冲洗液体来使晶片（W）进行漂洗处理 基质。 控制冲洗处理，首先执行在将晶片（W）的旋转速度控制到冲洗处理的转速的同时进行冲洗液的步骤，提高排水杯中的冲洗液体的液面的步骤（ 通过降低晶片的速度（W）或增加冲洗液的供给，以及提高晶片（W）的速度的步骤，从而提高冲洗液体在外周壁处的到达位置 排水杯（51）。

公开(公告)号：KR1020080036542A

公开(公告)日：2008-04-28

申请号：KR1020070106922

申请日：2007-10-23

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 난바히로미츠 ,  이또노리히로

IPC: H01L21/304

CPC classification number: H01L21/02052 ,  H01L21/67051

Abstract: A cleaning apparatus, a cleaning method, and a computer readable medium are provided to sufficiently clean the surroundings of a liquid ejection hole by forming a liquid layer around the liquid ejection hole. A substrate maintaining unit(2) includes a rotational plate and a maintaining member for horizontally maintaining a substrate. A rotating unit(3) rotates the rotational plate together with the substrate. A liquid ejection hole(5) is located near the revolution center of the rotational plate and ejects a liquid to the center of the substrate maintained by the substrate maintaining unit. A rear-side liquid supply nozzle(6) supplies a cleaning liquid and a rinse liquid so as to eject them to a rear of the substrate through the liquid ejection hole. A cup(4) surround the substrate maintained by the substrate maintaining unit. A control unit controls the revolution of the substrate and the liquid supply. The control unit forms a liquid layer at the surroundings of the liquid ejection hole to process the substrate and the surroundings.

Abstract translation: 提供清洁装置，清洁方法和计算机可读介质，以通过在液体喷射孔周围形成液体层来充分地清洁液体喷射孔的周围。 基板保持单元（2）包括旋转板和用于水平地保持基板的保持构件。 旋转单元（3）使旋转板与基板一起旋转。 液体喷射孔（5）位于旋转板的旋转中心附近，并将液体喷射到由基板保持单元维持的基板的中心。 后侧液体供给喷嘴（6）提供清洗液和冲洗液，以便通过液体喷射孔将其喷射到基板的后部。 围绕由基板保持单元维持的基板的杯（4）。 控制单元控制基板的旋转和液体供应。 控制单元在液体喷射孔的周围形成液体层以处理基板和周围环境。

公开(公告)号：KR1020070120032A

公开(公告)日：2007-12-21

申请号：KR1020070057770

申请日：2007-06-13

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 난바히로미츠 ,  이토노리히로

IPC: H01L21/02 ,  H01L21/304

CPC classification number: H01L21/67051 ,  G03F7/162 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/68728 ,  H01L21/68735

Abstract: A liquid process apparatus is provided to rapidly exhaust process liquid from a drain cup by including a spiral stream forming member for inducing the process liquid in a drain cup to a drain hole. A substrate maintenance part(2) horizontally maintains a substrate, capable of rotating together with the substrate. A rotation cup(4) of an annular type surrounds the substrate maintained by the substrate maintenance part, capable of rotating together with the substrate. A rotation unit(3) rotates the rotation cup and the substrate maintenance part together. A liquid supply unit(5) supplies process liquid to the substrate. A drain cup(51) is made of an annular type corresponding to the rotation cup, receiving the process liquid exhausted from the rotation cup and having a drain hole(60) for draining the received process liquid. When the rotation cup and the substrate maintenance part are rotated, a spiral stream forming member(32a) forms a spiral stream in the drain cup and accompanies the process liquid in the drain cup with the spiral stream to induce the process liquid to the drain hole. The spiral stream forming member can be inserted into the drain cup, and the rotation of the rotation cup and substrate maintenance part is accompanied by rotation of the spiral stream forming member.

Abstract translation: 提供一种液体处理装置，用于通过包括用于将排水杯中的处理液体引导到排水孔的螺旋流形成构件来迅速地从排水杯排出处理液。 基板维护部件（2）水平地保持能够与基板一起旋转的基板。 环形旋转杯（4）围绕由衬底维持部保持的基板，能够与衬底一起旋转。 旋转单元（3）将旋转杯和基板维护部分一起旋转。 液体供应单元（5）将处理液体供应到基底。 排水杯（51）由对应于旋转杯的环形制成，接收从旋转杯排出的处理液体并具有用于排出接收到的处理液体的排水孔（60）。 当旋转杯和基板维护部分旋转时，螺旋流形成构件（32a）在排水杯中形成螺旋流，并与排出杯中的处理液体一起用螺旋流引导处理液体到排水孔 。 螺旋流形成构件可以插入到排水杯中，并且旋转杯和基板维护部的旋转伴随着螺旋流形成构件的旋转。