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公开(公告)号：KR1020090111265A
公开(公告)日：2009-10-26
申请号：KR1020080125984
申请日：2008-12-11
Applicant: 삼성전기주식회사
CPC classification number: H04N5/50 , H03J3/185 , H03J3/20 , H04N21/4263
Abstract: PURPOSE: A front-end module for broadcast reception for performing RF loop is provided to prevent unnecessary power consumption and perform RF loop. CONSTITUTION: A first switch(100) passes the radio frequency signal of the input node connected to an input node. An amplifier(200) amplifies RF broadcast signal of a first switch. A splitter(300) distributes the RF broadcast signal of the amplifier with the first RF broadcast signal and the second radio frequency broadcast signal. A second switch outputs the second radio frequency broadcast signal of the splitter. The off-through switch(600) is switched off the fourth operating voltage.
Abstract translation: 目的：提供用于执行RF环路的广播接收的前端模块，以防止不必要的功耗并执行RF环路。 构成：第一开关（100）通过连接到输入节点的输入节点的射频信号。 放大器（200）放大第一开关的RF广播信号。 分路器（300）利用第一RF广播信号和第二射频广播信号来分配放大器的RF广播信号。 第二开关输出分路器的第二射频广播信号。 截止开关（600）关闭第四工作电压。
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公开(公告)号：KR1020090054291A
公开(公告)日：2009-05-29
申请号：KR1020070121079
申请日：2007-11-26
Applicant: 삼성전기주식회사
IPC: H05K3/18
CPC classification number: H05K3/107 , H05K3/0035 , H05K3/0038 , H05K3/045 , H05K3/421 , H05K3/427 , H05K2201/0394 , H05K2201/09563 , H05K2203/0577 , H05K2203/0723 , H05K2203/1152 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: 인쇄회로기판의 제조방법이 개시된다. (a) 절연층의 일면에 동박이 적층된 동박적층판에서, 상기 동박에 산에 강한 제1 커버층과 알카리에 강한 제2 커버층을 순차적으로 적층하는 단계,(b) 상기 제2 커버층, 상기 제1 커버층 및 상기 동박적층판의 일부를 제거하여 음각을 형성하는 단계, (c) 상기 음각 및 상기 제2 커버층에 시드층을 적층하는 단계, (d) 상기 제2 커버층을 박리하여, 상기 제2 커버층의 표면에 적층된 상기 시드층의 일부를 제거하는 단계, (e) 상기 음각 내부를 도금하여 도금층을 형성하는 단계, (f) 상기 제1 커버층을 박리하는 단계, 및 (g) 상기 제1 커버층의 박리로 노출된 상기 동박을 제거하는 단계를 포함하는 인쇄회로기판의 제조방법이 제공된다.
인쇄회로기판, 커버층, 음각Abstract translation: 公开了一种制造印刷电路板的方法。 （a）在所述铜箔上顺序地层压强抗酸的第一覆盖层和第二碱性覆盖层，其中所述铜箔层压在所述绝缘层的一侧上，（b） （C）在压花角度和第二覆盖层上层压种子层;（d）剥离第二覆盖层以除去第一覆盖层和第二覆盖层; 去除层压在第二覆盖层表面上的一部分种子层;（e）在凹版内部镀覆以形成镀层;（f）剥离第一覆盖层;以及 （g）除去因第一覆盖层剥离而露出的铜箔。
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公开(公告)号：KR1020070082286A
公开(公告)日：2007-08-21
申请号：KR1020060014917
申请日：2006-02-16
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L23/13 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2224/48237 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
Abstract: A package on package with a cavity and a method for manufacturing the same are provided to reduce the thickness of the package by forming a cavity in upper and lower substrates. A first upper substrate cavity is formed in one side of an upper substrate, and then an upper semiconductor chip(480) is mounted in the other side of the upper substrate. A lower substrate cavity is formed in one side of a lower substrate, and then a lower semiconductor chip(435) is mounted in the lower substrate cavity formed in the lower substrate. The upper substrate is stacked above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip.
Abstract translation: 提供具有空腔的封装和其制造方法，以通过在上基板和下基板中形成空腔来减小封装的厚度。 第一上基板空腔形成在上基板的一侧，然后上半导体芯片（480）安装在上基板的另一侧。 在下基板的一侧形成下基板空腔，然后将下半导体芯片（435）安装在形成在下基板中的下基板空腔中。 上基板堆叠在下基板上方，使得第一上基板空腔容纳下半导体芯片的一部分。
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公开(公告)号：KR100744994B1
公开(公告)日：2007-08-02
申请号：KR1020060007820
申请日：2006-01-25
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 다층 인쇄회로기판 및 그 제조방법이 개시된다. (a) 일면에 제1 동박층이 적층되고, 타면에 제1 동박층보다 두께가 두꺼운 제2 동박층이 적층된 비대칭(unbalance) 동박적층판(CCL)을 준비하는 단계, (b) 2장의 동박적층판을 제2 동박층이 서로 대향하도록 절연재를 개재하여 적층함으로써 코어기판을 형성하는 단계, (c) 코어기판의 표면에 적층된 제1 동박층의 일부를 제거하여 내층회로를 형성하는 단계, (d) 코어기판의 표면에 절연층을 개재하여 금속층을 적층하는 단계, 및 (e) 금속층의 일부를 제거하여 외층회로를 형성하는 단계를 포함하는 다층 인쇄회로기판 제조방법은, 비대칭 동박적층판의 두꺼운 동박층을 이용하여 코어기판 내에 메탈층이 삽입된 것과 같은 효과를 도출함으로써 기판의 강성이 증대되며, 두꺼운 동박층을 통해 기판 내에서 발생한 열이 효율적으로 방출되므로 열방출 효과가 향상된다.
다층 인쇄회로기판, 비대칭 동박적층판-
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Patent Agency Ranking
公开(公告)号：KR100657410B1
公开(公告)日：2006-12-14
申请号：KR1020060014555
申请日：2006-02-15
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: A method for manufacturing a multi-layer printed circuit board is provided to implement a high integrated interconnection of a printed circuit board by performing a precise ink-jet printing. A method for manufacturing a multi-layer printed circuit board includes the steps of: combining a first paste bump on a predetermined location of a substrate(100); stacking the first insulation layer on the substrate so that the first paste bump penetrates the first insulation layer(110); compressing the first paste bump corresponding to the height of the first insulation layer(120); and printing a first circuit pattern on the surface plane of the first insulation layer through an ink-jet scheme(130).
Abstract translation: 提供一种用于制造多层印刷电路板的方法，以通过执行精确的喷墨印刷来实现印刷电路板的高集成互连。 一种用于制造多层印刷电路板的方法，包括以下步骤：在衬底（100）的预定位置上结合第一浆料凸块; 将第一绝缘层堆叠在衬底上，使得第一浆料凸块穿透第一绝缘层（110）; 压缩与第一绝缘层（120）的高度对应的第一浆料凸块; 以及通过喷墨方案在第一绝缘层的表面平面上印刷第一电路图案（130）。
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公开(公告)号：KR1020160102798A
公开(公告)日：2016-08-31
申请号：KR1020150025334
申请日：2015-02-23
CPC classification number: H02M3/315 , H02M3/33592
Abstract: 본실시예는제어신호에의해스위칭동작을수행하는스위치부, 스위치부의스위칭동작에의해입력전압을컨버팅하고클램핑하여제1전압을출력하는제1컨버터, 스위치부의스위칭동작에의해제1전압을입력받아제2전압을출력하는제2컨버터, 및스위치부에제어신호를공급하는제어부를포함하는전원공급장치및 그를이용한전원공급방법을제공하는것이다.
Abstract translation: 本发明的实施例提供一种电源装置和使用该电源装置的电力供给方法，其具有高效率和低制造成本。 电源装置包括：开关单元，其通过控制信号执行切换操作; 第一转换器，用于通过开关单元的切换操作转换和钳位输入电压来输出第一电压; 第二转换器，用于通过开关单元的切换操作接收第一电压来输出第二电压; 以及用于将控制信号提供给开关单元的控制单元。
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公开(公告)号：KR1020130074555A
公开(公告)日：2013-07-04
申请号：KR1020110142663
申请日：2011-12-26
Applicant: 삼성전기주식회사
Inventor： 박동진
IPC: G11B19/20
CPC classification number: H02K5/16 , F16C17/107 , F16C2226/36 , F16C2370/12 , H02K5/163
Abstract: PURPOSE: A spindle motor is provided to minimize deformation in a circumferential direction by forming sleeve and a cover facing each other in a longitudinal direction by welding in a horizontal butt joint welding method. CONSTITUTION: A sleeve (120) is formed in a hollow cylindrical shape for rotatably supporting a shaft (130). A horizontal butt joint welding method forms a weld zone of a ring shape along the welding joint of the sleeve and a cover (170) arranged in an axial direction. The cover is arranged in parallel with the lower part of the sleeve for closing the open lower part of the sleeve. The welding joint between the outer circumferential surface of the cover and the outer circumferential surface of the sleeve is fixed in the horizontal butt joint welding method. The edge of the cover coincides with the shape of the outer circumferential surface of the lower part of the sleeve.
Abstract translation: 目的：通过在水平对接焊接方法中通过焊接，通过形成套筒和纵向方向彼此面对的盖来提供主轴电动机以最小化圆周方向的变形。 构成：套筒（120）形成为中空圆柱形，用于可旋转地支撑轴（130）。 水平对接焊接方法形成沿着套筒的焊接接头的环形焊接区域和沿轴向配置的盖子（170）。 盖与套筒的下部平行设置，用于封闭套筒的开口下部。 外壳的外周面与套筒的外周面之间的焊接接头以水平对接焊接方式固定。 盖的边缘与套筒下部的外圆周表面的形状重合。
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公开(公告)号：KR1020130074076A
公开(公告)日：2013-07-04
申请号：KR1020110141947
申请日：2011-12-26
CPC classification number: H02M3/33546 , H02M1/4225 , H02M7/23 , H02M2001/0032 , Y02B70/126 , Y02B70/16 , Y02P80/112
Abstract: PURPOSE: A power module and a decentralized power supply device having the same is provided to be able to quickly perform the desired power supply in hot-swapping or heavy loading by ceasing the operation of a direct current/direct current conversion stage in light loading and providing a reference voltage to a direct current/direct current conversion stage in hot-swapping or heavy loading. CONSTITUTION: A power factor correction stage (112) switches the input power source, and corrects the power factor. A direct current/direct current conversion stage (113) switches the power with the power factor corrected in the power factor correction stage, and converts into the pre-set direct current power supply. A control unit (114) controls the power factor correction stage and the direct current/direct current conversion stage in the pre-set powering mode. The control unit ceases the power source conversion operation of the direct current/direct current conversion stage in the pre-set idle mode. A reference voltage provider (115) provides the pre-set reference voltage to the direct current/direct current conversion stage in the pre-set idle mode. [Reference numerals] (111) Input filter unit; (112) Power factor correction stage; (113) Direct current/direct current conversion stage; (114) Control unit; (115) Reference voltage provider; (120) Second power module; (130) Third power module; (1N0) N-th power module
Abstract translation: 目的：提供一种电源模块和具有该功率模块的分散式电源装置，以便能够通过在轻负载中停止直流/直流转换级的运行来快速执行热插拔或大负载中的所需电源， 在热插拔或重负载中为直流/直流转换级提供参考电压。 构成：功率因数校正级（112）切换输入电源，校正功率因数。 直流/直流转换级（113）利用在功率因数校正级中校正的功率因数来切换功率，并转换成预设的直流电源。 控制单元（114）在预设供电模式下控制功率因数校正级和直流/直流转换级。 控制单元停止在预设空闲模式下的直流/直流转换级的电源转换操作。 参考电压提供器（115）在预置的空闲模式中将预置参考电压提供给直流/直流转换级。 （附图标记）（111）输入滤波器单元; （112）功率因数校正级; （113）直流/直流转换级; （114）控制单元; （115）参考电压提供器; （120）第二电源模块; （130）第三电源模块; （1N0）第N个电源模块
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公开(公告)号：KR1020130073611A
公开(公告)日：2013-07-03
申请号：KR1020110141560
申请日：2011-12-23
IPC: H02M3/28
CPC classification number: H02M3/33592 , Y02B70/1475
Abstract: PURPOSE: A power supplier is provided to reduce conduction loss of a second side rectifier element by controlling the switching of the second side rectifier element based on a first side current. CONSTITUTION: A switching unit switches an input power. A transformation unit transforms the switched power. A rectifying unit (130) has a rectifier element. A control unit (140) controls the switching of the switching unit. A switching control unit (150) turns on and turns off the rectifier element. [Reference numerals] (141) Detection unit; (142) Switching signal generation unit; (151a) Resonance current detection unit; (151b) Magnetization current detection unit; (152) Rectification switching control unit
Abstract translation: 目的：提供电源，以通过基于第一侧电流控制第二侧整流元件的开关来减少第二侧整流元件的导通损耗。 构成：开关单元切换输入电源。 变换单元转换开关电源。 整流单元（130）具有整流元件。 控制单元（140）控制切换单元的切换。 开关控制单元（150）导通并关闭整流元件。 （附图标记）（141）检测单元; （142）开关信号生成单元; （151a）谐振电流检测单元; （151b）磁化电流检测单元; （152）整流开关控制单元
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