公开(公告)号：KR101367065B1

公开(公告)日：2014-02-24

申请号：KR1020120121188

申请日：2012-10-30

Applicant: 삼성전기주식회사

Inventor： 조은정 ,  임재현 ,  김태현 ,  손영호

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H01L2224/34 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

Abstract: The present invention relates to a power module package comprising a base substrate having one surface and the other surface; a first pattern formed at one surface of the base substrate; a second pattern formed at the other surface of the base substrate; a circuit layer including via electrically connecting the first and second patterns; a first semiconductor chip and a second semiconductor chip having first surface and second surface, respectively and mounted at the base substrate for the first surface to contact the first pattern; and a lead frame having one side and the other side wherein the one side contacts the second surface of the first and second semiconductor chips, the other side has first lead protruding to outside, one side and the other side, the other side contacts the second pattern, and the other side comprises a second lead protruding to outside.

Abstract translation: 本发明涉及功率模块封装，其包括具有一个表面和另一个表面的基底基板; 形成在所述基底基板的一个表面上的第一图案; 形成在所述基底基板的另一个表面上的第二图案; 电路层，包括通过电连接第一和第二图案; 第一半导体芯片和第二半导体芯片，分别具有第一表面和第二表面，并且安装在用于第一表面的基底基板上以接触第一图案; 以及具有一侧和另一侧的引线框架，其一侧接触第一和第二半导体芯片的第二表面，另一侧具有突出到外侧，一侧和另一侧的第一引线，另一侧接触第二 图案，另一侧包括突出到外部的第二引线。

公开(公告)号：KR1020140002330A

公开(公告)日：2014-01-08

申请号：KR1020120070668

申请日：2012-06-29

Applicant: 삼성전기주식회사

Inventor： 조은정 ,  손영호 ,  임재현

IPC: H01L23/12

CPC classification number: H05K1/18 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2924/0002 ,  H05K3/306 ,  H05K3/3415 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10689 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

Abstract: According to the present invention, a superimposed module package includes a printed circuit board, a first module electrically connected onto the printed circuit board, and a second module electrically connected onto the printed circuit board and the first module and overlapped with the printed circuit board and the first module. According to the present invention, the superimposed module package is used in various categories for product lineup by applying various combinations such as a power module, a control module, a light emitting module, a storage module, etc. to each module.

Abstract translation: 根据本发明，叠加的模块封装包括印刷电路板，电连接到印刷电路板上的第一模块和电连接到印刷电路板和第一模块上并与印刷电路板重叠的第二模块，以及 第一个模块。 根据本发明，通过将各种组合（例如电源模块，控制模块，发光模块，存储模块等）应用于每个模块，叠加的模块封装以各种类别用于产品阵容。

公开(公告)号：KR1020130055358A

公开(公告)日：2013-05-28

申请号：KR1020110121063

申请日：2011-11-18

Applicant: 삼성전기주식회사

Inventor： 조은정 ,  임재현 ,  김태현 ,  손영호

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

Abstract: PURPOSE: A power module package and a manufacturing method thereof are provided to reduce the size of a product by thinning a lead frame bonded to a control device than the lead frame bonded to a power device. CONSTITUTION: A first semiconductor chip(130) is bonded to one side(110a) of a first lead frame(110). A second semiconductor chip(140) is bonded to one side(120a) of a second lead frame(120). The thickness of the first lead frame is different from the thickness of the second lead frame. A molding material(160) surrounds one side of the first lead frame, one side of the second lead frame, the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are electrically connected to each lead frame through a wire bonding using a wire(150).

Abstract translation: 目的：提供一种功率模块封装及其制造方法，通过将与键合到功率器件的引线框架相比，结合到控制装置的引线框架变薄来减小产品的尺寸。 构成：将第一半导体芯片（130）接合到第一引线框架（110）的一侧（110a）。 第二半导体芯片（140）接合到第二引线框架（120）的一侧（120a）。 第一引线框架的厚度与第二引线框架的厚度不同。 模制材料（160）围绕第一引线框架的一侧，第二引线框架的一侧，第一半导体芯片和第二半导体芯片。 第一半导体芯片和第二半导体芯片通过使用导线（150）的引线接合电连接到每个引线框架。