Abstract:
The present invention discloses a cache controller based on a quality of service (QoS) and an operating method thereof. The QoS based cache controller comprises an entry list determining module outputting a replaceable entry list based on the QoS value of a process; and a cache replacing module writing data to an entry included in the replaceable entry list.
Abstract:
PURPOSE: An electro mechanical transistor is provided to improve the reliability of an operation by improving a short channel effect through a movable channel. CONSTITUTION: A source pillar(130) is provided between a substrate and a source electrode. A drain pillar is provided between a substrate and a drain electrode. A movable channel is separated from the source electrode and the drain electrode. A gate nano pillar(110) is provided between the movable channel and the substrate. A first dielectric layer is provided between the movable channel and the gate nano pillar. A second dielectric layer is provided between the source pillar and the source electrode. A third dielectric layer is provided between the drain pillar and the drain electrode.
Abstract:
A register updating method, and a register and computer system adopting the same are provided to update information stored in the register, partially. According to the first information, an entry selection unit(910) generates a entry control signal for each region. The first information is transmitted together with the second information to be updated and shows whether to permit the updating for each region within a register block. According to the logical value of the entry control signal generated for each region, a storing unit(920) selects register data from each region and then partially records data.
Abstract:
소정 거리만큼 이격된 소오스 및 드레인 영역이 형성된 반도체 기판; 및 상기 소오스 및 드레인 영역사이의 상기 반도체 기판 상에 양단이 상기 소오스 및 드레인 영역과 접촉되도록 형성된 게이트 적층물을 구비하는 비휘발성 반도체 메모리 장치에 있어서, 상기 게이트 적층물은 터널링막, 질화막(Si 3 N 4 )보다 유전율이 크고 제1 불순물이 도핑된 제1 트랩 물질막, 상기 질화막보다 유전율이 큰 제1 절연막 및 게이트 전극이 순차적으로 적층되어 구성되고, 상기 제1 불순물은 Dy를 포함하는 란탄계열원소인 것을 특징으로 하는 비휘발성 반도체 메모리 장치를 제공한다. 이러한 본 발명을 이용하면, 도핑 농도에 따라 트랩밀도를 효과적으로 조절할 수 있고, 그에 따라 종래보다 낮은 전압으로 데이터를 기록 및 소거할 수 있으며, 종래보다 빠른 동작 속도를 얻을 수 있다.
Abstract:
소노스 메모리 소자 및 그 제조 방법과 동작방법이 개시되어 있다. 여기서, 본 발명은 소오스 및 드레인 영역과 채널영역이 포함된 반도체층과, 상기 반도체층 상에 구비되어 상기 반도체층과 함께 상부 소노스 메모리 소자를 이루는 상부 적층물과, 상기 반도체층 아래에 구비되어 상기 반도체층과 함께 하부 소노스 메모리 소자를 이루는 하부 적층물을 포함하는 소노스 메모리 장치를 제공하고, 이것의 제조방법 및 동작방법을 제공한다.
Abstract:
PURPOSE: An apparatus and a method for inspecting defects are provided to improve accuracy in defect inspection and reduce inspection time by calculating an optimal amplification ratio based on regional characteristics on an object to be inspected. CONSTITUTION: An apparatus for inspecting defects includes a stage(140), a light emitter(110), a detector(130), a controller(160), and a determiner(170). The stage supports and transfers an object to be inspected. The light emitter is apart from the stage by a predetermined distance and sequentially illuminates a light to at least two regions on the object to be inspected. The detector collects the light reflected from the object to be inspected and amplifies the collected light by an amplification ratio. The controller varies the amplification ratio according to regional characteristics corresponding to a variance of the amplified light. The determiner analyzes the amplified light and determines an error on the object to be inspected.
Abstract:
PURPOSE: A method and an apparatus of inspecting a surface of a wafer is provided to perform an accurate surface inspection process by using wafer location information to correct a location of the wafer. CONSTITUTION: A wafer is loaded into a surface inspection region(S100). Incident rays including a first incident ray for sensing a vertical location of the wafer and a second incident ray for inspecting a surface of the wafer are irradiated on the wafer(S200). The location of the wafer is controlled by detecting the first incident ray reflected from the wafer(S300). The surface of the wafer is inspected by detecting the second incident ray scattered by the wafer(S400).