公开(公告)号：KR100761853B1

公开(公告)日：2007-09-28

申请号：KR1020060067101

申请日：2006-07-18

Applicant: 삼성전자주식회사

Inventor： 이희석 ,  최윤석 ,  송은석 ,  조영상 ,  신나래

IPC: G02F1/1345

CPC classification number: H01F21/12 ,  H01F41/045 ,  H05K1/147 ,  H05K1/165

Abstract: A repairable and scalable filter, a tape line substrate with the filter and a display panel assembly with the tape line substrate are provided to effectively reduce the EMI(Electromagnetic Interference) and to maintain the driving property of a driving driver IC(Integrated Circuit) by mounting the repairable and scalable filter within wiring lines and repairing the filter to have a predetermined inductance corresponding to the generation of the EMI. A base film(161) has a chip mounting member for mounting a semiconductor chip. A wiring pattern(180) is arrayed on the base film. A filter is arrayed on the base film adjacent to the wiring pattern. The filter includes a filter wiring line(210) with the first line width and having the first and second ends. Repair members(220) are arrayed between the first and second ends of the filter wiring line. A filter bank member(230) is connected between the first and second ends of the filter wiring lines and controls the inductance of the filter according to the repair of the repairing member. The repair members have one or more repair patterns with the second line width. The filter bank member includes one or more unit bank filters connected in parallel to the repair patterns of the repair members. The unit filter banks have one of meander, spiral or solenoid shapes.

Abstract translation: 提供可修复和可缩放的滤波器，具有滤波器的带线基板和带带线基板的显示面板组件，以有效降低EMI（电磁干扰），并通过以下方式保持驱动驱动器IC（集成电路）的驱动性能 将可修复和可缩放的滤波器安装在布线内，并修复滤波器以具有对应于EMI产生的预定电感。 基膜（161）具有用于安装半导体芯片的芯片安装部件。 布线图案（180）排列在基膜上。 滤光片排列在邻近布线图案的基片上。 滤波器包括具有第一线宽并具有第一端和第二端的滤波器布线（210）。 维修构件（220）排列在过滤器配线的第一和第二端之间。 滤波器组构件（230）连接在滤波器布线的第一端和第二端之间，并且根据修理构件的修理来控制滤波器的电感。 修理构件具有一个或多个具有第二线宽度的修复图案。 过滤器组件包括与修理构件的修复图案并联连接的一个或多个单元组过滤器。 单元滤波器组具有曲折，螺旋形或螺线形形状之一。

公开(公告)号：KR100606654B1

公开(公告)日：2006-08-01

申请号：KR1020050070396

申请日：2005-08-01

Applicant: 삼성전자주식회사

Inventor： 송은석 ,  강운병 ,  이시훈

IPC: H01L21/28 ,  H05K1/18