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32.发明公开
公开(公告)号：KR1020140052116A
公开(公告)日：2014-05-07
申请号：KR1020120116127
申请日：2012-10-18
Applicant: 한국과학기술원
IPC: H01S3/067
CPC classification number: H01S3/06704 , H01S3/0064 , H01S3/06725 , H01S3/1106
Abstract: The present invention relates to a high power optical fiber femtosecond laser resonator generated by the combination mode locking of nonlinear polarization rotation and saturable absorption. An optical fiber femtosecond laser resonator, which is an optical fiber based resonator of a ring-type structure, includes a nonlinear polarization rotation mode locking part which is formed on the resonator and generates an UHF pulse by pulse shaping, and a saturable absorption mode locking part which performs the nonlinear filtering of pulse amplitude, prevents the excess nonlinear phenomenon of the inner part of the resonator, generates an initial pulse, and removes a dispersive wave generated in a soliton pulse.
Abstract translation: 本发明涉及通过非线性偏振旋转和可饱和吸收的组合模式锁定而产生的高功率光纤飞秒激光谐振器。 作为环型结构的基于光纤的谐振器的光纤飞秒激光谐振器包括形成在谐振器上的非线性偏振旋转模式锁定部，并且通过脉冲整形产生UHF脉冲，并且可饱和吸收模式锁定 执行脉冲幅度的非线性滤波的部分防止谐振器内部部分的过量非线性现象产生初始脉冲，并去除孤子脉冲中产生的色散波。
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公开(公告)号：KR101212527B1
公开(公告)日：2012-12-14
申请号：KR1020100100804
申请日：2010-10-15
Applicant: 한국과학기술원
IPC: B23K26/402 , B23K26/067 , B23K26/046
Abstract: 레이저소스, 복굴절물질, 편광기, 및렌즈를포함하는레이저가공장치가공개된다. 레이저소스로부터출력된레이저는복굴절물질, 편광기및 렌즈를통과하며, 복굴절물질에의해분광된분광레이저들은상이한위상을갖고상기렌즈의초점영역에서서로간섭된다.
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公开(公告)号：KR101210653B1
公开(公告)日：2012-12-11
申请号：KR1020100100799
申请日：2010-10-15
Applicant: 한국과학기술원
Abstract: 가공물의에너지상태를상승시키기위해가공물에전기장을형성하도록되어있는전기장발생장치및 전기장에의해상승된에너지상태를갖는가공물에레이저를조사함으로써가공물을가공하도록되어있는레이저발생장치를포함하는레이저가공장치가공개된다.
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公开(公告)号：KR101202256B1
公开(公告)日：2012-11-16
申请号：KR1020100119980
申请日：2010-11-29
Applicant: 한국과학기술원
Abstract: 본 발명은 극초단 펄스 레이저와 수분 응고를 이용한 절단 장치 및 방법에 관한 것으로, 절단 장치에 있어서, 극초단 펄스 레이저를 출력하여 가공 대상물에 공동(void)을 형성시키기 위해 집광렌즈로 집광하여 상기 가공 대상물에 레이저를 조사하는 레이저소스, 상기 가공 대상물 저면을 접하여 내측으로 소정의 공간부를 형성하고, 양쪽으로 수증기 공급부와 냉각 기체 공급부가 구비된 베이스 플레이트, 상기 수증기 공급부로 수증기를 공급하는 수증기 공급수단; 및 상기 냉각 기체 공급부로 냉각 기체를 공급하는 냉각 기체 공급수단을 포함하고, 상기 레이저소를 통해 가공 대상물에 조사하여 균열을 발생시키고, 수증기를 공급한 후 냉각 기체를 공급하여 수증기 응고에 따른 팽창으로 기판을 절단하는 것을 특징으로 한다. 이와 같이 구성되는 가공 대상물 표면으로 파편 입자 생성을 방지할 수 있고, 수분 팽창을 이용하여 최종적으로 절단하기 때문에 공정의 간소화, 공정의 청정성을 확보할 수 있다.
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Patent Agency Ranking
公开(公告)号：KR1020120039222A
公开(公告)日：2012-04-25
申请号：KR1020100100806
申请日：2010-10-15
Applicant: 한국과학기술원
IPC: B23K26/046 , H01S3/10
Abstract: PURPOSE: Laser processing apparatus and method using the dispersion controlling of pulse laser are provided to control the processing depth of a product without moving a laser condensing lens. CONSTITUTION: A laser processing method using the dispersion controlling of pulse laser comprises the following steps: controlling the dispersion of the pulse laser(700); irradiating the pulse laser to a product(103) for processing; and setting the pulse width(W) of the pulse laser in the product on the predetermined point after the applying point of the pulse layer.
Abstract translation: 目的：提供使用脉冲激光器的色散控制的激光加工设备和方法来控制产品的加工深度，而不会移动激光聚焦透镜。 构成：使用脉冲激光器的色散控制的激光加工方法包括以下步骤：控制脉冲激光器（700）的色散; 将脉冲激光照射到产品（103）上进行处理; 并且在脉冲层的施加点之后的预定点上设置脉冲激光在产品中的脉冲宽度（W）。
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公开(公告)号：KR1020120039216A
公开(公告)日：2012-04-25
申请号：KR1020100100798
申请日：2010-10-15
Applicant: 한국과학기술원
IPC: B23K26/70 , B23K26/384 , B23K28/00 , B06B1/00
Abstract: PURPOSE: Laser processing apparatus and method using ultrasonic waves are provided to enable users to obtain a clean processed surface, and to prevent the degeneration of a processed product. CONSTITUTION: A laser processing method using ultrasonic waves comprises a step of irradiating an object(102) with laser(107) for producing reformed portions(103) on the object. The ultrasonic waves(106) are transmitted to the reformed portions. Cracks(110) are extended from the reformed portions by the ultrasonic waves.
Abstract translation: 目的：提供使用超声波的激光加工设备和方法，使用户能够获得清洁的加工表面，并防止加工产品的退化。 构成：使用超声波的激光加工方法包括用激光（107）照射物体（102）以在物体上产生重整部分（103）的步骤。 超声波（106）被传送到重整部分。 裂纹（110）通过超声波从重整部分延伸。
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公开(公告)号：KR1020120039212A
公开(公告)日：2012-04-25
申请号：KR1020100100780
申请日：2010-10-15
Applicant: 한국과학기술원
Abstract: PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the following steps: irradiating an object(102) with a pulse laser(107) for processing; and detecting light(200) transmitted from the plasma(106) generated from the object for monitoring the processed condition of the object. The peak power of the pulse laser is controlled to process the object with a nonlinear optic phenomenon.
Abstract translation: 目的：提供使用等离子体的激光加工状态监测装置和方法，以有效地监测和分析使用从被处理物体产生的等离子体的物体的处理状态。 构成：激光加工状态监测方法包括以下步骤：用脉冲激光器（107）照射物体（102）进行处理; 以及检测从所述对象产生的等离子体（106）发送的光（200），用于监视对象的处理状态。 控制脉冲激光器的峰值功率以用非线性光学现象来处理物体。
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公开(公告)号：KR1020110137031A
公开(公告)日：2011-12-22
申请号：KR1020100057008
申请日：2010-06-16
Applicant: 한국과학기술원
IPC: B23K26/382 , H01S3/10
Abstract: PURPOSE: A cutting method through control of light intensity depending on the time of femtosecond pulse laser is provided to maximize the effect of a processing mechanism, which bases on multi photon ionization and avalanche ionization. CONSTITUTION: A cutting method through control of light intensity depending on the time of femtosecond pulse laser comprises next steps. At least two femtosecond laser pulses are generated separately to have a time interval using pulse delay(120). Each pulse excites electrons on a target(200) based on multi photon Ionization. The electrons excited from the multi photon ionization through avalanche ionization are used as seeds to increase the ionization of a material. Each of at least two femtosecond laser pulses is output, wherein one or more of their pulse width, pulse energy threshold, and inter-pulse interval are different.
Abstract translation: 目的：提供根据飞秒脉冲激光器的时间控制光强度的切割方法，以最大化基于多光子电离和雪崩电离的处理机制的影响。 构成：根据飞秒脉冲激光器的时间控制光强度的切割方法包括以下步骤。 至少两个飞秒激光脉冲被分开产生以具有使用脉冲延迟的时间间隔（120）。 每个脉冲基于多光子电离在靶（200）上激发电子。 通过雪崩电离从多光子电离激发的电子被用作种子以增加材料的电离。 输出至少两个飞秒激光脉冲中的每一个，其中它们的脉冲宽度，脉冲能量阈值和脉冲间间隔中的一个或多个是不同的。
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公开(公告)号：KR1020110132004A
公开(公告)日：2011-12-07
申请号：KR1020100051774
申请日：2010-06-01
Applicant: 한국과학기술원
IPC: B26F3/00 , B23K26/38 , H01L21/304
CPC classification number: B23K26/36 , H01L21/304
Abstract: PURPOSE: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is provided to enhance the cutting speed since the temtosecond pulse laser is used for a bendable or expandable PZT element, and the modified area of a target is separated along a cutting line quickly. CONSTITUTION: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is as follows. A transparent material, a wafer, and a target(101) like a substrate are attached to an expanding tape(103), and the expanding tape is attached onto a bendable PZT element(102). The femtosecond pulse laser is irradiated to the cut part of the target for several tens of femtosecond, and modified areas are formed in the cut part of the target. Voltage is supplied to the bendable PZT element, and the middle part of the PZT element is protruded to generate bending stress.
Abstract translation: 目的：提供使用飞秒脉冲激光器的PZT（压电）元件的加工面切割方法，以提高切割速度，因为立体脉冲激光器用于可弯曲或可扩展的PZT元件，并且目标的修改区域被分离 沿着切割线很快。 构成：使用使用飞秒脉冲激光器的PZT（压电）元件的加工面切割方法如下。 将透明材料，晶片和像基板的靶（101）连接到扩张带（103）上，将扩张带附接到可弯曲的PZT元件（102）上。 飞秒脉冲激光被照射到目标的切割部分数十飞秒，并且在靶的切割部分中形成改质区域。 电压被提供给可弯曲的PZT元件，并且PZT元件的中间部分突出以产生弯曲应力。
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