公开(公告)号：US20250168264A1

公开(公告)日：2025-05-22

申请号：US19030195

申请日：2025-01-17

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04M1/02 ,  H04M1/23

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

公开(公告)号：US11728569B2

公开(公告)日：2023-08-15

申请号：US17111131

申请日：2020-12-03

Applicant: Apple Inc.

Inventor： Bilgehan Avser ,  Harish Rajagopalan ,  Simone Paulotto ,  Jennifer M. Edwards ,  Hao Xu ,  Rodney A. Gomez Angulo ,  Matthew D. Hill ,  Mattia Pascolini

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q21/00

CPC classification number: H01Q9/0485 ,  H01Q1/243 ,  H01Q21/0075

Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

公开(公告)号：US20230224389A1

公开(公告)日：2023-07-13

申请号：US17903935

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  David A. Hurrell ,  Nicholas D. Rath ,  Tyler B. Cater ,  James A. Bertin ,  Sawyer I. Cohen

IPC: H04M1/02 ,  H04N5/225 ,  H04N5/247

CPC classification number: H04M1/0264 ,  H04N5/2254 ,  H04N5/247 ,  H04N5/2252 ,  H04M2201/38

Abstract: A mobile phone may include a display, an enclosure enclosing the display and including a front cover positioned over the display and defining a front exterior surface, and a rear cover defining a rear exterior surface and a raised sensor array region along the rear exterior surface. The raised sensor array region may define a first hole and a second hole. The second hole may be defined by a first opening along an interior surface of the rear cover and having a first opening size and a second opening along the rear exterior surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may further include a first camera having a first lens assembly extending into the first hole, and a second camera having a second lens assembly extending into the second hole.

公开(公告)号：US11700035B2

公开(公告)日：2023-07-11

申请号：US16920297

申请日：2020-07-02

Applicant: Apple Inc.

Inventor： Harish Rajagopalan ,  Bilgehan Avser ,  David Garrido Lopez ,  Forhad Hasnat ,  Mattia Pascolini ,  Mikal Askarian Amiri ,  Rodney A. Gomez Angulo ,  Thomas W. Yang ,  Jiechen Wu ,  Eric N. Nyland ,  Simone Paulotto ,  Jennifer M. Edwards ,  Matthew D. Hill ,  Ihtesham H. Chowdhury ,  David A. Hurrell ,  Siwen Yong ,  Jiangfeng Wu ,  Daniel C. Wagman ,  Soroush Akbarzadeh ,  Robert Scritzky ,  Subramanian Ramalingam

IPC: H01Q9/04 ,  H04B3/52 ,  G01R31/28 ,  H01Q1/22 ,  H01Q13/24 ,  H04B3/54

CPC classification number: H04B3/52 ,  G01R31/2822 ,  H01Q1/2283 ,  H01Q13/24 ,  H04B3/54

Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

公开(公告)号：US20230198129A1

公开(公告)日：2023-06-22

申请号：US18109168

申请日：2023-02-13

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: H01Q1/24 ,  H04M1/02 ,  G06F1/16 ,  B29C45/14

CPC classification number: H01Q1/243 ,  H04M1/0283 ,  H04M1/0249 ,  G06F1/1656 ,  B29C45/14311 ,  B29C45/14467 ,  G06F1/1626 ,  G06F1/1633 ,  B29L2031/34

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

公开(公告)号：US11581629B2

公开(公告)日：2023-02-14

申请号：US17555920

申请日：2021-12-20

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: G06F1/16 ,  H01Q1/24 ,  H04M1/02 ,  B29C45/14 ,  B29L31/34 ,  B29C37/00

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

公开(公告)号：US20220191356A1

公开(公告)日：2022-06-16

申请号：US17687497

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Scott W. Miller ,  Brian A. Argyres ,  Lindsay M. Alanen ,  Matthew D. Hill ,  Nicholas D. Smyth ,  Shujun Tang

IPC: H04N5/225 ,  G03B13/36

Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.

公开(公告)号：US11070655B2

公开(公告)日：2021-07-20

申请号：US16740668

申请日：2020-01-13

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04B1/38 ,  H04M1/02 ,  H04M1/23

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

公开(公告)号：US20200153950A1

公开(公告)日：2020-05-14

申请号：US16740668

申请日：2020-01-13

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Derek C. Krass ,  Benjamin Shane Bustle ,  Lucy Elizabeth Browning ,  Michael Benjamin Wittenberg ,  James B. Smith ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H04M1/02

Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

公开(公告)号：US10524372B2

公开(公告)日：2019-12-31

申请号：US16360939

申请日：2019-03-21

Applicant: Apple Inc.

Inventor： James A. Wright ,  Guangtao Zhang ,  Raymund W. M. Kwok ,  Karl Ruben F. Larsson ,  Christopher S. Graham ,  Matthew D. Hill ,  Abhijeet Misra

IPC: H05K5/04 ,  H02J50/10 ,  H01Q1/38 ,  H01Q7/00 ,  H05K5/03 ,  G06F1/18 ,  H04M1/02 ,  H05K7/14 ,  G06F1/16

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.