SYSTEM AND METHOD FOR BARE WAFER INSPECTION
    31.
    发明申请

    公开(公告)号:WO2020016262A1

    公开(公告)日:2020-01-23

    申请号:PCT/EP2019/069173

    申请日:2019-07-17

    Inventor: FANG, Wei WANG, Joe

    Abstract: A wafer inspection system includes a controller in communication with an electron-beam inspection tool. The controller includes circuitry to: acquire, via an optical imaging tool, coordinates of defects on a sample; set a Field of View (FoV) of the electron-beam inspection tool to a first size to locate a subset of the defects; determine a position of each defect of the subset of the defects based on inspection data generated by the electron-beam inspection tool during a scanning of the sample; adjust the coordinates of the defects based on the determined positions of the subset of the defects; and set the FoV of the electron-beam inspection tool to a second size to locate additional defects based on the adjusted coordinates.

    SEM IMAGE ENHANCEMENT METHODS AND SYSTEMS
    32.
    发明申请

    公开(公告)号:WO2020011580A1

    公开(公告)日:2020-01-16

    申请号:PCT/EP2019/067555

    申请日:2019-07-01

    Abstract: Systems and methods for image enhancement using a multi-beam device are disclosed. A method for enhancing an image includes acquiring a first scanning electron microscopy (SEM) image by use of an on-axis beam of the multi-beam device. The method further includes acquiring a second SEM image by use of an off-axis beam of the multi-beam device. The method further includes providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.

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