Abstract:
The disclosure relates to a charged particle beam apparatus configured to project charged particle beams towards a sample. The charged particle beam apparatus comprises: a plurality of charged particle-optical columns configured to project respective charged particle beams towards the sample, wherein each charged particle-optical column comprises: a charged particle source configured to emit the charged particle beam towards the sample, the charged particle sources being comprised in a source array; an objective lens comprising an electrostatic electrode configured to direct the charged particle beam towards the sample; and a detector associated with the objective lens array, configured to detect signal charged particles emitted from the sample. The objective lens is the most down-beam element of the charged particle-optical column configured to affect the charged particle beam directed towards the sample.
Abstract:
An inspection tool for inspecting a semiconductor substrate is described, the inspection tool comprising: - an substrate table configured to hold the substrate; - an electron beam source configured to project an electron beam onto an area of interest of the substrate, the area of interest comprising a buried structure; - a cathodoluminescent detector configured to detect cathodoluminescent light emitted from the buried structure; - a control unit configured to: - control the electron beam source to project to electron beam onto the area of interest; - receive a signal representative of the detected cathodoluminescent light; - determine, based on the signal, a characteristic of the buried structure.
Abstract:
Apparatuses (1400) and methods for charged-particle detection may include a deflector system (1408, 1410, 1412) configured to direct charged-particle pulses (1414, 1416, 1418), a detector having a detection element configured to detect the charged-particle pulses, and a controller having a circuitry configured to control the deflector system to direct a first and second charged-particle pulses to the detection element; obtain first and second timestamps associated with when the first charged-particle pulse is directed by the deflector system and detected by the detection element, respectively, and third and fourth timestamps associated with when the second charged-particle pulse is directed by the deflector system and detected by the detection element, respectively; and identify a first and second exiting beams based on the first and second timestamps, and the third and fourth timestamps, respectively.
Abstract:
Systems and methods for image enhancement using a multi-beam device are disclosed. A method for enhancing an image includes acquiring a first scanning electron microscopy (SEM) image by use of an on-axis beam of the multi-beam device. The method further includes acquiring a second SEM image by use of an off-axis beam of the multi-beam device. The method further includes providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.
Abstract:
An apparatus comprising a set of pixels configured to shape a beamlet approaching the set of pixels and a set of pixel control members respectively associated with each of the set of pixels, each pixel control member being arranged and configured to apply a signal to the associated pixel for shaping the beamlet.
Abstract:
A method and apparatus to provide a plurality of radiation beams modulated according to at least two sub patterns of a pattern using radiation sources, the radiation sources producing radiation beams of at least two spot sizes such that each of the radiation beams having a same spot size of the at least two spot sizes is used to produce one of the at least two sub patterns, project the plurality of beams onto a substrate, and provide relative motion between the substrate and the plurality of radiation sources, in a scanning direction to expose the substrate. A method and apparatus to provide radiation modulated according to a desired pattern using a plurality of rows of two-dimensional arrays of radiation sources, project the modulated radiation onto a substrate using a projection system, and remove fluid from between the projection system and the substrate using one or more fluid removal units.
Abstract:
Systems and methods of measuring beam current in a multi-beam apparatus are disclosed. The multi-beam apparatus may include a charged-particle source configured to generate a primary charged-particle beam, and an aperture array. The aperture array may comprise a plurality of apertures configured to form a plurality of beamlets from the primary charged-particle beam, and a detector including circuitry to detect a current of at least a portion of the primary charged-particle beam irradiating the aperture array. The method of measuring beam current may include irradiating the primary charged-particle beam on the aperture array and detecting an electric current of at least a portion of the primary charged-particle beam.
Abstract:
A direct write exposure apparatus configured to process a plurality of substrates is described, the apparatus comprising: - a substrate holder configured to hold a substrate having a usable patterning area; - a patterning system configured to project different patterns onto the substrate; - a processing system configured to: o determine a first combination of one or more patterns that are to be applied on a first substrate of the plurality of substrates; and o determine a second, different combination of one or more patterns that are to be applied on a second, subsequent, substrate of the plurality of substrates.
Abstract:
An exposure apparatus is described, the apparatus comprising: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device comprising an array of a plurality of radiation source modules configured to project the modulated radiation onto a respective array of a plurality of exposure regions on the substrate; a distributed processing system configured to process projection related data to enable the projection of the desired pattern onto the substrate, the distributed processing system comprising at least one central processing unit (1700) and a plurality of module processing units (1710) associated with respective plurality of radiation source modules.
Abstract:
A charged-particle tool configured to generate a plurality of sub- beams from a beam of charged particles and direct the sub-beams downbeam toward a sample (600) position, the tool charged-particle tool comprising at least three charged-particle-optical components (201,111,235,234); a detector module (240); and a controller. The detector module is configured to generate a detection signal in response to charged particles that propagate upbeam from the direction of the sample position. The controller is configured to operate the tool in a calibration mode.. The charged-particle-optical components include: a charged-particle source 201 configured to emit a beam of charged particles and a beam generator (111) configured to generate the sub-beams. The detection signal contains information about alignment of at least two of the charged-particle-optical components. The charged-particle optical components comprise two or more charged-particle optical elements comprising an array of apertures for which the charged particles may be monitored.