公开(公告)号：US20200048744A1

公开(公告)日：2020-02-13

申请号：US16530830

申请日：2019-08-02

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Herng-Jeng Jou ,  Weiming Huang ,  Graeme W. Paul ,  William A. Counts ,  Eric W. Hamann ,  Katie L. Sassaman ,  Abhijeet Misra ,  Zechariah D. Feinberg ,  James A. Yurko ,  Brian P. Demers ,  Rafael Yu ,  Anuj Datta Roy ,  Susannah P. Calvin

IPC: C22C21/00 ,  C22F1/04 ,  C22C1/02

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

公开(公告)号：US20200007670A1

公开(公告)日：2020-01-02

申请号：US16569525

申请日：2019-09-12

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

IPC: H04M1/18

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

公开(公告)号：US10327348B2

公开(公告)日：2019-06-18

申请号：US15581433

申请日：2017-04-28

Applicant: Apple Inc.

Inventor： James A. Wright ,  Guangtao Zhang ,  Raymund W. M. Kwok ,  Karl Ruben F. Larsson ,  Christopher S. Graham ,  Matthew D. Hill ,  Abhijeet Misra

IPC: H05K5/04 ,  H02J50/10 ,  H01Q7/00 ,  H05K5/03 ,  G06F1/18 ,  H04M1/02 ,  H01Q1/38 ,  H05K7/14

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

公开(公告)号：US20180103557A1

公开(公告)日：2018-04-12

申请号：US15581433

申请日：2017-04-28

Applicant: Apple Inc.

Inventor： James A. Wright ,  Guangtao Zhang ,  Raymund W.M. Kwok ,  Karl Ruben F. Larsson ,  Christopher S. Graham ,  Matthew D. Hill ,  Abhijeet Misra

IPC: H05K5/04 ,  H05K7/14 ,  H02J50/10 ,  H05K5/03 ,  H01Q1/38 ,  H01Q7/00

CPC classification number: H05K5/04 ,  G06F1/182 ,  H01Q1/38 ,  H01Q7/00 ,  H02J50/10 ,  H04M1/0202 ,  H05K5/03 ,  H05K7/1427

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

公开(公告)号：US20180084653A1

公开(公告)日：2018-03-22

申请号：US15606920

申请日：2017-05-26

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

IPC: H05K5/00 ,  H05K5/04

CPC classification number: H04M1/185 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1656 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0283

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

公开(公告)号：US20180016667A1

公开(公告)日：2018-01-18

申请号：US15406153

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  James A. Wright ,  Herng-Jeng Jou

IPC: C22F1/053 ,  C22C21/10 ,  C22C1/02

CPC classification number: C22F1/053 ,  C22C1/02 ,  C22C1/026 ,  C22C21/10

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.