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公开(公告)号：US20190223310A1
公开(公告)日：2019-07-18
申请号：US16360939
申请日：2019-03-21
Applicant: Apple Inc.
Inventor： James A. Wright , Guanglao Zhang , Raymund W.M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
CPC classification number: H05K5/04 , G06F1/1656 , G06F1/1658 , G06F1/182 , H01Q1/38 , H01Q7/00 , H02J50/10 , H04M1/0202 , H05K5/03 , H05K7/1427
Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
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公开(公告)号：US20180103557A1
公开(公告)日：2018-04-12
申请号：US15581433
申请日：2017-04-28
Applicant: Apple Inc.
Inventor： James A. Wright , Guangtao Zhang , Raymund W.M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
CPC classification number: H05K5/04 , G06F1/182 , H01Q1/38 , H01Q7/00 , H02J50/10 , H04M1/0202 , H05K5/03 , H05K7/1427
Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
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