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49 records (took 0.021 seconds)

    36.
    发明专利
    未知

    公开(公告)号：FI57775B

    公开(公告)日：1980-06-30

    申请号：FI108371

    申请日：1971-04-20

    Applicant: BASF AG

    Inventor： MAYER JOHANN ,  SCHMIDT-HELLERAU CHRISTOF

    IPC: C08G14/06 ,  C09J161/34 ,  C09J3/16

    Abstract: Procedure for obtaining wood glues, which per mole of melamine, or a mixture of at least 15 mole% melamine and up to 85 mole% urea, contain 1.7 to 3.0 moles of formaldehyde and 0.05 mol to 0.2 mol of a phenol, characterized in that in each case 1 mol of melamine and/or urea and from 1.5 to 2.5 mol of formaldehyde are condensed in a known manner in aqueous solution until a compatibility with water of 0.5 to 10 and the condensate is reacted at a ph of 7.5 to 10 and between 45 and 100º c, in each case with 0.05 to 0.2 mol of a phenol, if necessary, with up to 0.5 mol of formaldehyde and, if necessary, with up to 0.5 mol of melamine, until the aqueous solution reaches a viscosity of 300 to 2000 cp, measured with a solids content of 63% and 20ºc. (Machine-translation by Google Translate, not legally binding)

    Multilayer chipboard materials - using different binder resins, with interlayer contg. poly:isocyanate binder
    37.
    发明专利
    Multilayer chipboard materials - using different binder resins, with interlayer contg. poly:isocyanate binder 未知

    公开(公告)号：DE2817495A1

    公开(公告)日：1979-10-31

    申请号：DE2817495

    申请日：1978-04-21

    Applicant: BASF AG

    Inventor： CLAD WERNER DIPL ING DR ,  SCHMIDT-HELLERAU CHRISTOF

    IPC: B27N1/00 ,  B29J5/00

    Abstract: Wood materials, esp. chipboard of Class 100 are made by bonding comminuted ligno-cellulose raw material with a binder under heat and pressure to form multiple layers using different binders, in which an intermediate layer is provided contg. a binder which acts as an adhesion promoter. Improved water-resistance and reduced absorption from use of phenolic resin in outer layers, are combined with high shear and tensile strength from use of aminoplast resin in the middle layer, which also reduces HCHO evolution. Good bonding is obtd., between the alkaline-hardening phenolic resin and the acid-hardening aminoplast resin.

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