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公开(公告)号：DE2817495A1
公开(公告)日：1979-10-31
申请号：DE2817495
申请日：1978-04-21
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , SCHMIDT-HELLERAU CHRISTOF
Abstract: Wood materials, esp. chipboard of Class 100 are made by bonding comminuted ligno-cellulose raw material with a binder under heat and pressure to form multiple layers using different binders, in which an intermediate layer is provided contg. a binder which acts as an adhesion promoter. Improved water-resistance and reduced absorption from use of phenolic resin in outer layers, are combined with high shear and tensile strength from use of aminoplast resin in the middle layer, which also reduces HCHO evolution. Good bonding is obtd., between the alkaline-hardening phenolic resin and the acid-hardening aminoplast resin.
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公开(公告)号：DE2837401A1
公开(公告)日：1980-03-13
申请号：DE2837401
申请日：1978-08-26
Applicant: BASF AG
Inventor： MAYER JOHANN DIPL CHEM DR , CLAD WERNER DIPL ING DR
Abstract: Before adhesive substance is printed on to the panel of cement-bonded wood wool or wood chips, or on to both the panel and the wooden support structure, for the prodn. of a building element, the surface or surfaces are treated with water and a multi-valent isocyanate. A waterproof adhesive such as a formaldehyde condensate or a mixed condensate of melamine and phenol is used, and the process produces a bond which is not loosened by the penetration of water. In addition, the bonding agents used have the advantage of hardening at room temp.
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Patent Agency Ranking
公开(公告)号：DE2746165A1
公开(公告)日：1979-04-19
申请号：DE2746165
申请日：1977-10-14
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , BAUMGAERTNER KURT , MERKEL HEINZ , EUSTACHI WOLFGANG
IPC: G01N19/04
Abstract: Two rollers (3, 4) of dia. about 60 mm and length about 120 mm are mounted in supports (1, 2) and are rigidly attached to driving gear wheels (5, 6). One roller (3) is connected to a drive (10) by way of an elastic coupling (7). The bearings (8, 8a) of the indirectly driven roller are mounted in teh support by means of micrometer screws (9, 9a) so that the separation of the rollers can be varied. The drive motor (10) has a linear torque/drive voltage characteristic and its speed can be monitored by a photo-electric measuring device (11). With the rollers at a predetermined spacing, and driven at a known speed, a measured quantity at adhesive is applied to one of the rollers and the change of speed measured on a recorder (16).
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公开(公告)号：DE2811593A1
公开(公告)日：1979-09-27
申请号：DE2811593
申请日：1978-03-17
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , PFALZGRAF WALTER , SIEGLER MANFRED ING GRAD
Abstract: In the prepn. of multilayer chipboard from adhesive coated wood chips, wood fibres and/or other lignocellulosic contg. materials which are spread in >=3 layers and then hot pressed and in which the covering layers contain a different adhesive from that used in the middle layer, the covering layers contain a polyvalent isocyanate as adhesive and >=1 middle layer contains an aminoplast or phenoplast as binder. The boards can be used in building or as wall coverings as they can be coated and have high water and alkali resistance, hardness, and strength. There is no trouble due to HCHO formation as the outer layers use the isocyanate as adhesive.
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公开(公告)号：DE2732872A1
公开(公告)日：1979-02-08
申请号：DE2732872
申请日：1977-07-21
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , SCHMIDT-HELLERAU CHRISTOF
Abstract: Natural resins of wood chips and comminuted plants, opt. together with HCHO, are used as binders in chipboards and other plant-derived pressed article prodn. On using the plant resins alone, pressing is affected with heating and re-cooling before opening the press tools. No re-cooling is needed when adding HCHO. Use of natural resins, e.g. resin acids, cuts chipboard prodn. costs, e.g. for packaging. Cooling prevents spring-back of pressed chip cakes on opening the hot presses. The addn. of even 2-10 wt. % of 40% formalin (w.r.t. wood chips) solidifies the pressed board sufficiently to allow its handling and removal without cooling.
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公开(公告)号：DE3118021A1
公开(公告)日：1982-11-25
申请号：DE3118021
申请日：1981-05-07
Applicant: BASF AG
Abstract: Low density chipboards are obtained by adding fine-particulate solid paraffin or wax with a melting point above 100 DEG C to the chip mixture to be pressed, cavities being produced by melting the wax after the boards are cured.
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公开(公告)号：DE2647488A1
公开(公告)日：1978-04-27
申请号：DE2647488
申请日：1976-10-21
Applicant: BASF AG
Inventor： CLAD WERNER DIPL ING DR , BAUMGAERTNER KURT
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