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公开(公告)号:AT455157T
公开(公告)日:2010-01-15
申请号:AT06793112
申请日:2006-08-31
Applicant: BASF SE
Inventor: SCHNEIDER NORBERT , LIPPERT GERALD , LOCHTMAN RENE , MAAS HEIKO , PFISTER JUERGEN , SOBOTKA BETTINA , WAGNER NORBERT
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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公开(公告)号:CA2686000A1
公开(公告)日:2008-11-27
申请号:CA2686000
申请日:2008-05-20
Applicant: BASF SE
Inventor: LOCHTMAN RENE , WAGNER NORBERT , HENTSCHEL DIETER , PFISTER JUERGEN , KACZUN JUERGEN
Abstract: The invention relates to a method for producing polymer-coated metal foil s, comprising the following steps: (a) a base layer (7) is applied to a carr ier foil (3) by means of a dispersion (5) containing particles that can be e lectroless-plated or electroplated in a matrix material; (b) the matrix mate rial is at least partially dried and/or at least partially hardened; (c) a m etal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplate d to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufa cturing printed circuit boards.
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公开(公告)号:CA2631180C
公开(公告)日:2014-12-16
申请号:CA2631180
申请日:2006-12-18
Applicant: BASF SE
Inventor: RAFFAELE ADDAMO ANTONINO , NOERENBERG RALF , SOBOTKA BETTINA , DURIS TIBOR , LOCHTMAN RENE , WAGNER NORBERT , SCHNEIDER NORBERT , PFISTER JUERGEN
Abstract: The invention relates to a method for producing a planer metallised textile structure which is characterised in that a planar textile structure (A) is printed with a printing formula which contains at least one metal powder (a) as components, selected from a powder of Zn, Ni, Cu, Sn, Co, Mn, Fe, Mg, Pb, Cr and Bi, or mixtures and alloys of the above-mentioned metals, (B) is thermally treated in one or several steps, and (C) an additional metal is deposited on the planar textile structure.
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公开(公告)号:BRPI0811243A2
公开(公告)日:2014-11-04
申请号:BRPI0811243
申请日:2008-05-20
Applicant: BASF SE
Inventor: LOCHTMAN RENE , KACZUN JUERGEN , WAGNER NORBERT , PFISTER JUERGEN , HENTSCHEL DIETER
Abstract: The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).
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公开(公告)号:BRPI0615863A2
公开(公告)日:2012-12-18
申请号:BRPI0615863
申请日:2006-08-31
Applicant: BASF SE
Inventor: SCHNEIDER NORBERT , LIPPERT GERALD , LOCHTMAN RENE , MAAS HEIKO , PFISTER JUERGEN , SOBOTKA BETTINA , WAGNER NORBERT
Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.
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公开(公告)号:BRPI0806629A2
公开(公告)日:2011-09-13
申请号:BRPI0806629
申请日:2008-01-17
Applicant: BASF SE
Inventor: LOCHTMAN RENE , KACZUN JUERGEN , WAGNER NORBERT , PFISTER JUERGEN
Abstract: Method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps: a) structuring a base layer containing electrolessly and/or electrolytically coatable particles on the substrate by ablating the base layer according to a predetermined structure with a laser, b) activating the surface of the electrolessly and/or electrolytically coatable particles and c) applying an electrically conductive coating onto the structured base layer.
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公开(公告)号:DE502008000952D1
公开(公告)日:2010-08-26
申请号:DE502008000952
申请日:2008-02-19
Applicant: BASF SE
Inventor: LOCHTMAN RENE , WAGNER NORBERT , KACZUN JUERGEN , PFISTER JUERGEN , RAFFAELE ADDAMO ANTONINO , NOERENBERG RALF
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公开(公告)号:DE502007002680D1
公开(公告)日:2010-03-11
申请号:DE502007002680
申请日:2007-04-05
Applicant: BASF SE
Inventor: LOCHTMAN RENE , KACZUN JUERGEN , SCHNEIDER NORBERT , PFISTER JUERGEN , POHL GERT , WAGNER NORBERT
Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
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公开(公告)号:NO20081107A
公开(公告)日:2008-04-07
申请号:NO20081107
申请日:2008-03-04
Applicant: BASF SE
Inventor: LOCHTMAN RENE , WAGNER NORBERT , PFISTER JUERGEN , LIPPERT GERALD , MAAS HEIKO , SCHNEIDER NORBERT , SOBOTKA BETTINA
CPC classification number: H01B1/22 , C09D5/24 , H05K1/095 , H05K3/246 , H05K2201/0245 , H05K2201/0248 , H05K2201/0272 , H05K2201/0347 , Y10T428/25 , Y10T428/256 , Y10T428/258
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