公开(公告)号：US06381164B1

公开(公告)日：2002-04-30

申请号：US09835123

申请日：2001-04-13

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: G11C502

CPC classification number: H05K7/1061 ,  G11C5/063 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/7082 ,  H05K1/112 ,  H05K1/144 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09845 ,  H05K2201/10378 ,  H01L2924/00

Abstract: The present invention provides a low profile, high density electronic package for high speed, high performance semiconductors, such as memory devices. It includes a plurality of modules having high speed, impedance-controlled transmission line buses, short interconnections between modules and, optionally, driver line terminators built into one of the modules, for maintaining high electrical performance. Suitable applications include microprocessor data buses and memory buses such as RAMBUS and DDR. The modules may be formed on conventional printed circuit cards with unpacked or packed memory chips attached directly to the memory module. Thermal control structures may be included to maintain the high density modules within a reliable range of operating temperatures.

Abstract translation: 本发明提供了用于高速，高性能半导体（例如存储器件）的薄型，高密度电子封装。 它包括多个模块，其具有高速，阻抗控制的传输线总线，模块之间的短互连，以及可选地，内置在模块之一中的驱动器线路终端器，用于维持高电气性能。 适用的应用包括微处理器数据总线和诸如RAMBUS和DDR之类的存储器总线。 模块可以在具有直接附接到存储器模块的未包装或打包的存储器芯片的常规印刷电路卡上形成。 可以包括热控制结构以将高密度模块保持在可靠的操作温度范围内。

公开(公告)号：US06370770B1

公开(公告)日：2002-04-16

申请号：US09851212

申请日：2001-05-07

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01R1200

CPC classification number: H01R12/7005 ,  H01R13/2414 ,  Y10T29/4921

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes. Description of the processes to assemble the carrier and overall connector are also disclosed.

Abstract translation: 本发明提供一种载体，其提供改进的保持性，从而导致具有改进的可制造性，可靠性和更均匀的机械和电气性能的LGA插入器连接器。 在一个实施例中，包括介电材料的上部和下部在其间具有粘合剂层的载体包括多个开口，每个开口可以包含单独的接触元件。 在连接器的组装期间，一旦接触元件被插入，粘合剂层被回流，从而允许载体相对于彼此以及对载体捕获接触元件的位置。 或者，载体可以以不包括要回流的粘合剂层的方式实现，仍然提供改进的各个接触元件的保持性。 这些实施例可以更容易组装，并且制造成本更低，特别是在大体积中。 还公开了组装载体和整体连接器的过程的描述。

公开(公告)号：US5252382A

公开(公告)日：1993-10-12

申请号：US753848

申请日：1991-09-03

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  B32B9/00

CPC classification number: H01L23/5283 ,  H01L23/522 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Interconnect structures for integrated circuits and semiconductor chips are disclosed which employ patterned interfaces to minimize stress migration in the interconnects. The interfaces are patterned to have regions of substantially no adhesion and other regions of good adhesion. The regions of substantially no adhesion reduce stress migration in the interconnect, while the regions of good adhesion ensure adequate thermal contact, fabricability and mechanical integrity of the interconnect structures. The patterned interfaces can be formed either by treating the surfaces of the interconnect or adjacent insulator and passivation layers, or by forming patterned interlayers of material in the interfaces. Multiple layer interconnects can also be formed which incorporate similarly patterned interfaces.

Abstract translation: 公开了用于集成电路和半导体芯片的互连结构，其采用图案化接口以使互连中的应力迁移最小化。 界面被图案化以具有基本上没有粘附的区域和其它良好粘合的区域。 基本上没有粘附的区域减少互连中的应力迁移，而良好粘附的区域确保互连结构的热接触，可制造性和机械完整性。 图案化界面可以通过处理互连或相邻绝缘体和钝化层的表面，或者通过在界面中形成图案化的材料夹层来形成。 还可以形成多层互连，其结合类似的图案化界面。

公开(公告)号：US07358603B2

公开(公告)日：2008-04-15

申请号：US11463740

申请日：2006-08-10

Applicant: Che-Yu Li ,  Matti A. Korhonen

Inventor： Che-Yu Li ,  Matti A. Korhonen

IPC: H01L23/04 ,  H01L23/48 ,  H01L23/12 ,  H01L23/053

CPC classification number: H01L23/142 ,  G01R1/0408 ,  G01R31/2886 ,  H01L21/486 ,  H01L24/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/45 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/83136 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0203 ,  H05K3/32 ,  H05K3/341 ,  H05K2201/10378 ,  H05K2201/10719 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

Abstract translation: 一种高密度电气封装，利用一系列高性能可拆卸的电触点，例如UEC，T-Spring，F-Spring及其等效元件，它们以一种或多种元件与衬底之间的插入物形式存在于载体中。 载体由导热金属制成，或者包含导热金属，除了保持和对准电触头的功能外，还提供散热或散热功能。 上述插入器用于封装中的单个芯片或一堆芯片的芯片连接。 插入器通过单独的电接触提供电连接到另一个芯片或封装的基板。 它还为与特定插入件热连接的芯片提供散热或散热功能。 必要时，内插器可进一步与外部散热器进行热连接。

公开(公告)号：US20080036071A1

公开(公告)日：2008-02-14

申请号：US11463740

申请日：2006-08-10

Applicant: Che-Yu Li ,  Matti A. Korhonen

Inventor： Che-Yu Li ,  Matti A. Korhonen

IPC: H01L23/12

CPC classification number: H01L23/142 ,  G01R1/0408 ,  G01R31/2886 ,  H01L21/486 ,  H01L24/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/45 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/83136 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0203 ,  H05K3/32 ,  H05K3/341 ,  H05K2201/10378 ,  H05K2201/10719 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

Abstract translation: 一种高密度电气封装，利用一系列高性能可拆卸的电触点，例如UEC，T-Spring，F-Spring及其等效元件，它们以一种或多种元件与衬底之间的插入物形式存在于载体中。 载体由导热金属制成，或者包含导热金属，除了保持和对准电触点的功能外，还提供散热或散热功能。 上述插入器用于封装中的单个芯片或一堆芯片的芯片连接。 插入器通过单独的电接触提供电连接到另一个芯片或封装的基板。 它还为与特定插入件热连接的芯片提供散热或散热功能。 必要时，内插器可进一步与外部散热器进行热连接。

公开(公告)号：US20070105406A1

公开(公告)日：2007-05-10

申请号：US11334993

申请日：2006-01-18

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2435 ,  H01R13/03

Abstract: An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. A connector system having a housing that has a plurality of through openings. A plurality of electrical contacts, each being formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. Each of the electrical contacts is arranged within a corresponding one of the plurality of through openings such that the first contact edge is positioned outside of the through-opening in which electrical contact is positioned, and the second contact edge is positioned outside of the through-opening in which electrical contact is positioned, but spaced from the first contact edge.

Abstract translation: 由柔性折叠片形成的电接触件包括顶表面，底表面，第一接触边缘和第二接触边缘。 在顶表面和底表面上形成多个波纹，其终止于第一接触边缘和第二接触边缘。 一种具有壳体的连接器系统，该壳体具有多个通孔。 多个电触头，每个电触头由兼容的折叠片形成，包括顶表面，底表面，第一接触边缘和第二接触边缘。 在顶表面和底表面上形成多个波纹，其终止于第一接触边缘和第二接触边缘。 每个电接触件布置在所述多个通孔中的相应的一个中，使得所述第一接触边缘位于所述通孔的外侧，在所述通孔中位于所述通孔中，并且所述第二接触边缘位于所述通孔的外侧， 开口，其中电接触被定位，但是与第一接触边缘隔开。

公开(公告)号：US20060189176A1

公开(公告)日：2006-08-24

申请号：US11375657

申请日：2006-03-13

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2464 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact. An electrical contact may also be formed by folding a portion of the unitary structure so as to form one or more pleats, annealing the pleated unitary structure, and then cutting the pleated unitary structure so as to release one or more electrical contacts. The precursor material may also be formed by photo-etching a sheet of conductive material so as to form a mesh, and then annealing the mesh. A connector system may be formed including a housing defining a plurality of openings that are each filled with an electrical contact comprising a plurality of interlaced and annealed wires that have been previously either rolled or pleated.

公开(公告)号：US20060094269A1

公开(公告)日：2006-05-04

申请号：US11299518

申请日：2005-12-12

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R4/58

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/03 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, nonwoven mesh (60), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (60) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (60) is free of internal elastic strain, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

公开(公告)号：US07029289B2

公开(公告)日：2006-04-18

申请号：US11082364

申请日：2005-03-17

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2464 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

公开(公告)号：US07029288B2

公开(公告)日：2006-04-18

申请号：US10940457

申请日：2004-09-14

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R9/09

CPC classification number: H01L23/49827 ,  G01R1/0466 ,  G01R1/06755 ,  H01L21/486 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/58 ,  H01R12/52 ,  H01R12/714 ,  H01R12/716 ,  H01R13/24 ,  H01R13/2407 ,  H01R13/33 ,  H05K3/325 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electrical contact (2) and method of making the electrical contact (2), and a connector (11) and method making the connector (11), wherein the electrical contact (2) is an electrically conducting, interlaced mesh (40), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (2), wherein the mesh (40) is annealed while restrained in the form of the electrical contact (2) wherein the mesh (40) is free of internal elastic strain, or the mesh (40) is hardened, and wherein the connector (11) retains the electrical contact (2) for edgewise connection.

Abstract translation: 电触头（2）和制造电触头（2）的方法，以及制造连接器（11）的连接器（11）和方法，其中电触头（2）是导电的交织网（40）， 所述网状物的边缘为所述电接触件（2）的沿边电连接提供多个接触点，其中所述网状物（40）在电接触（2）的形式被退火，其中所述网状物（40）不含 内部弹性应变或网格（40）被硬化，并且其中连接器（11）保持用于沿边连接的电触点（2）。