公开(公告)号：US20150050863A1

公开(公告)日：2015-02-19

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20140370794A1

公开(公告)日：2014-12-18

申请号：US14476680

申请日：2014-09-03

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/32 ,  H01L21/304

CPC classification number: B24B37/32 ,  B24B37/005 ,  B24B49/16 ,  H01L21/304

Abstract: A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.

Abstract translation: 公开了一种能够精确控制晶片的抛光轮廓，特别是边缘部分的抛光轮廓的抛光装置。 抛光装置包括：顶环轴; 固定到顶环轴的壳体; 柔性膜，其构造成将晶片压靠在抛光垫上; 构造成保持柔性膜的顶环体; 保持环，其联接到所述顶环体并且被设置成围绕所述柔性膜; 万向架机构，其构造成允许顶环主体和保持环相对于壳体倾斜; 以及局部负载施加机构，其构造成在保持环的一部分上施加向下的局部负载。

公开(公告)号：US20130196573A1

公开(公告)日：2013-08-01

申请号：US13752659

申请日：2013-01-29

Applicant: Ebara Corporation

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI

IPC: B24B37/32 ,  B24B37/04

CPC classification number: B24B37/32 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.

Abstract translation: 衬底保持器是用于保持衬底并将其按压在抛光垫上的装置。 衬底保持器包括：内保持环，其可独立于顶环体垂直移动并且布置在衬底周围; 内部按压机构，用于将内部保持环压靠在抛光垫的抛光表面上; 外保持环，能够独立于内保持环和顶环体垂直移动; 将外保持环压靠在研磨面上的外压机构; 以及支撑机构，用于在抛光基板期间接收从衬底施加到内保持环的横向力，并且可倾斜地支撑外保持环。

公开(公告)号：US20130136884A1

公开(公告)日：2013-05-30

申请号：US13687263

申请日：2012-11-28

Applicant: EBARA Corporation

Inventor： Hozumi YASUDA ,  Katsuhide WATANABE ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Makoto FUKUSHIMA ,  Satoru YAMAKI ,  Shingo TOGASHI

IPC: B32B3/08

CPC classification number: B32B3/08 ,  B24B37/30 ,  B32B3/18 ,  B32B27/12 ,  Y10T428/21 ,  Y10T428/24174 ,  Y10T428/24851

Abstract: There is provided an elastic membrane which can uniformly reduce deformation (elongation) of its contact portion, having a contact surface for contact with a substrate, along the contact surface in substantially the entire area of the contact portion from the center to the periphery. The elastic membrane includes a contact portion having a contact surface for contact with the substrate; a first peripheral wall portion coupled to the peripheral end of the contact portion and extending upwardly; and a second peripheral wall portion located on the inside of the first peripheral wall portion, coupled to the contact portion and extending upwardly, and defining a first chamber on the outer side thereof and a second chamber on the inner side thereof. In the elastic membrane, substantially the entire area of the contact portion is reinforced with a reinforcing member having a higher rigidity than the elastic membrane.

Abstract translation: 提供了一种弹性膜，其能够均匀地减小其接触部分的接触部分的变形（伸长率），该接触部分具有与基板接触的接触表面，沿接触表面沿接触部分的中心到周边的大致整个区域。 弹性膜包括具有与基板接触的接触表面的接触部分; 耦合到所述接触部分的外周端并向上延伸的第一周壁部分; 以及位于所述第一周壁部分的内侧的第二周壁部分，其联接到所述接触部分并向上延伸，并且在其外侧上限定第一室，在其内侧限定第二室。 在弹性膜中，基本上接触部分的整个区域都被具有比弹性膜高的刚性的加强件增强。