公开(公告)号：JPH06310054A

公开(公告)日：1994-11-04

申请号：JP9976693

申请日：1993-04-26

Applicant: FUTABA DENSHI KOGYO KK

Inventor： NAMIKAWA MAMORU ,  YAMAURA TATSUO ,  OGAWA YUKIO ,  MAKITA YOSHIO ,  YOSHIMURA TOMOSHI

IPC: H01J9/24 ,  H01J29/86 ,  H01J29/87 ,  H01J31/12 ,  H01J31/15

Abstract: PURPOSE:To arrange column members having a uniform height between an anode substrate and a cathode substrate in an image display device formed by using a field emission element. CONSTITUTION:A glass pattern 3 having a low softening point is arranged on an anode substrate 2 while keeping away from phosphor layers 4. A bundle of hardened glass fiber 6 is sliced in a prescribed length. Ni 13 is applied to one end of the glass fiber. Paste 14 containing magnet powder is filled in a recess formed in a desired pattern on a glass substrate 7. One end of the glass fiber is held by magnetic force, and a glass substrate 12 is fixed to the other end by an adhesive 11. The other end of the glass fiber is fitted to the glass pattern of the anode substrate 2, and these are baked, and are fixed to each other.

公开(公告)号：JP2000128556A

公开(公告)日：2000-05-09

申请号：JP31053698

申请日：1998-10-30

Applicant: FUTABA DENSHI KOGYO KK

Inventor： SHIMIZU HIDEYUKI ,  MAKITA YOSHIO

IPC: B26F3/16 ,  B23K26/382 ,  C03B33/09 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a hole of a glass substrate which does not require processing by a tool, hardly generates particles and dispenses with a shorter processing time. SOLUTION: A glass substrate 2 is irradiated with a laser beam along a hole shape 1 and is heated to a temperature close to its softening temperature. The glass substrate is cooled right after the heating and a crack surface 3 along the hole shape is internally formed. The rear surface of the glass substrate 2 is heated by a heating means 10. While a hole plate part 4 is cooled from the front surface, the hole plate part is sucked and held. The hole plate part 4 shrinks and the portions exclusive of the hole plate part 4 of the glass substrate 2 expand. The crack surface 3 breaks and the hole plate part 4 is taken out of the hole.

公开(公告)号：JP2956590B2

公开(公告)日：1999-10-04

申请号：JP15294296

申请日：1996-05-27

Applicant: FUTABA DENSHI KOGYO KK

Inventor： MAKITA YOSHIO ,  YOSHIMURA TOMOSHI ,  ITO SHIGEO

IPC: B23P19/00 ,  H01J9/18 ,  H01J9/24 ,  H01J29/02 ,  H01J29/86 ,  H01J31/12

公开(公告)号：JP2904089B2

公开(公告)日：1999-06-14

申请号：JP92096

申请日：1996-01-08

Applicant: FUTABA DENSHI KOGYO KK

Inventor： KADOWAKI AKIRA ,  ITO SHIGEO ,  MAKITA YOSHIO ,  OZAWA KATSUNOSUKE ,  UEKI KOJI ,  YOSHIKATA SATOSHI

IPC: B26F3/00 ,  B28D5/00 ,  C03B33/033 ,  C03B33/10

公开(公告)号：JPH10208671A

公开(公告)日：1998-08-07

申请号：JP1537797

申请日：1997-01-29

Applicant: FUTABA DENSHI KOGYO KK

Inventor： ITO SHIGEO ,  MAKITA YOSHIO ,  HONDA KENICHI ,  YAMAURA TATSUO

IPC: H01J29/87 ,  H01J1/52 ,  H01J3/18 ,  H01J5/03 ,  H01J7/18 ,  H01J29/02 ,  H01J29/06 ,  H01J29/62 ,  H01J29/82 ,  H01J29/94 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To keep a space between substrates stably by improving the stress resistance and a characteristic of the buckling resistance, so as to prevent a deformation caused by the atmospheric pressure from the outer side. SOLUTION: On the inner surface of an anode substrate 2, a display 6 consisting of an anode conductor 4 and a phosphor layer 5 is formed. On the inner surface of a cathode substrate 3, the anode substrate 2 and its electronic source are formed opposing to the display 6. An envelope 1 is composed by sealing the anode substrate 2 and the cathode substrate 3 on the outer periphery by placing a specific interval. A supporting member 15 is housed and provided in the envelope 1. The supporting member 15 furnishes a plate member 16 forming plural through holes 18 at specific intervals, and stays for reinforcement 19 inserted to the through holes 18 and their central parts in the axial direction are fixed to the through holes 18. In the stays 19 for reinforcement, both ends 19a and 19b are abutted to the inner surfaces of the anode substrate 2 and the cathode substrate 3 to support them, and they maintain between the anode substrate 2 and the cathode substrate 3 at a specific interval.

公开(公告)号：JPH1021829A

公开(公告)日：1998-01-23

申请号：JP19271496

申请日：1996-07-04

Applicant: FUTABA DENSHI KOGYO KK

Inventor： ITO SHIGEO ,  MAKITA YOSHIO ,  TONEGAWA TAKESHI ,  HIRATA YOSHIHIKO ,  KADOWAKI AKIRA

IPC: H01J9/24 ,  H01J9/38 ,  H01J9/385 ,  H01J9/39 ,  H01J9/40 ,  H01J29/94 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To enable manufacturing of plural vacuum air tight container simultaneously in mass production by forming plural exhaust holes for a first multiple substrate, and surface-sticking a second multiple substrates thereto and cutting it. SOLUTION: Plural exhaust holes 6 are formed for plural field emission cathodes formed on a first multiple substrate 2'. A column is formed on either the first multiple substrate 2' or a second multiple substrate 3', a sealing member 8 is applied, and the first multiple substrate 2' and the second multiple substrate 3' are surface-sticked each other. A getter box provided with an exhaust tube 5 is placed at an exhaust hole 6 formed on the first multiple substrate 2'. A sealing member 8 is heated and fused, and the first multiple substrate 2' and the second multiple substrate 3' are sealed each other. Next, plural vacuum air tight containers 1 are separated by cutting. Air is exhausted from an exhaust tube 5 provided with each vacuum air tight container 1 whose inside is evacuated, and an exhaust tube 5 is sealed.

公开(公告)号：JPH08268728A

公开(公告)日：1996-10-15

申请号：JP92096

申请日：1996-01-08

Applicant: FUTABA DENSHI KOGYO KK

Inventor： KADOWAKI AKIRA ,  ITO SHIGEO ,  MAKITA YOSHIO ,  OZAWA KATSUNOSUKE ,  UEKI KOJI ,  YOSHIKATA SATOSHI

IPC: B26F3/00 ,  B28D5/00 ,  C03B33/033 ,  C03B33/10

Abstract: PURPOSE: To provide a sheet glass cutter capable of cracking sheet glass having a width small relative to a thickness without any trouble and dealing with a fluctuation in the thickness. CONSTITUTION: A glass substrate 10 is placed on a pair of horizontal holding tables 4, 4 installed apart a spacing and is held on the holding surfaces 4a of these holding tables by attraction means. A cutter 3 forms a groove 10a of a straight line on the rear surface of the glass substrate 10. A pair of the holding tables 4, 4 supported by link mechanisms 5a, 5b are moved to a high position on the outer side from a horizontal state by driving cylinders. The respective holding tables 4, 4 rotate upward around the groove 10a within the plane orthogonal with the longitudinal direction of the groove 10a. The glass substrate 10 is kept held by the respective holding table 4, 4 and is, therefore, cracked along the groove 10a.

公开(公告)号：JPH0689662A

公开(公告)日：1994-03-29

申请号：JP23868392

申请日：1992-09-07

Applicant: FUTABA DENSHI KOGYO KK

Inventor： YAMAURA TATSUO ,  OGAWA YUKIO ,  MAKITA YOSHIO ,  NAMIKAWA MAMORU ,  YOSHIMURA TOMOSHI

IPC: H01J9/24

Abstract: PURPOSE:To make partitions uniform in height on a substrate without damaging an ITO film on the substrate and uniformly provide phosphors between the partitions. CONSTITUTION:A photosensitive paste 3 is stuck to an ITO film 2 on a substrate 1, and low-softening point glass patterns are formed by photolithography with a photo-mask 4. Phosphors 6 are uniformly formed between the low- softening point glass patterns 5, 5. A plate glass 10 is stuck to a partition holding plate 8, and resist 11 is provided on it. Photolithography is applied with a photo-mask 12 of the same patterns as those of the photo-mask 4 to obtain the resist of the preset patterns. Sand blast is applied, and the plate glass 10 is machined to form screens 13 of the preset patterns. The screen holding plate 8 is reversed and positioned on the substrate 1, and the partitions 13 are overlapped on the low-softening point glass patterns 5 on the substrate 1. The substrate 1 and the screens 13 are fixed by baking, and the partition holding plate 8 is removed.

公开(公告)号：JPH11126037A

公开(公告)日：1999-05-11

申请号：JP29102997

申请日：1997-10-23

Applicant: FUTABA DENSHI KOGYO KK

Inventor： HONDA KENICHI ,  MAKITA YOSHIO ,  NAMIKAWA MAMORU

IPC: G09F9/33 ,  H01L33/62 ,  H01L33/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor display device producing method simple in production process and high in the positioning precision of light emitting diode elements. SOLUTION: An adhesive tape is stuck to an electrically conductive substrate and the substrate side of a wafer having a light emitting diode layer. Then, the wafer is divided to form plural light emitting elements 4. An operating means is used to suck in the elements 4 from plural positioning holes and to hold the elements 4. Then, the strength of the adhesive tape is reduced, and the tape is arranged at the location close to the elements 4, and the elements 4 are sucked in to hold the elements 4 in the holes. Then, an adhesive 21 is applied on the base body 6 side of the elements 4 being held. Then, the base body 6 side of the elements 4 are adhered to the prescribed positions of the inner surface of a back surface substrate 23. Then, a light emitting diode 7 of the element 4 and the inner surface of a transparent front surface substrate 26 are placed opposing to each other and an elastic sealing material 27 is provided between the both substrates. Then, the inner section of the inner space is evacuated, sealed and the inner surface of the substrate 26 is contacted to the diodes 7 and fixed.

公开(公告)号：JPH1179387A

公开(公告)日：1999-03-23

申请号：JP25166197

申请日：1997-09-17

Applicant: FUTABA DENSHI KOGYO KK

Inventor： YAMAMOTO NOBORU ,  MAKITA YOSHIO

IPC: B65G49/06

Abstract: PROBLEM TO BE SOLVED: To transport and move a glass substrate by preventing chipping off of a corner part thereof formed by cut faces without generating dust even if it is the unpolished glass substrate immediately after cutting. SOLUTION: This holder has a frame body in which right and left side plates 3 which face mutually and vertically are opened in the forward and backward mounting directions for both side ends of a horizontal top plate 1 and a ground plate 2. A support part 6 which supports bottom face fringes of a plurality of unpolished glass substrates 14 which protrude at a predetermined interval in the vertical direction of the side plate 3 to oppose horizontally between each side plate 3 for each inner wall face of each side plate 3 and are cut to a predetermined size is provided. Moreover, a locking member which protrudes in the horizontal direction at an upper position of a horizontal line of each opposing support part 6 on each inner wall face of each side plate 3 and on a rear side between each side plate 3 and comes in contact with cut faces at side ends of each glass substrate 14 of which protruded end part is supported by each support part 6 is provided. Consequently, it does not come in contact with a corner part formed by the cut faces of the glass substrate 14 so as to prevent chipping off of the corner part so that transportation and travel can be done without generating dust.