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    OVERFILL-TOLERANT MICROFLUIDIC STRUCTURES
    32.
    发明申请
    OVERFILL-TOLERANT MICROFLUIDIC STRUCTURES 审中-公开

    公开(公告)号：WO2022235272A1

    公开(公告)日：2022-11-10

    申请号：PCT/US2021/031344

    申请日：2021-05-07

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  SHKOLNIKOV, Viktor ,  KEEFE, Brian J.

    IPC: C12Q1/6806 ,  G01N33/569 ,  B01F23/411 ,  B81B1/00

    Abstract: An example overfill-tolerant microfluidic structure can include an inlet microfluidic channel. A sample chamber can be connected to the inlet microfluidic channel to receive liquid from the inlet microfluidic channel. A gas-permeable liquid barrier can be connected to the sample chamber and positioned to allow gas to flow out of the sample chamber. An overflow chamber can be connected to the inlet microfluidic channel. A capillary break can be positioned between the inlet microfluidic channel and the overflow chamber. The capillary break can include a narrowed opening with a smaller width than a width of the inlet microfluidic channel. In some examples, the gas-permeable liquid barrier can allow gas to flow out of the sample chamber at a pressure lower than the break pressure, and prevent liquid from flowing out of the sample chamber at the break pressure.

    FLUID STRUCTURE FORMATION VIA REMOVING SACRIFICIAL STRUCTURES
    33.
    发明申请
    FLUID STRUCTURE FORMATION VIA REMOVING SACRIFICIAL STRUCTURES 审中-公开

    公开(公告)号：WO2021225599A1

    公开(公告)日：2021-11-11

    申请号：PCT/US2020/032013

    申请日：2020-05-08

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W.

    IPC: B81C3/00 ,  B81B1/00 ,  B01L3/00

    Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, sacrificial structures that define fluid structures to be formed on a fluid analysis device and interconnect structures that define electrical interconnects to be formed on the fluid analysis device are formed on a surface. The structures are embedded in a plastic compound and multiple layers of plastic compound embedded with structures are stacked. The fluid structures are formed by removing the sacrificial structures.

    DIGITAL MICROFLUIDICS DEVICE WITH DROPLET PROCESSING COMPONENTS
    36.
    发明申请
    DIGITAL MICROFLUIDICS DEVICE WITH DROPLET PROCESSING COMPONENTS 审中-公开

    公开(公告)号：WO2021015763A1

    公开(公告)日：2021-01-28

    申请号：PCT/US2019/043280

    申请日：2019-07-24

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CUMBIE, Michael W. ,  SHKOLNIKOV, Viktor ,  CHEN, Chien-Hua

    IPC: G01N27/00 ,  B81B7/02 ,  B01L11/00

    Abstract: An example digital microfluidics device includes a device body having a primary substrate defining a planar primary substrate surface; a plurality of droplet processing components having respective component substrates overmolded in the primary substrate in a coplanar arrangement with the primary substrate surface; and an electrical interface carried on the primary substrate surface, the electrical interface defining a planar droplet manipulation surface and carrying a set of droplet manipulation electrodes adjacent to the droplet manipulation surface; the electrical interface configured to interconnect the droplet manipulation electrodes and at least a portion of the droplet processing components.

    FLUID EJECTION POLYMERIC RECIRCULATION CHANNEL
    37.
    发明申请
    FLUID EJECTION POLYMERIC RECIRCULATION CHANNEL 审中-公开

    公开(公告)号：WO2020263235A1

    公开(公告)日：2020-12-30

    申请号：PCT/US2019/039077

    申请日：2019-06-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CHEN, Chien-Hua ,  CUMBIE, Michael W. ,  CHOY, Si-Iam J.

    IPC: B41J2/14 ,  B41J2/18

    Abstract: A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.

    FLUID FEED HOLE PORT DIMENSIONS
    40.
    发明申请
    FLUID FEED HOLE PORT DIMENSIONS 审中-公开

    公开(公告)号：WO2020145969A1

    公开(公告)日：2020-07-16

    申请号：PCT/US2019/012926

    申请日：2019-01-09

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： CLARK, Garrett E. ,  CUMBIE, Michael W.

    IPC: B41J2/14

    Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.

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