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公开(公告)号：CA1141695A
公开(公告)日：1983-02-22
申请号：CA288228
申请日：1977-10-06
Applicant: IBM
Inventor： CASTELLANI EUGENE E , POWERS JOHN V , ROMANKIW LUBOMYR T
IPC: C25D7/00 , C25D3/56 , C25D5/08 , C25D17/00 , C25D21/12 , G11B5/31 , G11B5/858 , H01F10/14 , H01F41/14 , H01F41/26 , C25D5/02
Abstract: MAGNETOSTRICTIVE ALLOY THIN FILM ELECTROPLATING METHOD A thin film of low magnetostriction Permalloy* 80% nickel - 20% iron ? 1% is electroplated onto a substrate in a bath having a ratio of from 5.8:1 to 23:1 ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of from 25:1 to 86:1 with a current density of from 2 ma/cm2 - 60 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. The Fe++ ion concentration required is inverse to the circulation of bath fluid across the substrate. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe ++, 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6. * Trade Mark
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公开(公告)号：CA1072389A
公开(公告)日：1980-02-26
申请号：CA254962
申请日：1976-06-16
Applicant: IBM
Inventor： PFEIFFER ALOYSIUS T , ROMANKIW LUBOMYR T
IPC: G03F1/20 , H01L21/027 , B05D3/06
Abstract: METHODS FOR FORMING THICK SELF-SUPPORTING MASKS A method of constructing a relatively thick, self-supporting mask suitable for electron beam projection processes. Thickness is achieved by multiple steps of coating with resist, exposure and development. Either positive or negative resist may be used for second and subsequent coatings. Second and subsequent exposures are directed through the first relatively thin mask formed and through the substrate to eliminate critical alignment of subsequent masks. When desired thickness is achieved an even thicker frame may be fabricated for support purposes and the mask may then be lifted off the substrate on which it had rested during the fabrication steps. When positive resist is employed, the resist remaining after development is baked on to give added structural strength to the mask. This baked resist can be coated with an additional layer of metal by evaporation or sputtering to give greater mechanical strength. When negative resist is employed, the portions of the resist protected by the relatively thin previously formed mask are removed and additional material is plated to increase the thickness and strength of the mask. The unprotected resist material is then also removed. The completed mask can be further strengthened by evaporating or sputtering an additional layer of metal or oxide.
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公开(公告)号：CA1039849A
公开(公告)日：1978-10-03
申请号：CA232202
申请日：1975-07-24
Applicant: IBM
Inventor： ROMANKIW LUBOMYR T
Abstract: INTEGRATED MAGNETORESISTIVE READ, INDUCTIVE WRITE, BATCH FABRICATED MAGNETIC HEAD A thin film head includes a permeable substrate providing a first shield, which may include a more highly permeable layer on its upper surface for shielding, a layer of permeable material thereon providing a second shield and a first write head leg referred to as the shielding-leg layer and a magnetic gap filled with dielectric material between the substrate and the shielding-leg layer. A magnetoresistive stripe including permeable material extends within the dielectric in said gap near the tip end of the head spaced from the substrate and the shielding-leg layer. An inductive single turn or multiturn writing winding is formed upon a layer of dielectric on the other side of the shielding-leg layer. A second leg layer covers the half of the spiral winding towards the tip end of the head and extends through an opening into contact with the shielding-leg layer.
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公开(公告)号：FR2354633A1
公开(公告)日：1978-01-06
申请号：FR7714017
申请日：1977-05-03
Applicant: IBM
Inventor： ANDERSON RONALD L , CASTELLANI EUGENE E , MCCAFFREY PATRICK M , ROMANKIW LUBOMYR T
IPC: H05K3/18 , C25D5/02 , H01L21/768 , H05K3/10 , H05K3/24 , H05K3/38 , H01L21/441
Abstract: A metal pattern is made by selective electroplating on an underlay. A substrate is coated with a layer (I) providing adhesion, and then an underlay (II) followed by a thin, non-platable layer (III) onto which a mask is applied, forming a negative pattern. The exposed zone (IV) of layer (III) are removed; and the exposed zones of the underlay (II) are electroplated; then, and as required, the mask the remainder of layer (III), the bare underlay (II), and opt. layer (I), can be removed. Underlay (II) is pref. metal, esp. Cr, Ti, Ta, Nb, or Hf, whereas layer (III) is dielectric, esp. SiO2, Si3N4, Al2O3, SiO, an organo-silicate, or a polymer. Zones (IV) are pref. removed by plasma etching in at atmos. of C2Cl3F3 or C2Cl3F3 plus O2. The electroplated pattern is pref. Au, Cu, Ni, Ni-Fe, Pt, Pd, or their alloys with other metals; a lacquer mask is pref. used, whereas layer (I) is Cr, Ti, Ta, Nb, Al, Hf, or similar metals, and 100-1000 A thick. Underlay (II) is pref. 100-2000 A thick, and layer (III) 450 A thick. Method is used for providing metal patterns on microelectronic components; magnetic cylinder domin- or magnetic- components. Gold patterns for example, can be obtd. which do not lift off at their edges.
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公开(公告)号：DE69612897D1
公开(公告)日：2001-06-28
申请号：DE69612897
申请日：1996-02-13
Applicant: IBM
Inventor： CHAINER TIMOTHY J , ROMANKIW LUBOMYR T
Abstract: An integrated microfile includes a rotatably supported magnetic disk for storing data and a micromotor for rotating the disk. The micromotor includes a rotor fixedly joined to the disk and having a plurality of rotor poles. A stator includes a plurality of stator poles positioned around the rotor for sequentially cooperating with respective ones of the rotor poles for rotating the rotor to rotate the disk. A selectively movable access head is disposed adjacent to the disk for selectively addressing the data on the disk. The microfile may be fabricated using lithographic and electroplating techniques in subform-factor sizes in an exemplary embodiment.
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Patent Agency Ranking
公开(公告)号：DE69113845D1
公开(公告)日：1995-11-23
申请号：DE69113845
申请日：1991-03-02
Applicant: IBM
Inventor： GUPTA ARUNAVA , HABA BELGACEM , HUSSEY BRIAN W , ROMANKIW LUBOMYR T
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公开(公告)号：CA1139009A
公开(公告)日：1983-01-04
申请号：CA353720
申请日：1980-06-10
Applicant: IBM
Inventor： MIERSCH EKKEHARD F , ROMANKIW LUBOMYR T
IPC: H05K1/05 , H01L21/60 , H01L23/12 , H01L23/14 , H01L23/52 , H01L23/538 , H05K1/11 , H05K3/32 , H05K3/46 , H05K1/18
Abstract: THIN FILM METAL PACKAGE FOR LSI CHIPS An integrated circuit board for mounting very high density chips of small size on its top surface including conductor planes for carrying very large values of .DELTA.I (transient current) is constructed with a plurality of essentially flat parallel power planes serving as conductive leads to the chip connectors (pins or solder balls). The land areas on the top surface of the board are connected to conductors below by integrated coaxial conductor extensions from the planes having a high degree of capacitive coupling to adjacent conductor planes. YO978-065
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公开(公告)号：FR2316635A1
公开(公告)日：1977-01-28
申请号：FR7618498
申请日：1976-06-14
Applicant: IBM
Inventor： PFEIFFER ALOYSIUS T , ROMANKIW LUBOMYR T
IPC: G03F1/20 , H01L21/027 , G03F1/02 , G03F9/00
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公开(公告)号：FR2301077A1
公开(公告)日：1976-09-10
申请号：FR7600768
申请日：1976-01-08
Applicant: IBM
Inventor： ANDERSON RONALD L , CASTELLANI EUGENE E , MCCAFFREY PATRICK M , ROMANKIW LUBOMYR T
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公开(公告)号：CA832429A
公开(公告)日：1970-01-20
申请号：CA832429D
Applicant: IBM
Inventor： ROMANKIW LUBOMYR T , POWERS JOHN V
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