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    MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNECTED THROUGH WAVEGUIDES
    32.
    发明申请
    MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNECTED THROUGH WAVEGUIDES 审中-公开
    使用通过波形连接的无线接口的微电子封装通信

    公开(公告)号：WO2017052656A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2015/052485

    申请日：2015-09-25

    Applicant: INTEL CORPORATION

    Inventor： OSTER, Sasha N. ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  DOGIAMIS, Georgios C. ,  RAWLINGS, Brandon M.

    IPC: G06F13/14 ,  G06F13/00 ,  H01R11/01 ,  H04M9/06

    CPC classification number: G06F13/00 ,  G06F13/14 ,  H04M9/06

    Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

    Abstract translation: 描述了使用通过波导连接的无线电接口的微电子封装通信。 一个示例包括集成电路芯片，用于承载集成电路芯片的封装衬底，具有用于将集成电路芯片连接到外部组件的导电连接器的封装衬底以及耦合到无线电芯片的封装衬底上的无线电装置以调制数据 并且传送调制数据。 波导连接器耦合到介质波导以从无线电接收传输的调制数据并将其耦合到波导中，波导将调制的数据传送到外部组件。

    CROSS TALK AND INTERFERENCE REDUCTION FOR HIGH FREQUENCY WIRELESS INTERCONNECTS
    33.
    发明申请
    CROSS TALK AND INTERFERENCE REDUCTION FOR HIGH FREQUENCY WIRELESS INTERCONNECTS 审中-公开
    用于高频无线互联的交叉和干扰减少

    公开(公告)号：WO2017052566A1

    公开(公告)日：2017-03-30

    申请号：PCT/US2015/052063

    申请日：2015-09-24

    Applicant: INTEL CORPORATION

    Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  DOGIAMIS, Georgios C.

    IPC: H01Q1/52 ,  H01Q1/38

    CPC classification number: H01Q1/38 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q1/525 ,  H01Q21/28

    Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

    Abstract translation: 本发明的实施例可以包括可用于减少相邻天线之间的串扰的封装装置。 在一个实施例中，封装的器件可以包括安装到印刷电路板（PCB）的第一封装衬底。 多个第一天线也可以形成在第一封装上。 实施例还可以包括安装到PCB的第二封装衬底，并且第二封装衬底可以包括第二多个天线。 根据实施例，通过在第一和第二封装之间形成引导结构来减少第一和第二多个天线之间的串扰。 在一个实施例中，引导结构包括在第一天线和第二天线之间限定多个通路的多个翅片。

    REDUCED DISPERSION DIELECTRIC WAVEGUIDES
    35.
    发明申请
    REDUCED DISPERSION DIELECTRIC WAVEGUIDES 审中-公开

    公开(公告)号：WO2019221885A1

    公开(公告)日：2019-11-21

    申请号：PCT/US2019/029032

    申请日：2019-04-25

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  BRAUNISCH, Henning ,  SWAN, Johanna M.

    IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00

    Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

    PLUGGABLE MM-WAVE MODULE FOR RACK SCALE ARCHITECTURE (RSA) SERVERS AND HIGH PERFORMANCE COMPUTERS (HPCS)
    39.
    发明申请
    PLUGGABLE MM-WAVE MODULE FOR RACK SCALE ARCHITECTURE (RSA) SERVERS AND HIGH PERFORMANCE COMPUTERS (HPCS) 审中-公开

    公开(公告)号：WO2018128617A1

    公开(公告)日：2018-07-12

    申请号：PCT/US2017/012367

    申请日：2017-01-05

    Applicant: INTEL CORPORATION

    Inventor： DOGIAMIS, Georgios ,  OSTER, Sasha ,  KAMGAING, Telesphor

    IPC: H01P5/08 ,  H01P3/16 ,  G06F15/16

    Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

    MULTIPLEXER AND COMBINER STRUCTURES EMBEDDED IN A MMWAVE CONNECTOR INTERFACE
    40.
    发明申请
    MULTIPLEXER AND COMBINER STRUCTURES EMBEDDED IN A MMWAVE CONNECTOR INTERFACE 审中-公开

    公开(公告)号：WO2018128615A1

    公开(公告)日：2018-07-12

    申请号：PCT/US2017/012364

    申请日：2017-01-05

    Applicant: INTEL CORPORATION

    Inventor： KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  SWAN, Johanna

    IPC: H01P5/18 ,  H01P1/207 ,  H01P5/103

    Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 µm and 1,000 µm

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