Abstract:
PROBLEM TO BE SOLVED: To provide a composition for resist underlay film which is excellent in adhesiveness with a resist film, can improve the reproducibility of a resist pattern, has durability against an alkali solution used for development or the like and against oxygen ashing upon removing the resist, can form a resist underlay film less in permeation amount of a resist material, and is excellent in storage stability. SOLUTION: The composition for a resist underlay film contains a solvent and polysiloxane containing a structural unit having a methacrylate group in a side chain and a structural unit having a phenyl group in a side chain. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a resist underlayer film excellent in storage stability and capable of forming a resist underlayer film excellent in adhesion to a resist film, improving the reproducibility of a resist pattern and having resistance to an alkali solution used for development and to oxygen ashing in resist removal. SOLUTION: The composition for a resist underlayer film comprises a resin comprising a repeating unit represented by formula (1) and a repeating unit represented by formula (2) and a solvent. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for resist underlayer film, capable of forming a resist underlayer film which has functions as an anti-reflection film, and is superior in a pattern transfer performance and etching selectivity, and is also superior in the via-hole filling capability, in a dual-damascene process. SOLUTION: The composition comprises a polymer, having a structural unit represented either by Formula (1) or Formula (2). In the Formula (1), R 1 represents a bivalent organic group. In the Formula (2), R 2 , R 3 and A respectively represents bivalent organic group that are independent of each other. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition which forms a crosslinked structure upon exposure to radiation, is degraded to low molecular weight by heating at a relatively low temperature after crosslinking, can easily be removed without damaging a substrate, has a high stationary wave preventing effect, does not cause intermixing with a resist film, and is useful to form a hard mask capable of forming a resist pattern excellent in resolution, pattern profile, etc. SOLUTION: The radiation-sensitive composition comprises (A) a copolymer typified by a copolymer having a repeating unit represented by formula (1-1) and a repeating unit represented by formula (2-1), (B) a radiation-sensitive acid generator and (C) a solvent. In the formula (1-1), R 5 denotes hydrogen atom or methyl group. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a process for applying a vinyl-based naphthalenecarboxylic acid (derivative) and a vinyl-based naphthalenemethanol, with which technical idea or technical concept reaching application to an antireflection film having extremely excellent properties is created. SOLUTION: The process for applying a naphthalene derivative comprises using a polymer obtained by polymerizing the naphthalene derivative represented by formula (1) or formula (5) (R 1 , R 2 and R 3 are each independently a hydrogen atom or a 1-10C monofunctional organic group) as a main component for an antireflection film. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To obtain a new polysiloxane that is suitable as a resin component in chemically amplified resist particularly having excellent I-D bias and depth of focus (DOF), a new silane compound useful as a raw material for producing the polysiloxane, and a polysiloxane-containing radiation ray-sensitive resin composition. SOLUTION: The silane compound is represented by formula (I). The polysiloxane has a structural unit represented by formula (1) or has the unit (1) and a structural unit represented by formula (2) (wherein R is an alkyl, R 1 and R 2 are each fluorine atom, or a lower alkyl or a lower fluorinated alkyl, (n) and (m) are each 0 or 1, (k) is 1 or 2, (i) is an integer of 0 to 10). The radiation ray-sensitive resin composition contains the polysiloxane and a radiation ray sensitive acid-generating agent. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film forming composition which has a high antireflection effect, does not cause intermixing, and can form a resist pattern excellent in resolution, pattern shape, etc.; and a polymer useful as a constituting component for the composition. SOLUTION: The polymer comprises first structural units represented by formula (1) and second structural units having cross-linking properties. In formula (1), R 1 and R 2 are each a monovalent atom or a monovalent organic group; R 3 and R 4 are each a hydrogen atom or a monovalent organic group; and m and n are each an integer of 0 or 1-3. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a resist lower layer film excellent in storage stability for obtaining a resist lower layer film which suppresses resist peeling, improves reproducibility of a pattern, and has alkali resistance and resistance to oxygen ashing in resist removal, by disposal under a resist. SOLUTION: The composition for a resist lower layer film comprises (A) a hydrolysis condensation product of an alkoxysilane including a compound of the formula Si(OR 2 ) 4 , wherein four symbols R 2 may be the same or different and are each a monovalent organic group, and (B) a hydrolysis condensation product of an alkoxysilane including at least a compound of the formula R 1 n Si(OR 2 ) 4-n , wherein a plurality of symbols R 1 may be the same or different and are each a monovalent organic group or H; a plurality of symbols R 2 may be the same or different and are each a monovalent organic group; and n is an integer of 1-2. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a resist lower layer film having preferable gas permeability, excellent adhesiveness with a resist film and excellent durability against a developer for the development of the resist film and to provide the resist lower layer film and a method of manufacturing the film. SOLUTION: The composition for a resist lower layer film contains a film forming component consisting of a hydrolyzed product and/or condensed product of a specified silane compound and contains a heat volatile substance which is gasified by heating. When the composition is heated, the film forming component is hardened while the heat volatile substance is gasified to form a porous silica film. The heat volatile substance preferably has 200 to 450 deg.C boiling point or decomposition temperature. The density of the resist lower film to be formed is preferably 0.7 to 1.8 g/cm3. The resist lower film is formed by heating the thin film of the above composition at a temperature equal to or higher than the boiling point or the decomposition temperature of the heat volatile substance.