POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE

    公开(公告)号:CA1274938A

    公开(公告)日:1990-10-02

    申请号:CA528830

    申请日:1987-02-03

    Abstract: POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYMIDE This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting 2,6-bis(3-amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'benzophenonetetracarboxylic dianhydride.

    POLYIMIDE RESIN COMPOSITION
    32.
    发明专利

    公开(公告)号:AU598972B2

    公开(公告)日:1990-07-05

    申请号:AU3385889

    申请日:1989-04-28

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

    PRODUCTION PROCESS FOR POLYIMIDE FIBERS

    公开(公告)号:CA2002147A1

    公开(公告)日:1990-05-07

    申请号:CA2002147

    申请日:1989-11-03

    Abstract: A process for the production of polyimide fibers and polyimide fibers obtained by the process. The process includes thermal or chemical imidation of a polyamic acid which has been obtained by reacting a specific diamine and a particular tetracarboxylic dianhydride in the presence of a dicarboxylic anhydride represented by the following formula: wherein Z represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups and non-fused polycyclic aromatic groups with aromatic rings bonded together directly or via a crosslinking member.

    POLYIMIDE RESIN COMPOSITION
    36.
    发明专利

    公开(公告)号:AU3132389A

    公开(公告)日:1989-09-21

    申请号:AU3132389

    申请日:1989-03-15

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: y

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