公开(公告)号：US06454878B1

公开(公告)日：2002-09-24

申请号：US09703553

申请日：2000-11-01

Applicant: Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

Inventor： Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

IPC: C23C806

CPC classification number: H05K3/022 ,  B32B15/017 ,  B32B15/018 ,  H05K2201/0361 ,  Y10T29/49126

Abstract: A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Abstract translation: 一种用于形成包含使用包层磨的三金属材料组的方法。 当形成多组三金属材料时，通过氧化制备每组的外表面以防止每一组粘附到上述或下方。 氧化的替代物是在三金属材料的外表面上提供可除去的层。 或者可以在中间表面上使用粘合材料; 这种接合材料可以选自锡，镍，钛，铬，银和锌。

公开(公告)号：US06381837B1

公开(公告)日：2002-05-07

申请号：US09148061

申请日：1998-09-04

Applicant: Jay DeAvis Baker ,  Edward McLeskey ,  Delin Li ,  Cuong Van Pham ,  Robert Edward Belke ,  Vivek Amir Jairazbhoy ,  Thomas B Krautheim ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka ,  Jun Ming Hu

Inventor： Jay DeAvis Baker ,  Edward McLeskey ,  Delin Li ,  Cuong Van Pham ,  Robert Edward Belke ,  Vivek Amir Jairazbhoy ,  Thomas B Krautheim ,  Mohan R. Paruchuri ,  Lakhi Nandlal Goenka ,  Jun Ming Hu

IPC: H05K334

CPC classification number: H05K3/4685 ,  H05K1/111 ,  H05K3/062 ,  H05K3/303 ,  H05K3/328 ,  H05K3/3442 ,  H05K3/4007 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Abstract translation: 从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。 凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。 或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

公开(公告)号：US6027575A

公开(公告)日：2000-02-22

申请号：US958235

申请日：1997-10-27

Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K35/26 ,  H05K3/34

CPC classification number: H05K3/3463 ,  B23K35/26

Abstract: The invention is a self-low-temperature curing metallic adhesive with thermal and electrical conductivity. It comprises a paste mixture of a liquid metal having a melting temperature below 30.degree. C. and comprising: (1) 99.2-75 wt. % gallium and (2) aluminum or zinc and (3) optionally tin or indium; and a metallic powder selected from the group consisting of: zirconium, rare earth elements, copper, nickel, silver, antimony, cobalt, chromium, germanium, gold, iron, magnesium, manganese, platinum, palladium, and vanadium, and combinations of any of them.

Abstract translation: 本发明是具有导热性和导电性的自低温固化金属粘合剂。 它包括熔融温度低于30℃的液态金属的糊料混合物，其包含：（1）99.2-75wt。 ％镓和（2）铝或锌和（3）任选的锡或铟; 和选自锆，稀土元素，铜，镍，银，锑，钴，铬，锗，金，铁，镁，锰，铂，钯和钒的金属粉末，以及任何 的他们。

公开(公告)号：US5833921A

公开(公告)日：1998-11-10

申请号：US938574

申请日：1997-09-26

Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K35/26 ,  C22C30/04

CPC classification number: B23K35/264 ,  C22C30/04

Abstract: Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

Abstract translation: 电焊料组合物（重量百分比）具有43-58％的Sn; 38-52％Bi; 和至少一种：5-15％的Sb; 1-4.0％Cu; 2％ 和1-2％Ag，熔融温度为133°-167℃。焊料是无铅的并且具有低熔点，使得它们特别适用于其中待连接的组分涉及热塑性基材的应用。