公开(公告)号：JP2007335732A

公开(公告)日：2007-12-27

申请号：JP2006167483

申请日：2006-06-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  YAMADA TOMOHIDE ,  TAGA SHIGERU

IPC: H05K3/46 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate which can provide a positional relationship between a surface pattern or via and a substrate end accurately.
SOLUTION: A plurality of ceramic green sheets 11 forming a printed pattern 17 are laminated to form a green sheet laminate 21. In this green sheet laminate 21, a mark 19 is formed for recognizing a cut position when a green composite laminate 25 is cut. Further, an anti-contraction green sheet 23 is laminated on the surface of the green sheet laminate 21. In this anti-contraction green sheet 23, an opening 27 is provided which can check the mark 19 when the anti-contraction green sheet 23 is laminated. The anti-contraction green sheet 23 is laminated on a face side where the mark 19 of the green sheet laminate 21 is formed, the mark 19 can be checked from the opening 27, and the green composite laminate 25 is cut in its lamination direction at the mark 19.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 解决的问题：提供一种可以精确地提供表面图案或通孔与基板端之间的位置关系的多层陶瓷基板的制造方法。 ＆lt;解决方案＆gt;层叠形成印刷图案17的多个陶瓷生片11以形成生片层叠体21.在该生片层叠体21中，形成标记19，以便在生坯复合层叠体25 被切了 此外，在生片层叠体21的表面上层压抗收缩生片23.在该抗收缩生片23中，设置有开口部27，该开口部27在抗收缩生片23为 层压。 将抗收缩生片23层叠在形成有生片层叠体21的标记19的面侧，从开口部27检查标记19，将复合层叠体25的层叠方向切断， 标记19.版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007335584A

公开(公告)日：2007-12-27

申请号：JP2006164842

申请日：2006-06-14

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HIGO ICHIEI ,  SHIMOGAMI KOICHIRO ,  KIMURA YUKIHIRO ,  TAGA SHIGERU ,  HIRANO SATOSHI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable composite substrate having no interlayer peeling, no bonding failure between a substrate and a resin layer as an intermediate layer and no crack etc., and no dimensional deviation in a via hole conductor formed on the resin layer as the intermediate layer and in the shape or positional accuracy of a thermal via. SOLUTION: The composite substrate 1 is provided with a multilayer resin layer 4 consisting of a first resin layer 7 including a thermoplastic resin, and a second resin layer 8 provided on at least one surface of the first resin layer 7 and including a thermosetting resin; a first substrate or electric element 2 provided on one main surface of the multilayer resin layer 4; and a second substrate or electric element 3 having a thermal expansion coefficient different from that of the first substrate or electric element 2, and provided on the other main surface of the multilayer resin layer 4. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供不具有层间剥离的高可靠性复合基板，基板和作为中间层的树脂层之间没有接合故障，并且没有裂纹等，并且形成的通孔导体中没有尺寸偏差 作为中间层的树脂层和热通孔的形状或位置精度。 ＆lt; P＆gt;解决方案：复合基板1设置有由包括热塑性树脂的第一树脂层7和设置在第一树脂层7的至少一个表面上的第二树脂层8组成的多层树脂层4， 热固性树脂; 设置在多层树脂层4的一个主面上的第一基板或电气元件2; 以及具有与第一基板或电气元件2不同的热膨胀系数的第二基板或电气元件3，并且设置在多层树脂层4的另一个主表面上。

公开(公告)号：JP2007141978A

公开(公告)日：2007-06-07

申请号：JP2005330944

申请日：2005-11-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  KATO TATSUYA ,  YOSHIDA HATAAKI ,  KATAGIRI HIROYUKI ,  TAGA SHIGERU ,  SATO MANABU

IPC: H05K3/46 ,  H01B1/00 ,  H01B1/22 ,  H05K1/09

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive paste which is suitable for the so-called "concentration baking control process", controls concentration of a green sheet along the thickness thereof, and is less likely to generate projection of a via conductor, after the baking, and to provide a manufacturing method of the wiring board that uses the relevant conductive paste. SOLUTION: The manufacturing method of wiring circuit board (1) comprises the steps of filling the conductive pastes v1, v2 through the area along the thickness direction of the green sheets s1 to s3 formed of glass-ceramics, forming a green sheet laminate GS, by laminating the green sheets s1 to s3, forming a laminate ZS by laminating the concentration control sheets y1, y2 which is not baked at the baking temperature of the green sheets s1 to s3 to both surfaces of the green sheet laminate GS, and baking the composite laminate ZS, at the baking temperature of the green sheets s1 to s3. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供适合于所谓的“浓缩烘烤控制处理”的导电糊的制造方法，控制生片的厚度沿其厚度的浓度，并且不太可能产生投影 的通孔导体，并且提供使用相关的导电浆料的布线板的制造方法。 布线电路板（1）的制造方法包括以下步骤：将导电糊料v1，v2填充到由玻璃陶瓷形成的生片s1〜s3的厚度方向的区域，形成生片 层压体GS，通过层压生片s1〜s3，通过将未生坯片s1〜s3的烘烤温度下未烘烤的浓度控制片y1，y2层压到生片层叠体GS的两面​​，形成层叠体ZS， 并在生片s1〜s3的烘烤温度下烘烤复合层叠体ZS。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004179628A

公开(公告)日：2004-06-24

申请号：JP2003332709

申请日：2003-09-25

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAGA SHIGERU ,  TAKAHASHI HIROYUKI

IPC: H05K1/03 ,  H01L23/15 ,  H01L23/498 ,  H05K3/46

CPC classification number: H05K3/4688 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which little contract in the direction of plane and to provide its manufacturing method which secures to obtain the wiring board. SOLUTION: The manufacturing method of a wiring board includes a process of alternately laminating a green sheet 2', which is composed of ceramic particles α and glass powder 4 and burned at low-temperature, and a green sheet 3', which contains ceramic particles β for a ceramic layer which is not burned at the temperature of burning the green sheet 2', and a process of burning the stack of these layers S' at the temperature of burning the green sheet 2'. The mean particle diameter of the ceramic particle β is larger than that of the ceramic particle α and specific surface area of β is smaller than that of α. A part of glass component of the green sheet 2' is supplied to the green sheet 3' during the burning process. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2009278013A

公开(公告)日：2009-11-26

申请号：JP2008130084

申请日：2008-05-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  KATO TATSUYA ,  TAGA SHIGERU

IPC: H05K3/46 ,  C04B35/64

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a new ceramic substrate excellent in adhesiveness, i.e. bonding strength, with a connection terminal. SOLUTION: A green sheet multi-layer body is formed by laminating a plurality of green sheets in each of which a crystalline filler and glass are included and at least one of which conductor layer is formed, and constraining layers composed of a material having a firing temperature higher than firing temperatures of respective green sheets are pressure-bonded to the upper and lower surfaces of the green sheet multi-layer body and fired to obtain a ceramic fired body. After removing remaining constraining layers, at least one of the upper and lower surfaces of the ceramic fired body is polished so that a ratio Sr/Sv of the occupied area Sr of the filler exposed to at least one of the upper and lower surfaces of the ceramic fired body to the occupied area Sv of the filler in the ceramic fired body becomes 0.95 to 1.05 to obtain a ceramic substrate. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于制造具有优异的粘合性即接合强度的新型陶瓷基板与连接端子的方法。 解决方案：通过层叠多个生片，形成生坯片多层体，其中包括结晶填料和玻璃，并且形成至少一个导体层，以及由材料构成的约束层 将烧成温度高于各自的生片的烧成温度的方法压接在生片多层体的上表面和下表面，并进行烧制以获得陶瓷烧制体。 在去除剩余的约束层之后，对陶瓷烧制体的上表面和下表面中的至少一个进行抛光，使得暴露于上述表面中的至少一个的填料的占据面积Sr的比率Sr / Sv 陶瓷烧制体中的陶瓷烧结体到陶瓷烧制体的填充物的占有面积Sv为0.95〜1.05，得到陶瓷基板。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2007073977A

公开(公告)日：2007-03-22

申请号：JP2006265736

申请日：2006-09-28

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAGA SHIGERU ,  BABA MAKOTO ,  MIURA KAZUNORI

IPC: H05K3/46 ,  C04B35/632

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass ceramic multilayer wiring board calsined at a low temperature using a ceramic green sheet, which is excellent in non-binder performance and the handling at the time of row processing because of the moderate sheet strength and moderate flexibility, and especially excellent in property of forming fine via holes at a narrow pitch with a low fusion point metals such as Ag, Cu or Au as a wiring material. SOLUTION: The ceramic green sheet contains ceramic material powder and a binder which is an acrylic resin having an average molecular weight of ≥2.0×10 5 , an acid value of 2.4-7.2 and 50-90°C glass transition temperature (Tg). The binder is the acrylic resin derived from ethyl methacrylate. Dioctyl phthalate (DOP) or dibutyl phthalate (DBP) is contained as a plasticizer. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造使用陶瓷生坯片在低温下低温处理的玻璃陶瓷多层布线板的方法，该陶瓷生片具有优异的非粘合剂性能以及在行处理时的处理，因为 中等的片材强度和适度的柔韧性，并且特别优异的是以低的熔点金属如Ag，Cu或Au作为布线材料以窄的间距形成精细的通孔。 ＆lt; P＆gt;解决方案：陶瓷生片包含陶瓷材料粉末和粘合剂，其是平均分子量为≥2.0×10 5 的丙烯酸树脂，酸值为2.4-7.2和50- 90℃玻璃化转变温度（Tg）。 粘合剂是衍生自甲基丙烯酸乙酯的丙烯酸树脂。 含有邻苯二甲酸二辛酯（DOP）或邻苯二甲酸二丁酯（DBP）作为增塑剂。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004319706A

公开(公告)日：2004-11-11

申请号：JP2003110662

申请日：2003-04-15

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  TAGA SHIGERU

IPC: H05K1/09 ,  C04B35/64 ,  H01B1/22 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste which can suppress the occurrence of a gap between a via-conductor and a sintered material and cracks in the sintered material in the periphery of the via-conductor, and to provide a multilayer substrate and its manufacturing method. SOLUTION: The conductive paste (which may contain Ag powder and Pd powder and/or Pt powder, and also may contain an insulating component such as glass) is used to fill via-holes formed in a ceramic green sheet for low-temperature burning (which contains alumina powder, a binder, etc.). The conductive paste satisfies a formula 0°C≤Tc-Tv≤150°C , where Tc is a burning shrinkage starting temperature of the ceramic green sheet for low-temperature burning, and Tv is a burning shrinkage starting temperature of the conductive paste, and also satisfies a formula ¾Sc-Sv¾≤10% where Sc is a burning shrinkage rate of the ceramic green sheet for low-temperature burning and Sv is a burning shrinkage rate of the conductive paste. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够抑制通孔导体和烧结材料之间的间隙的发生的导电性糊剂以及通孔导体周围的烧结体中的裂纹，提供多层 基板及其制造方法。 解决方案：使用导电浆料（其可以含有Ag粉末和Pd粉末和/或Pt粉末，并且还可以含有诸如玻璃的绝缘组分）填充形成在陶瓷生片中的通孔， 温度燃烧（含有氧化铝粉末，粘合剂等）。 导电性糊剂满足公式0℃≤Tc-Tv≤150℃，其中Tc是用于低温燃烧的陶瓷生片的燃烧收缩起始温度，Tv是导电膏的燃烧收缩起始温度， 并且还满足公式¾Sc-Sv¾≤10％其中Sc是用于低温燃烧的陶瓷生片的燃烧收缩率，Sv是导电膏的燃烧收缩率。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002298650A

公开(公告)日：2002-10-11

申请号：JP2001100052

申请日：2001-03-30

Applicant: NGK SPARK PLUG CO

Inventor： SATO HIRONORI ,  TAGA SHIGERU

IPC: H05K1/09 ,  C09J1/00 ,  C09J9/02 ,  H01B1/00 ,  H01B1/22 ,  H05K3/12 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste for forming a wiring part in which glass content does not come out floating on the surface of a conductive layer part that is formed by using the conductive paste on a glass ceramic substrate, and a wiring board using the same, and its manufacturing method. SOLUTION: The conductive paste is made by mixing 0.5-30 mass % of a first silver material powder having an average particle size of 0.3-2 μm and 70-99.5 mass % of a second silver material powder having an average particle size of 3-5 μm. It further contains 0.2-1 parts by mass of manganese dioxide, 0.2-1 parts by mass of copper oxide, 0.3-1 parts by mass of silicon dioxide, and 3-5.6 parts by mass of molybdenum and tungsten against the total 100 parts by mass of the first silver material powder and second silver material powder. This wiring board comprises a substrate made mainly of borosilicate lead system glass, a conductive layer part formed using the above conductive paste, and a plated layer part formed on the conductive layer part, and the maximum diameter of the recessed part on the conductive layer part is 6 μm.

公开(公告)号：JP2001143527A

公开(公告)日：2001-05-25

申请号：JP24853699

申请日：1999-09-02

Applicant: NGK SPARK PLUG CO

Inventor： KODERA EIJI ,  NAGURA HITOSHI ,  SATO HIRONORI ,  TAGA SHIGERU

IPC: H05K1/09 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which the surface layer conductor having an excellent adhesive strength, an excellent solder heat-resistance, an excellent burning matching with the board and a reduced conductor loss is formed by simultaneous burning on a board consisted of a glass ceramic being capable of burning at a temperature below 1,000 deg.C. SOLUTION: After forming a surface layer wiring on a ceramic green sheet that is not burned yet using a conductive paste including a conductive component of silver and platinum, and a filler component consisting of molybdenum, tungsten, manganese dioxide, silicon dioxide, and copper oxide, it provides a ceramic wiring board which burns the ceramic green sheet that is not burned yet along with the silver/platinum surface layer wiring at a temperature below 1,000 deg.C.

公开(公告)号：JP2001048639A

公开(公告)日：2001-02-20

申请号：JP22121599

申请日：1999-08-04

Applicant: NGK SPARK PLUG CO

Inventor： TAGA SHIGERU ,  TAKAHASHI HIROYUKI ,  YOSHIDA YOSHITAKA

IPC: H05K1/03 ,  C03C3/108 ,  C03C8/14 ,  C03C14/00 ,  C04B35/16 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a glass-ceramic composition excellently matchable with an Ag or Au conductor material as well as provided with good ceramic characteristics and to produce a circuit board using the glass-ceramic composition. SOLUTION: The glass-ceramic composition has a glass to ceramic weight ratio of (40-60):(60-40) and the glass has an Li2O-free composition consisting of, by weight, 40-60% SiO2, 5-9% Al2O3, 1-10% B2O3, 3-5% Na2O+K2O, 3-15% CaO+MgO+ZnO and 15-40% PbO and has 650-780 deg.C softening point. The circuit board contains a laminated substrate 41 obtained by laminating insulating substrates 42a-42d and a conductor circuit formed on the surface of each of the insulating substrates, and the insulating substrates comprise the glass-ceramic composition. A wiring layer 54 and a via hole conductor 56 are disposed in the laminated substrate 41.