Abstract:
PROBLEM TO BE SOLVED: To provide method of forming a P-type nitride based III-V compound semiconductor layer which can bring an electrode into ohmic contact of low resistance with a P-type nitride based III-V compound semiconductor layer, while restraining generation of surface roughness, cracks, and deterioration of crystallinity of the semiconductor layer. SOLUTION: After a P-type nitride based III-V compound semiconductor layer, e.g. P-type GaN layer 3 is grown by an organic metal chemical vapor deposition method or the like, group II elements such as Mg and Zn are diffused on the surface of the layer 3 by a vapor diffusion method or a solid diffusion method, and a P type diffusion layer 4 is formed. The diffusion of group II elements is performed at, e.g. 500-700 deg.C. Thereby an electrode can be brought into ohmic contact of low resistance with the P-type nitride based III-V compound semiconductor layer, while restraining generation of surface roughness, cracks, and deterioration of crystallinity of the semiconductor layer.
Abstract:
PURPOSE:To effectively perform optical wavelength-multiple recording and reproduction by vapor-depositing MFX:R whose vapor deposition can be effected at room temp. or a temp. close to room temp. on a substrate set at a temp. within a specified range and stably forming an optical recording medium excel lent in S-N ratio. CONSTITUTION:A reflecting layer 2 is formed on a quartz substrate 1 by vapor- depositing Al in about 500nm thickness at 200-250 deg.C temp. of the substrate. A recording layer 3 is then formed on the reflecting layer 2 by vapor-depositing SrFCl0.5Br0.5:Sm in about 1mum thickness at 250-350 deg.C temp. of the substrate to produce the objective optical recording medium 4. Pressure during this vapor deposition is regulated to about 10 -10 Torr. The medium 4 is irradiated with laser light for recording and reproduction from the side opposite to the substrate 1. In this case, a transparent substrate is not necessarily required as the substrate 1. Since the optical recording medium excellent in S-N ratio in its light absorption spectrum is stably formed, optical wavelength-multiple recording and reproduction can be effectively performed.
Abstract:
PURPOSE:To improve recording density and a data transmitting rate and to simplify system configuration by recording plural bits of digital data on a recording medium in parallel. CONSTITUTION:A recording layer and a reflecting layer indicating a PHB phenomenon are provided in a disk type recording medium 7. Selection light having wavelengths of lambda1-lambdan generated in a multi-wavelength laser beam source section 1 and gate light from a laser beam source section 2 are superimposed, and projected to a recording medium 7 through a polarizing beam splitter 4, a lambda/4 plate 5 and lens 6. A reflected light is supplied to a spectroscope unit 8 from the polarizing beam splitter 4, and divided into colors having plural wavelengths, and received by a detector 9. Multiplicity (n) of a wavelength of the selection light and (n) bits of data are made correspondent, and '0', '1' of data and ON/OFF of the selection light are made correspondent. ON/OFF of the selection light is performed by controlling a light source section 1 by a system control circuit 12 receiving data from a data bus 11. Reproduced data is supplied to the system control circuit 12 from the detector 9 through a detector control circuit 13.
Abstract:
PURPOSE:To make recording and reproducing possible with simple constitution and to reduce the size and cost of the device by constituting an optical member of a specific combination. CONSTITUTION:The recording light from a light source section 1 is reflected by a deflection beam splitter 2, is passed through a quarter-wave plate 24 and is cast to an optical wavelength multiplex recording medium 4 and recording is conducted by a two photon recording method at the time of recording. The reflected light is again passed through the quarter-wave plate 24, is rotated 90 deg. in the plane of polarization and is transmitted through the deflection beam splitter 2 to avert the return beam to the light source 1 section. At this time, the return beam is partly reflected by a polarization beam splitter 23 and is supplied to a detecting section 28, by which a servo signal is obtd. The linearly polarized light from the light source section 1 is cast to the recording medium and the return beam is again passed through the quarter-wave plate 24 to rotate the plane of polarization by 90 deg. and is made incident on the photodetecting part 3 through the deflection beam splitter 2, by which recording information is obtd. at the time of reproducing. The device is simply constituted and the size, weight and cost of the device are reduced by combining the light source lens, the beam splitters and the quarter-wave plate.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor element including an n-type clad layer having characteristics required for an n-type clad layer or a p-type clad layer having characteristics required for a p-type clad layer. SOLUTION: An n-type first clad layer 12A has higher n-type carrier density than an n-type second clad layer 12B, and is also made thicker than the n-type second clad layer 12B to thereby secure the carrier conductivity of the whole n-type clad layer 12. The n-type second clad layer 12B has a higher conduction band sub-level lower end than an active layer 14 to thereby secure a sufficient electron barrier for carrier confinement and also suppress type II light emission. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide semiconductor laser equipment that can reduce or eliminate a sum-wavelength noise and speckle noise, does not require any high position precision, and can be miniaturized. SOLUTION: The semiconductor laser equipment has: a current drive type semiconductor laser 2 utilizing emission light generated by current injection to an active layer 23 for laser oscillation as a pumping light source; and an optically pumped semiconductor laser 3 utilizing emission light generated by application of laser beams radiated from the current drive type semiconductor laser 2 to the active layer 34 for laser oscillation, as an optically pumped laser. There is a cylindrical lens 6, which reduces a divergence angle in a fast axis direction of laser beams L1 emitted from the current drive type semiconductor laser 2, on an optical axis AX1 of the current drive type semiconductor laser 2 and between the current drive type semiconductor laser 2 and the optically pumped semiconductor laser 3. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element capable of improving luminous efficiency by suppressing type II emission. SOLUTION: A spacer layer 14 is provided between an n-type cladding layer 12 (n-type graded layer 13) and an active layer 16 (guide layer 15). The spacer layer 14 has a band structure, where the lower end of a conduction band has a level higher than that of the lower end of the conduction band of the n-type cladding layer 12, the n type graded layer 13, the guide layer 15, and the active layer 16, and is composed of a material and by a thickness for suppressing the type II emission of the n-type cladding layer 12 and the active layer 16. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser capable of stabilizing a luminescence at an end in the widthwise direction of a current injection region, and capable of making the uniformity of an NFP improved. SOLUTION: An n-type semiconductor layer 20, an active layer 30 and a p-type semiconductor layer 40 are laminated successively, and a current constriction region 50 is formed to the p-type semiconductor layer 40. A recess 70 is formed at a place displaced on the inside, in the widthwise direction from a border line 52 in the current passage region 51 of the p-type semiconductor layer 40, and a refractive index in the recess 70 is made lower than the p-type semiconductor layer 40. The effective refractive index of a region 30B directly under the recess of the active layer 30 is lowered, and the gain in the end region 30D between the region 30B directly under the recess and a current non-injection region 30C is improved relatively, and the light intensity is increased. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To equalize an NFP in the semiconductor laser of a broad area type. SOLUTION: For constitution of the semiconductor laser wherein a waveguide of light is formed by using an n-type cladding layer 2, an n-type separated confinement heterostructure 3, an activity layer 4, a p-type separated confinement heterostructure 5 and a p-type cladding layer 6, a diffraction portion 10 which carries out diffraction of light which is guided in the waveguide into a direction different from an X direction in a field parallel to the activity layer 4 is formed in the vicinity of one laser end surface 9B out of laser end surfaces 9A, 9B which are arranged at both ends of the X direction which becomes an axial direction of the waveguide. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which has superior luminous properties, is very reliable, and has a long service life. SOLUTION: A method of manufacturing the semiconductor light emitting device includes a step of enabling a nitride III-V compound semiconductor layer forming a light emitting device structure to grow on a nitride III-V compound semiconductor substrate where a plurality of second regions having a second average dislocation density higher than a first average dislocation density possessed by a first crystal region and extending rectilinearly are regularly arranged in parallel with each other in the first crystal region. In the above manufacturing method, the second regions are arranged at an interval of 50 μm or above, one or more rows of the second regions are included, and a device region is demarcated on the nitride III-V compound semiconductor substrate so as not to enable the second regions to be included in the light emitting region of the semiconductor light emitting device. COPYRIGHT: (C)2004,JPO