公开(公告)号：JPS52151857A

公开(公告)日：1977-12-16

申请号：JP6895776

申请日：1976-06-11

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  YAMAMOTO KATSUMI

IPC: H01G4/12 ,  H01G4/005

公开(公告)号：JPH11307662A

公开(公告)日：1999-11-05

申请号：JP11388998

申请日：1998-04-23

Applicant: SONY CORP

Inventor： YAMAMOTO KATSUMI ,  KAWAKAMI RYUICHI ,  SUWA HISASHI

IPC: H01L23/02 ,  H04B1/38 ,  H04B1/3822 ,  H04M1/02 ,  H04Q7/32

Abstract: PROBLEM TO BE SOLVED: To provide an electronic package component which is high in reliability and mounting workability, lessened in mounting floor area, compact, and suitable for an enhancement in frequency and an electronic device equipped therewith. SOLUTION: An electronic package component 10 is composed of a ceramic member 1 which forms a package, a two-stage housing part 2 which is formed inside the ceramic member 1 to house an electronic component, a sealing plate 3 which comes into close contact with the opening of the ceramic member 1 for sealing up the housing part 2, connection terminals 4 and 5 provided penetrating through the ceramic member 1 to make an electrical contact with the outside of the package from the housing part 2, and electronic components 6 and 7 housed in the housing part 2 being electrically connected to the connection terminals 4 and 5.

公开(公告)号：JPH0682953B2

公开(公告)日：1994-10-19

申请号：JP5991479

申请日：1979-05-16

Applicant: SONY CORP

Inventor： OOSAWA MITSUO ,  NODA TERUYOSHI ,  ICHIKAWA IWAO ,  YAMAMOTO KATSUMI

IPC: H05K13/02 ,  H01L21/50 ,  H05K3/30 ,  H05K3/34

公开(公告)号：JPS5688397A

公开(公告)日：1981-07-17

申请号：JP16592979

申请日：1979-12-20

Applicant: SONY CORP

Inventor： MACHIDA HIROMASA ,  TSUCHIYA NORIYUKI ,  YAMAMOTO KATSUMI

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

公开(公告)号：JPS55151394A

公开(公告)日：1980-11-25

申请号：JP5888879

申请日：1979-05-14

Applicant: SONY CORP

Inventor： OOSAWA MITSUO ,  NODA TERUYOSHI ,  ICHIKAWA IWAO ,  YAMAMOTO KATSUMI

IPC: H05K3/34

公开(公告)号：JPS55148484A

公开(公告)日：1980-11-19

申请号：JP5543079

申请日：1979-05-07

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  YAMAMOTO KATSUMI

IPC: H05K3/34 ,  B41F15/46 ,  H05K3/12

公开(公告)号：JPS5562702A

公开(公告)日：1980-05-12

申请号：JP13379478

申请日：1978-11-01

Applicant: SONY CORP

Inventor： YAMAMOTO KATSUMI ,  TSUCHIYA NORIYUKI

IPC: H01C1/034

公开(公告)号：JPS54103565A

公开(公告)日：1979-08-15

申请号：JP1017478

申请日：1978-02-01

Applicant: SONY CORP

Inventor： YAMAMOTO KATSUMI ,  OOSAWA MITSUO

IPC: H05K3/34

公开(公告)号：JPS5436564A

公开(公告)日：1979-03-17

申请号：JP10334377

申请日：1977-08-29

Applicant: SONY CORP

Inventor： OOSAWA MITSUO ,  YAMAMOTO KATSUMI

IPC: H01F41/12 ,  H01F27/32 ,  H02K3/30 ,  H02K15/12

公开(公告)号：JPS5430020A

公开(公告)日：1979-03-06

申请号：JP9580777

申请日：1977-08-10

Applicant: SONY CORP

Inventor： OOSAWA MITSUO ,  YAMAMOTO KATSUMI

IPC: C08F2/00 ,  C08F2/48 ,  H04R31/00

Abstract: PURPOSE:To apply and impregnate a composite of thermoset resin to eliminate the drawback of being thermally set by using a composite of such a resin as will be set when irradiated with a ray of shorter waves.