THERMAL STENCIL PRINTING BASE SHEET

    公开(公告)号:JPH08324149A

    公开(公告)日:1996-12-10

    申请号:JP15681195

    申请日:1995-05-30

    Abstract: PURPOSE: To obtain a thermal stencil printing base sheet having excellent sensitivity and plate wear resistance by sticking a film formed of specific polymer to nonwoven fabric without intermediary of a bonding agent and specifying the mean fiber size of the fiber for forming the nonwoven fabric. CONSTITUTION: The thermal stencil printing base sheet is perforated to be engraved by flashing light emitting, pulse-like emitting of a laser beam or bringing a thermal head into contact, and formed by sticking the film formed of polymer of ethylene-2, 6-naphthalate of main repetition unit to nonwoven fabric without intermediary of a bonding agent. The mean fiber size of the fiber forming the nonwoven fabric is set to a range of 1 to 15μm. The tensile elastic modulus of the base sheet in its lengthwise direction is preferably 0.20kg/cm or more.

    THERMOSENSITIVE STENCIL PRINTING SHEET

    公开(公告)号:JPH0867081A

    公开(公告)日:1996-03-12

    申请号:JP20516794

    申请日:1994-08-30

    Abstract: PURPOSE: To obtain a thermosensitive stencil printing sheet with high perforation sensitivity and outstanding image sharpness. CONSTITUTION: A thermosensitive stencil printing sheet has thermoplastic resin film laminated on one surface of a porous support. The maximum surface roughness(Rt) of the thermoplastic resin film in a laminated state is less than 10μm and the smoothness measured by Open-type smoothness tester is, at least.

    POLYESTER FILM FOR PHOTOGRAPH
    33.
    发明专利

    公开(公告)号:JPH07209806A

    公开(公告)日:1995-08-11

    申请号:JP530094

    申请日:1994-01-21

    Abstract: PURPOSE:To obtain a photographic film excellent in heat resistance and dimensional stability having little foreign matter by specifying the amt. of metal antimony single element. CONSTITUTION:This film consists of a polyester having an ethylene-2,6- naphthalate unit by at least >=80mol% of the repeating structural units and contains 0.01 to 10ppm metal antimony single material to the weight of the polyester. This polyester is substantially composed of ethylene-2,6-naphthalate, and at least >=80% of the repeating structural units is ethylene-2,6-naphthalate, preferably >=90mol%, and more preferably >=95mol%. When the amt. of ethylene-2,6-naphthalate unit is

    RESIN-IMPREGNATED FIBER SHEET
    34.
    发明专利

    公开(公告)号:JPH06286067A

    公开(公告)日:1994-10-11

    申请号:JP7377993

    申请日:1993-03-31

    Abstract: PURPOSE:To balance various characteristics such as heat resistance, thermal dimensional stability, mechanical characteristics, etc., in high dimensions and to improve through-hole, thermal fusion-bonding processability by resin- impregnated fiber sheet having specific values of resin impregnating degree of resin composition, relative crystallization index, size of microcrystal, and a ratio of residual crystallization energy to crystallization energy. CONSTITUTION:A resin-impregnated fiber sheet is obtained by impregnating a resin sheet with resin composition containing poly-p-phenylene sulfide as a main ingredient in which resin impregnation degree of the composition is 80% or more, relative crystallization index is 2.5-13.0, a size of a microcrystal is 50-100 Angstrom and residual crystallization energy DELTAHt is 20-80% of crystallization energy DELTAHq of the composition. Of fiber sheets, a glass fiber sheet is preferable in view of electric insulation, thermal dimensional stability, and particularly cloth of glass fiber is preferable in view of points of heat resistance, dimensional stability and processability. Of which, a range of 0.7-1.4 of average density of warps to wefts of the cloth is preferable in view of thermal dimensional stability.

    PRINTED WIRING BOARD
    35.
    发明专利

    公开(公告)号:JPH0645764A

    公开(公告)日:1994-02-18

    申请号:JP19537092

    申请日:1992-07-22

    Abstract: PURPOSE:To obtain a printed wiring board mounted with electronic parts high in mounting density by a method wherein semiconductor chips are built in holes provided inside the board. CONSTITUTION:A printed wiring board is composed of two outer boards 2 and an inner board 1 sandwiched in between the two outer boards 2 and equipped with circuit wiring layers 3 each provided onto the surface of the wiring board and between the boards. A hole 7 is provided to the inner board 1 at a prescribed position, and a pad and a wiring used for mounting an IC chip 6 are formed on the circuit wiring layer 3 exposed at the hole 7. The IC chip 6 is mounted on the circuit wiring layer 3 through the intermediary of bumps 5. Electronic parts 4 are formed on the surfaces of the printed wiring board at prescribed positions. As mentioned above, an IC is mounted inside the hole 7 provided to the inner board 1, so that elements mounted on a printed wiring board can be enhanced in number per unit area.

    LAMINATED FILM
    37.
    发明专利

    公开(公告)号:JPH05111958A

    公开(公告)日:1993-05-07

    申请号:JP27790291

    申请日:1991-10-24

    Abstract: PURPOSE:To equalize the height of surface projections and improve sliding properties and dielectric strength by laminating a resin mainly comprising two kinds of poly-p-phenylene sulfide having different characteristic values and forming a biaxially oriented laminated film. CONSTITUTION:Poly-p-phenylene sulfide(PPS) resin powder having the characteristic value of melting viscosity of 1000-50000 poise at 300 deg.C at a shear rate of 200sec is melt-extruded, thus preparing a pellet A. On the other hand, PPS resin povyder having melting viscosity of half or one twentyth of the melting viscosity of the pellet A and a temperature-drop crystallization temperature of 150-250 deg.C is melt-extruded, thus preparing a pellet B. The pellets A, B are laminated under a molten state in a flow path between an extruder and a mouthpiece, thus preparing a PPS laminated film. The PPS laminated film is biaxially oriented by magnification, where the pellet A is orientated sufficiently, simultaneously or successively in length and breadth at a fixed temperature, and thermally treated in constant length at a fixed temperature for a specified time, thus acquiring a biaxially oriented PPS laminated film.

    LAMINATED PRODUCT AND CIRCUIT BOARD USING SAID LAMINATED PRODUCT

    公开(公告)号:JPH04224941A

    公开(公告)日:1992-08-14

    申请号:JP41500490

    申请日:1990-12-27

    Abstract: PURPOSE:To provide a heat-resistant base material having well-balanced properties such as heat resistance, size stability against heat and humidity, flame retardation and stability against high frequency, and besides, self-fusion which allows thermal fusion even at comparatively low temperature, and especially best suited for use on a circuit board. CONSTITUTION:A laminated product consists of a non-stretched sheet (B-layer) containing poly-p-phenylenesulfide as a main component without using an adhesive as an intermediately, fixed to at least, one surface of a fibrous sheet (A layer). In addition, the laminated product has the residual crystallization energy DELTAHt of the B layer which is equipment to 20% or higher of the crystallization energy DELTA Hq of resin constituting the B layer. A circuit board has an electric circuit provided at least, on one surface of the laminated product.

    BIAXIALLY ORIENTED POLYPHENYLENE SULFIDE FILM

    公开(公告)号:JPH04146935A

    公开(公告)日:1992-05-20

    申请号:JP27154990

    申请日:1990-10-08

    Abstract: PURPOSE:To obtain the title film improved in impact resistance and tear resistance without detriment to its heat resistance, electrical properties and chemical resistance by mixing a polyphenylene sulfide with a polyetherimide in a specified ratio. CONSTITUTION:An alkali sulfide is polymerized with a p-dihalobenzene at high temperature under high pressure in a polar solvent to obtain a polyphenylene sulfide (A). 100 pts.wt. component A is melt-kneaded with 0.5-30 pts.wt., desirably 0.5-20 pts.wt. polyetherimide (B) and molded into a film, which is biaxially oriented at 85-105 deg.C at a draw ratio of 2.5-4.5 in each of the machine and transverse directions. The resulting film is heat-treated for 1-300sec at 200 deg.C to the melting point of the film under constant-length conditions and optionally relaxed within a range of 0-15% in each of the machine and transverse directions.

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